JPH0397888A - Tinned copper alloy product - Google Patents
Tinned copper alloy productInfo
- Publication number
- JPH0397888A JPH0397888A JP1235401A JP23540189A JPH0397888A JP H0397888 A JPH0397888 A JP H0397888A JP 1235401 A JP1235401 A JP 1235401A JP 23540189 A JP23540189 A JP 23540189A JP H0397888 A JPH0397888 A JP H0397888A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- layer
- zinc
- copper alloy
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 23
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 17
- 229910052718 tin Inorganic materials 0.000 claims description 30
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 26
- 238000007747 plating Methods 0.000 claims description 25
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 16
- 239000011701 zinc Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 9
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 abstract 1
- 238000004299 exfoliation Methods 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 description 9
- 239000011800 void material Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910018082 Cu3Sn Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は銅合金、特に電子部品用銅合金の錫めっき品
に関するものであり、特に経時変化や熱に対して、めっ
き接合の信頼性を高めた銅合金用錫めっき品に関するも
のである．
〔従来の技術〕
従来、電子部品材料として使用されている銅合金は、素
条段階で錫やはんだめっきを施したものが多く使われて
おり，そのめっき組成としては、＠錫、９０％錫−１０
％鉛、６０％錫−４０％鉛等が代表的なものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to tin-plated copper alloys, particularly copper alloys for electronic components, and improves the reliability of plating joints, especially against changes over time and heat. This relates to tin-plated products for copper alloys. [Prior art] Copper alloys conventionally used as electronic component materials are often plated with tin or solder at the raw stage, and the plating composition is @tin, 90% tin. -10
% lead, 60% tin-40% lead, etc. are typical.
最近の電子部品材料の高度な成長に伴い、部品の信頼性
向上は大きな課題であり、例えばコネクタや集積回路（
ＩＣ）の基板実装や、接触子等において、使用環境ある
いは電子部品白体の発熱に伴い、めっき部が劣化して信
頼性の低下を招くことがあり、使用条件によっては、め
っき部が剥離してしまうケースも出ている。With the recent rapid growth of electronic component materials, improving the reliability of components is a major issue, such as connectors and integrated circuits (
When mounting IC (IC) boards, contacts, etc., the plating may deteriorate due to the usage environment or the heat generation of the white body of the electronic component, leading to a decrease in reliability. Depending on the usage conditions, the plating may peel off. There are also cases where this happens.
第１図は従来の錫めっきを行った直後の銅合金の模型断
面図、第２図はその加熱後の模型断面図であり、図にお
いて、（１）は銅合金、（２）は銅合金（１）上にめっ
きされた錫めっき層、（３）は拡ｆｔ２層（η相）、（
４）は拡散層（ε相） ． （５）はカーケンダルボイ
ドである。Figure 1 is a cross-sectional view of a copper alloy model immediately after conventional tin plating, and Figure 2 is a cross-sectional view of the model after heating. In the figure, (1) is a copper alloy, and (2) is a copper alloy. (1) Tin plating layer plated on top, (3) expanded ft2 layer (η phase), (
4) is a diffusion layer (ε phase). (5) is Kirkendall void.
銅合金（１）に錫めっきを施した直後は、第１図に示す
ような錫めっき層（２）が得られるが，その後加熱や経
時変化によって、第２図に示すような拡散状態が生じ、
剥離現象の原因となっている力−ケンダルボイド（５）
が発生する。Immediately after tin plating the copper alloy (1), a tin plating layer (2) as shown in Figure 1 is obtained, but after that, due to heating and changes over time, a diffusion state as shown in Figure 2 occurs. ,
The force that causes the peeling phenomenon - Kendall void (5)
occurs.
