JP2798512B2 - Tin-plated copper alloy material and method for producing the same - Google Patents
Tin-plated copper alloy material and method for producing the sameInfo
- Publication number
- JP2798512B2 JP2798512B2 JP3013031A JP1303191A JP2798512B2 JP 2798512 B2 JP2798512 B2 JP 2798512B2 JP 3013031 A JP3013031 A JP 3013031A JP 1303191 A JP1303191 A JP 1303191A JP 2798512 B2 JP2798512 B2 JP 2798512B2
- Authority
- JP
- Japan
- Prior art keywords
- tin
- copper alloy
- layer
- nickel
- alloy material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Description
【０００１】[0001]
【産業上の利用分野】本発明は、錫めっき銅合金材およ
びその製造方法に係り、より詳しくは、例えば、端子・
コネクター等の電子材料部品に好適に用いることができ
る半田付け性に優れた錫めっき銅合金材およびその製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tin-plated copper alloy material and a method for producing the same, and more particularly, to a tin-plated copper alloy material and
The present invention relates to a tin-plated copper alloy material excellent in solderability that can be suitably used for electronic material components such as connectors and a method for producing the same.
【０００２】[0002]
【従来の技術】錫めっき銅合金材は、端子・コネクター
をはじめ様々な電子部品に用いられている。錫めっきを
施す目的は、耐食性、良好な半田付け性を付与ことにあ
る。また、接点材では、接触抵抗値を低く安定に保つ目
的を持っている。2. Description of the Related Art Tin-plated copper alloy materials are used for various electronic parts including terminals and connectors. The purpose of tin plating is to impart corrosion resistance and good solderability. Further, the contact material has the purpose of keeping the contact resistance value low and stable.
【０００３】従来、これらの錫めっき銅合金材の多く
は、銅合金上に直接錫めっきを施すか、あるいは銅合金
材と錫めっき層との中間に銅下地めっきを施すかして製
造されていた。Hitherto, most of these tin-plated copper alloy materials have been manufactured by directly tin-plating a copper alloy or by plating a copper base between a copper alloy material and a tin-plated layer. Was.
【０００４】これらの錫めっき銅合金材を用いた電子部
品は、実装の際の半田付け時や、実装後の使用環境にお
いて熱影響を受ける。この熱影響は、錫めっき層表面の
酸化という問題、銅合金中や銅下地めっき層のＣｕの錫
めっき層中への拡散の促進という問題、その他様々な問
題の原因となる。例えば、Ｃｕが錫めっき中を拡散し
て、錫めっきと反応し、脆い金属間化合物が厚く形成さ
れてしまい、曲げ加工時のめっき層の剥離の原因とな
る。また、錫めっき層全体が合金化し、純錫層がなくな
ると、半田付けは不可能になる。従来の錫めっき銅合金
材ではこれらの問題が発生する場合が多くあった。これ
を避けるための一つの対策として、錫めっき層を厚く施
すことにより拡散の時間をかせぐ方法があるが、錫は、
高価な金属であり、錫めっき材のコストを高くするとい
う問題がある。また、錫めっき層が厚いと、スタンピン
グの際に端面に錫のバリ（スタンピングのカス）が多く
発生し、金型の寿命を短くする問題があった。そこで、
従来通りの薄い錫めっき層で耐熱剥離性、耐熱半田付け
性にすぐれた錫めっき銅合金材が望まれている。[0004] Electronic components using these tin-plated copper alloy materials are thermally affected by soldering during mounting and in a use environment after mounting. This thermal effect causes problems such as oxidation of the surface of the tin plating layer, promotion of diffusion of Cu in the copper alloy and the copper base plating layer into the tin plating layer, and various other problems. For example, Cu diffuses in the tin plating and reacts with the tin plating to form a thick brittle intermetallic compound, which causes peeling of the plating layer during bending. Further, when the entire tin plating layer is alloyed and the pure tin layer is eliminated, soldering becomes impossible. These problems often occur in conventional tin-plated copper alloy materials. As one measure to avoid this, there is a method to save diffusion time by applying a thick tin plating layer.
Since it is an expensive metal, there is a problem that the cost of the tin plating material is increased. In addition, when the tin plating layer is thick, many burrs (stamps of stamping) of tin occur on the end face during stamping, and there is a problem that the life of the mold is shortened. Therefore,
There is a demand for a tin-plated copper alloy material having a conventional thin tin-plated layer and excellent heat-resistant peelability and heat-resistant solderability.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、めっき層の
耐剥離性、耐熱半田付け性に優れた安価な錫めっき銅合
金材およびその製造方法を提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide an inexpensive tin-plated copper alloy material having excellent peel resistance and heat-resistant solderability of a plating layer and a method for producing the same.
