JPS56101750A - Method of mounting and packaging silicon unit on ceramic substrate and package unit therefor - Google Patents
Method of mounting and packaging silicon unit on ceramic substrate and package unit thereforInfo
- Publication number
- JPS56101750A JPS56101750A JP82081A JP82081A JPS56101750A JP S56101750 A JPS56101750 A JP S56101750A JP 82081 A JP82081 A JP 82081A JP 82081 A JP82081 A JP 82081A JP S56101750 A JPS56101750 A JP S56101750A
- Authority
- JP
- Japan
- Prior art keywords
- unit
- mounting
- ceramic substrate
- therefor
- packaging silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/147—Semiconductor insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA343,318A CA1115852A (en) | 1980-01-09 | 1980-01-09 | Mounting and packaging of silicon devices on ceramic substrates, and assemblies containing silicon devices |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56101750A true JPS56101750A (en) | 1981-08-14 |
Family
ID=4116006
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP82081A Pending JPS56101750A (en) | 1980-01-09 | 1981-01-08 | Method of mounting and packaging silicon unit on ceramic substrate and package unit therefor |
JP1990020545U Expired JPH0410700Y2 (ja) | 1980-01-09 | 1990-03-02 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990020545U Expired JPH0410700Y2 (ja) | 1980-01-09 | 1990-03-02 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4406054A (ja) |
EP (1) | EP0032565B1 (ja) |
JP (2) | JPS56101750A (ja) |
CA (1) | CA1115852A (ja) |
DE (1) | DE3070907D1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4566170A (en) * | 1983-05-10 | 1986-01-28 | Pitney Bowes Inc. | Method of producing a light emiting diode array |
US4760440A (en) * | 1983-10-31 | 1988-07-26 | General Electric Company | Package for solid state image sensors |
DE3516954A1 (de) * | 1984-05-14 | 1985-11-14 | Gigabit Logic, Inc., Newbury Park, Calif. | Montierte integrierte schaltung |
US5162251A (en) * | 1991-03-18 | 1992-11-10 | Hughes Danbury Optical Systems, Inc. | Method for making thinned charge-coupled devices |
JP4663304B2 (ja) * | 2004-11-30 | 2011-04-06 | 株式会社吉野工業所 | 液状物の注出容器 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3577037A (en) * | 1968-07-05 | 1971-05-04 | Ibm | Diffused electrical connector apparatus and method of making same |
US3984620A (en) * | 1975-06-04 | 1976-10-05 | Raytheon Company | Integrated circuit chip test and assembly package |
-
1980
- 1980-01-09 CA CA343,318A patent/CA1115852A/en not_active Expired
- 1980-12-18 DE DE8080108016T patent/DE3070907D1/de not_active Expired
- 1980-12-18 EP EP80108016A patent/EP0032565B1/en not_active Expired
-
1981
- 1981-01-08 JP JP82081A patent/JPS56101750A/ja active Pending
- 1981-11-27 US US06/325,373 patent/US4406054A/en not_active Expired - Lifetime
-
1990
- 1990-03-02 JP JP1990020545U patent/JPH0410700Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0032565A1 (en) | 1981-07-29 |
JPH0357946U (ja) | 1991-06-05 |
CA1115852A (en) | 1982-01-05 |
EP0032565B1 (en) | 1985-07-24 |
DE3070907D1 (en) | 1985-08-29 |
JPH0410700Y2 (ja) | 1992-03-17 |
US4406054A (en) | 1983-09-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3380003D1 (en) | Dense mounting of semiconductor chip packages | |
JPS56150835A (en) | Method of packaging tape-operated semiconductor device | |
EP0331467A3 (en) | Method of forming semiconductor thin film | |
EP0097833A3 (en) | Substrate for integrated circuit packages | |
JPS5752139A (en) | Method and device for etching one side of semiconductor disc | |
JPS5782050A (en) | Method of mounting printing substrate | |
JPS55105382A (en) | Method of roughening surface of silicon substrate | |
GB2137809B (en) | A ceramic package for semiconductor devices | |
GB2084796B (en) | Mounting and cooling arrangements for semiconductor devices | |
JPS57173960A (en) | Ceramic substrate device and method of producing same | |
EP0203589A3 (en) | Method and apparatus for airtightly packaging semiconductor package | |
DE3571724D1 (en) | Semiconductor device package for high frequencies | |
DE3472613D1 (en) | Method of mounting a carrier for a microelectronic silicon chip | |
DE3279378D1 (en) | Package for semiconductor device and method for its production | |
GB2148597B (en) | Packages and mountings for semi-conductor devices and methods of manufacture thereof | |
JPS56101750A (en) | Method of mounting and packaging silicon unit on ceramic substrate and package unit therefor | |
DE3660351D1 (en) | Lead material for ceramic package ic | |
GB2174543B (en) | Apparatus and method for improved packaging of semiconductor devices | |
DE3279791D1 (en) | Package for semicondutor device and method of manufacturing it | |
KR0127135B1 (en) | Ceramic semiconductor package and method for manufacture thereof | |
KR960008895B1 (en) | Manufacturing method of substrate for descrete device and the apparatus and the substrate | |
JPS5717200A (en) | Method of bonding electronic part taping mounting paper | |
JPS5771196A (en) | Method of mounting semiconductor device | |
DE3569171D1 (en) | Hermetically sealable package for electronic component | |
DE3573686D1 (en) | Semiconductor power device package for surface mounting |