このカーケンダルボイド（５）は、銅合金（１）と錫め
っきＭ（２）の相互拡散が進むときに原子の移動に伴う
拡散速度の差により、ボイドとなって空洞ができる現象
である。拡散層は一般的には第２図に示すようにη相（
３） （Ｃｕ６ＳｎＳ）、ε相（４）（Ｃｕ３Ｓｎ）が
主であるが，めっきされる銅合金（１）の組成或分によ
って状況が異なる場合があり，従ってめっき後の信頼性
についても差が出てくる．〔発明が解決しようとする課
題〕
従来の銅合金用錫めっき品においては、上記のように拡
散を生じるため、拡散時におけるカーケンダルボイドの
発生を防止することが部品の信頼性向上のために重要な
課題である．
この発明は、上記のような問題点を解決するためになさ
れたもので、従来の錫めっき組成に亜鉛を添加してカー
ケンダルボイドの発生を抑え，これにより熱による錫め
っきの密着性低下や剥離現象を改善することができる銅
合金用錫めっき品を得ることを目的とするものである。The Kirkendall void (5) is a phenomenon in which a void is formed due to a difference in diffusion rate due to the movement of atoms when the copper alloy (1) and the tin plating M (2) mutually diffuse. Generally, the diffusion layer is composed of η phase (
3) (Cu6SnS) and ε phase (4) (Cu3Sn) are the main ones, but the situation may differ depending on the composition of the copper alloy (1) to be plated, and therefore there is also a difference in reliability after plating. come out. [Problem to be solved by the invention] In conventional tin-plated products for copper alloys, diffusion occurs as described above, so it is important to prevent the occurrence of Kirkendall voids during diffusion in order to improve the reliability of parts. This is an important issue. This invention was made to solve the above-mentioned problems by adding zinc to the conventional tin plating composition to suppress the occurrence of Kirkendall voids, thereby preventing the adhesion of tin plating from decreasing due to heat. The object of the present invention is to obtain a tin-plated product for copper alloys that can improve the peeling phenomenon.
この発明は次の銅合金用錫めっき品である。 This invention relates to the following tin-plated product for copper alloy.
（１）めっき組成として重量基準で、亜鉛０．０３〜５
％を含み，残部が錫および不可避の元素から成り，亜鉛
と錫の合計量が９８％以上、他の元素の合計量が２％以
下である銅合金用錫めっき品。(1) Zinc 0.03 to 5 on a weight basis as a plating composition
%, with the balance being tin and unavoidable elements, the total amount of zinc and tin being 98% or more, and the total amount of other elements being 2% or less.
・・・・・・錫めっき品（１）
（２）めっき組成として重量基準で、亜鉛０．０３〜５
％を含み、残部が錫および他の元素から或り、亜鉛と錫
の合計量が９８％以上、他の元素の合計量が２％以下、
かツＦｅ． Ｎｉ． Ｃｏ． ＳｉおよびＰの合計量が
０．４％以下である銅合金用錫めっき品。・・・・・・Tin plated product (1) (2) Plating composition: Zinc 0.03 to 5 on a weight basis
%, the balance is tin and other elements, the total amount of zinc and tin is 98% or more, the total amount of other elements is 2% or less,
Cutlet Fe. Ni. Co. A tin-plated product for copper alloys in which the total amount of Si and P is 0.4% or less.
・・・・・・錫めっき品（ｎ）
本発明において，他の元素としてはＦｅ， Ｎｉ， Ｃ
ｏ、Ｓｉ． Ｐ ．その他任意の元素があげられる．〔
作 用〕
この発明の錫めっき品（１）． （Ｉｆ）における亜
鉛添加の目的は、拡散時において亜鉛元素の移動がカー
ケンダルボイドの発生を抑えることにあり、その効果は
最小量０．０３％で認められ，添加量が多くなるにつれ
て顕著となる．一方、亜鉛の添加量増加は部品実装時の
はんだ付け性を低下させる傾向にあり、このため上限を
５％に定めた。また他の元素の合計量が２％以下とした
のは同様にはんだ付け性が低下するためである．
錫めっき品（ＩＩ）におけるＦｅ． Ｎｉ． Ｃｏ，
Ｓｉ． Ｐの合計量の上限値の制限は、これらの元素は
添加により逆にカーケンダルボイドの発生が増加する傾
向にあるため、その悪影響の認められない量として決め
られており、各元素の最大値はそれぞれ０．２％とする
のが好ましい。...Tin plated product (n) In the present invention, other elements include Fe, Ni, and C.