【０００６】[0006]
【課題を解決するための手段】本発明の第１の要旨は、
銅合金材と錫めっき層との間に、ニッケル層のない、
０．１〜０．４μｍ厚のニッケルと錫との金属間化合物
層を持つことを特徴とした錫めっき銅合金材に存在す
る。A first gist of the present invention is as follows.
Between copper alloy material and tin plating layerWithout nickel layer,
An intermetallic compound of nickel and tin having a thickness of 0.1 to 0.4 μm
Exists in tin-plated copper alloy material characterized by having a layer
You.
【０００７】本発明の第２の要旨は、銅合金材の表面に
０．０８〜０．３μｍのニッケルめっき層を施し、さら
にその上に錫めっきを施した後、錫めっき層をリフロー
させることによって、銅合金材と錫めっき層との間に、
ニッケル層のない、０．１〜０．４μｍ厚のニッケルと
錫との金属間化合物層を設けることを特徴とする錫めっ
き銅合金材の製造方法に存在する。[0007] A second gist of the present invention is to apply a nickel plating layer of 0.08 to 0.3 µm on the surface of a copper alloy material, further apply tin plating thereon, and then reflow the tin plating layer. Between the copper alloy material and the tin plating layer ,
There is provided a method for producing a tin-plated copper alloy material, comprising providing a 0.1-0.4 μm thick intermetallic compound layer of nickel and tin without a nickel layer .
【０００８】本発明の第３の要旨は、銅合金材の表面に
０．０８〜０．３μｍのニッケルめっき層を施した後、
ニッケルめっき層を施した銅合金材を、溶融した錫中に
浸漬することにより錫めっき層を形成すると同時に銅合
金材と錫めっき層の中間に、ニッケル層のない、０．１
〜０．４μｍのニッケルと錫の金属間化合物層を設ける
ことを特徴とする錫めっき銅合金材の製造方法に存在す
る。[0008] The third gist of the present invention is that a nickel plating layer having a thickness of 0.08 to 0.3 µm is formed on the surface of a copper alloy material.
A copper alloy material having a nickel plating layer is immersed in molten tin to form a tin plating layer, and at the same time , there is no nickel layer between the copper alloy material and the tin plating layer.
There is provided a method for producing a tin-plated copper alloy material, characterized by providing a nickel-tin intermetallic compound layer of about 0.4 μm.
【０００９】[0009]
【作用】発明の詳細な内容を以下に説明する。The detailed contents of the invention will be described below.
【００１０】銅合金上あるいは銅下地めっき上に錫めっ
きを施すと、錫と銅が反応拡散して、Ｃｕ3 Ｓｎからな
るε層、Ｃｕ6 Ｓｎ5からなるη層ができる。錫めっき
層中における銅の拡散は非常に速く、１００〜２００℃
において数時間から数十時間で１〜２μｍ拡散する。銅
合金と錫めっき層との間に所定の厚さを有するニッケル
と錫との金属間化合物層を設ける理由は、このニッケル
と錫との金属間化合物層が、錫めっき層中への銅の拡散
を防ぎ、ひいては錫めっき層が金属間化合物を形成する
のを防ぐようにすることにある。これにより錫めっき層
は純錫の部分を安定して保存することができる。ここ
で、ニッケルと錫の金属間化合物とは、Ｎｉ3 Ｓｎ、Ｎ
ｉ3 Ｓｎ2 およびＮｉ3 Ｓｎ4 のことである。When tin plating is applied to a copper alloy or a copper base plating, tin and copper react and diffuse to form an ε layer made of Cu 3 Sn and an η layer made of Cu 6 Sn 5 . Diffusion of copper in the tin plating layer is very fast, 100-200 ° C.
At a time of several hours to several tens hours. The reason why the intermetallic compound layer of nickel and tin having a predetermined thickness is provided between the copper alloy and the tin plating layer is that the intermetallic compound layer of nickel and tin is formed of copper in the tin plating layer. The purpose is to prevent diffusion and thus the tin plating layer from forming intermetallic compounds. Thereby, the tin plating layer can stably store the pure tin portion. Here, the intermetallic compound of nickel and tin is Ni 3 Sn, N
i 3 Sn 2 and Ni 3 Sn 4 .
【００１１】従来は、ニッケルと錫との金属間化合物層
のような金属間化合物ができると曲げ加工によってめっ
き層が金属間化合物層と銅合金材との界面からめっき層
が剥離すると言われていた。Conventionally, it is said that when an intermetallic compound such as an intermetallic compound layer of nickel and tin is formed, the plating layer peels off from the interface between the intermetallic compound layer and the copper alloy material by bending. Was.