o, Si. P. Other arbitrary elements can be mentioned. [
Function] Tin-plated product of this invention (1). The purpose of adding zinc in (If) is to suppress the generation of Kirkendall voids due to the movement of the zinc element during diffusion, and this effect is observed at a minimum amount of 0.03%, and becomes more pronounced as the amount added increases. Become. On the other hand, an increase in the amount of zinc added tends to reduce solderability during component mounting, and therefore the upper limit was set at 5%. The reason why the total amount of other elements was set to 2% or less is because solderability similarly decreases. Fe in tin-plated product (II). Ni. Co,
Si. The upper limit of the total amount of P is determined as an amount that does not have any adverse effects, since the addition of these elements tends to increase the occurrence of Kirkendall voids, and the maximum value of each element is is preferably 0.2% each.
以下、この発明の一実施例について説明する。 An embodiment of the present invention will be described below.
市販のばね用りん青銅（ＪＩＳ Ｃ５２１０）に，表上
の組成の錫めっき組成を直接電気めっきにより２μｍの
めっき厚となるようにめっきした．その後１５０℃で加
熱試験を行い、曲げ試験により剥離の発生するまでの時
間を測定した結果、ならびに電気錫めっき後、２４０℃
で溶融はんだめっきを行い、錫めっき層が濡れるまでの
時間を測定した．錫めっき層が濡れるまでの時間は、溶
融した６０％Ｓｎ − ４０％Ｐｂの中に、錫を電気め
っきしたりん青銅を浸漬したときに生ずる表面張力によ
る浮力と張力がつり合うまでの時間とした。結果を表１
に示す。Commercially available phosphor bronze for springs (JIS C5210) was directly plated with the tin plating composition shown in the table to a plating thickness of 2 μm. After that, a heating test was conducted at 150℃, and the time until peeling was measured by a bending test.
We performed molten solder plating and measured the time it took for the tin plating layer to get wet. The time it took for the tin plating layer to get wet was determined as the time it took for the buoyancy and tension due to the surface tension generated when phosphor bronze electroplated with tin was immersed in molten 60% Sn - 40% Pb to balance out. Table 1 shows the results.
Shown below.
表１の結果より、亜鉛を添加した本発明の總めっき品は
耐熱剥離に対し大きな改善効果が認められる。From the results in Table 1, it can be seen that the single-plated products of the present invention to which zinc is added have a significant improvement effect on heat-resistant peeling.
試料恥１〜５の結果より，亜鉛の添加量が多くなるほど
耐熱剥離は向上するが、逆にはんだ付け性が低下してい
ることがわかり、添加量を０．０３〜５％とした根拠と
なっている．
また試料Ｎｌ１８−１１の結果より、Ｆｅ． Ｎｉ．
Ｃｏ． Ｓｉ、Ｐ等は，亜鉛添加による耐熱剥離の向上
を打ち消す結果が得られており、この結果より上限値が
それぞれ０．２％とされている。From the results of samples 1 to 5, it was found that as the amount of zinc added increases, the heat resistance peeling improves, but conversely, the solderability decreases, which is the basis for setting the amount of addition to 0.03 to 5%. It has become. Also, from the results of sample Nl18-11, Fe. Ni.
Co. It has been found that Si, P, and the like cancel out the improvement in heat peeling resistance caused by the addition of zinc, and based on these results, the upper limit values for each are set at 0.2%.
なお、−Ｌ記実施例では、錫と銅の拡散現象より、銅合
金を対象とした錫めっき品となっているが，銅合金以外
に適用しても特に支障はないと考えられる．
また、ウイスカ一発生防止とはんだ付け性の向Ｌや密着
性の向上を目的とし、電気めっき後に再加熱リフロ−処
理して活用することも当然可能である．
〔発明の効果〕
この発明によれば、錫めっき組成に亜鉛を添加したので
、カーケンダルボイドの発生を抑えることができ、これ
により熱による錫めっきの密着性低下や剥離現象を防止
することができる。In addition, in Example -L, the tin-plated product is intended for copper alloys due to the diffusion phenomenon of tin and copper, but it is thought that there will be no particular problem if it is applied to other than copper alloys. Furthermore, it is naturally possible to perform reheating and reflow treatment after electroplating for the purpose of preventing whisker generation and improving solderability and adhesion. [Effects of the Invention] According to the present invention, since zinc is added to the tin plating composition, it is possible to suppress the occurrence of Kirkendall voids, thereby preventing a decrease in the adhesion of the tin plating and a peeling phenomenon caused by heat. can.
第】−図は従来の錫めっきを行った直後の銅合金の模型
断面図、第２図はその加熱後の模型断面図である。
各図中、同一符号は同一または相当部分を示し、（１）
は銅合金、（２）は錫めっき層、（３）は拡敗屓（η相
）、（４）は拡散層（Ｅ相） ． （５）はカーケンダ
ルボイドである。Figure 2 is a cross-sectional view of a copper alloy model immediately after conventional tin plating, and Figure 2 is a cross-sectional view of the model after heating. In each figure, the same reference numerals indicate the same or corresponding parts, (1)
is a copper alloy, (2) is a tin plating layer, (3) is a diffused layer (η phase), and (4) is a diffusion layer (E phase). (5) is Kirkendall void.
Claims (2)
％を含み、残部が錫および不可避の元素から成り、亜鉛
と錫の合計量が９８％以上、他の元素の合計量が２％以
下であることを特徴とする銅合金用錫めっき品。(1) Zinc 0.03 to 5 on a weight basis as a plating composition
%, the balance is tin and unavoidable elements, the total amount of zinc and tin is 98% or more, and the total amount of other elements is 2% or less.
％を含み、残部が錫および他の元素から成り、亜鉛と錫
の合計量が９８％以上、他の元素の合計量が２％以下、
かつＦｅ、Ｎｉ、Ｃｏ、ＳｉおよびＰの合計量が０．４
％以下であることを特徴とする銅合金用錫めっき品。(2) Zinc 0.03 to 5 on a weight basis as a plating composition
%, the balance consists of tin and other elements, the total amount of zinc and tin is 98% or more, the total amount of other elements is 2% or less,
and the total amount of Fe, Ni, Co, Si and P is 0.4
% or less of tin-plated products for copper alloys.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1235401A JPH0397888A (en) | 1989-09-11 | 1989-09-11 | Tinned copper alloy product |
| KR1019900014305A KR930005262B1 (en) | 1989-09-11 | 1990-09-11 | Soldered product and tinned product for copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1235401A JPH0397888A (en) | 1989-09-11 | 1989-09-11 | Tinned copper alloy product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397888A true JPH0397888A (en) | 1991-04-23 |
Family
ID=16985547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1235401A Pending JPH0397888A (en) | 1989-09-11 | 1989-09-11 | Tinned copper alloy product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397888A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10180480A (en) * | 1996-11-08 | 1998-07-07 | Tanaka Denshi Kogyo Kk | Lead-free soldering material and electronic parts using the material |
| KR100584766B1 (en) * | 2001-12-27 | 2006-05-30 | 주식회사 포스코 | Sn-Zn Alloy Plating Fluids Having Superior Abrasive Resistance and Surface Roughness |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6260839A (en) * | 1985-09-09 | 1987-03-17 | Hitachi Cable Ltd | Alloy for surface treatment |
-
1989
- 1989-09-11 JP JP1235401A patent/JPH0397888A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6260839A (en) * | 1985-09-09 | 1987-03-17 | Hitachi Cable Ltd | Alloy for surface treatment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10180480A (en) * | 1996-11-08 | 1998-07-07 | Tanaka Denshi Kogyo Kk | Lead-free soldering material and electronic parts using the material |
| KR100584766B1 (en) * | 2001-12-27 | 2006-05-30 | 주식회사 포스코 | Sn-Zn Alloy Plating Fluids Having Superior Abrasive Resistance and Surface Roughness |
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