【００１２】しかし、経時的な拡散によってできる金属
間化合物層の場合とは異なり、溶融してできた金属間化
合物層の場合は、拡散による欠陥も界面になく、密着性
に優れていることを知見した。また、金属間化合物層が
めっき層全体に対して薄いときは、めっきの剥離は全く
発生じないことも知見した。However, unlike the intermetallic compound layer formed by diffusion over time, the intermetallic compound layer formed by melting has no defects due to diffusion at the interface and has excellent adhesion. I learned. It was also found that when the intermetallic compound layer was thin with respect to the entire plating layer, no peeling of the plating occurred.
【００１３】このように、我々は、悪影響を及ぼすと従
来考えられてきたニッケルと錫の金属間化合物層が、そ
れを錫の融点以上の温度で生成し、かつ、限られた所定
の範囲に厚さを制御すれば、従来考えられてきたのとは
反対に、ＣｕとＳｎの相互拡散を抑制し、錫めっき層の
合金化を防ぐことを明らかにした。これによって、熱的
に経時的に安定した半田付け性を有する錫めっき銅合金
材を開発する方法を発明したのである。As described above, we have found that an intermetallic compound layer of nickel and tin, which has conventionally been considered to have an adverse effect, forms it at a temperature higher than the melting point of tin and within a limited predetermined range. It has been clarified that by controlling the thickness, contrary to what has conventionally been considered, the interdiffusion of Cu and Sn is suppressed and the alloying of the tin plating layer is prevented. Thus, a method for developing a tin-plated copper alloy material having a soldering property that is thermally stable over time was invented.
【００１４】ここで、ニッケルと錫の金属間化合物層の
厚さを０．１μｍ以上としたのは、銅の錫中への拡散を
防ぐには、０．１μｍ以上のニッケルと錫の金属間化合
物が必要だからである。また、０．４μｍ以下としたの
は、それ以上厚くても銅の拡散防止の効果に大差は無い
ためである。また、０．４μｍ以上にニッケルと錫の金
属間化合物層が成長すると、曲げ加工時に曲げの応力が
大きくなってニッケルと錫の金属間化合物層が銅合金の
界面から剥離したり、錫めっき層の大部分が合金層にな
って半田が付かなくなったりするからである。また、合
金層が必要以上に厚いと錫めっき材をスタンピングする
際に、ダイスの寿命を短くする原因にもなる。よって、
ニッケルと錫の金属間化合物層の厚さは、０．１〜０．
４μｍとした。Here, the reason why the thickness of the intermetallic compound layer of nickel and tin is set to 0.1 μm or more is to prevent the diffusion of copper into tin. This is because a compound is required. The reason why the thickness is set to 0.4 μm or less is that there is no significant difference in the effect of preventing the diffusion of copper even if the thickness is larger than 0.4 μm. Also, when the intermetallic compound layer of nickel and tin grows to 0.4 μm or more, the bending stress increases during bending, and the intermetallic compound layer of nickel and tin peels off from the interface of the copper alloy, or the tin plating layer This is because most of the alloy becomes an alloy layer and no solder is attached. In addition, if the alloy layer is thicker than necessary, the stamping of the tin-plated material may shorten the life of the die. Therefore,
The thickness of the intermetallic compound layer of nickel and tin is 0.1 to 0.5.
4 μm.
【００１５】次に、製造方法について説明する。錫めっ
きを施す方法は、電気めっき後にリフロー処理する方
法、溶融錫の中に浸漬する方法のいずれでもよい。Next, the manufacturing method will be described. The method of applying tin plating may be any of a method of performing reflow treatment after electroplating and a method of immersing in tin.
【００１６】前者では、電気めっき皮膜をリフロー（再
溶解）させる時にニッケルめっきと錫めっきが溶融し
て、ニッケルと錫の金属間化合物層をつくる。また、溶
融めっきの場合も同様にニッケルと錫の金属間化合物層
をつくる。これらはいずれも錫めっきを施す工程とニッ
ケルめっきを金属間化合物層に変化させることを行うも
のである。In the former, when the electroplating film is reflowed (remelted), the nickel plating and the tin plating are melted to form an intermetallic compound layer of nickel and tin. Similarly, in the case of hot-dip plating, an intermetallic compound layer of nickel and tin is formed. In each of these processes, a tin plating process and a nickel plating are changed to an intermetallic compound layer.
【００１７】両方法において、ニッケルめっきの厚さを
０．０８μｍ以上としたのは、それよりも薄いとニッケ
ルと錫の金属間化合物層の厚さが不十分となり、Ｃｕの
Ｓｎめっき層中への拡散防止効果が不十分になるからで
ある。また、０．３μｍ以下としたのは、それ以上厚い
と不必要な厚さのニッケルと錫の金属間化合物層ができ
てしまい、加工性を悪化させるためである。よって、ニ
ッケルめっきの厚さは０．０８〜Ｏ．３μｍとした。In both methods, the reason why the thickness of the nickel plating is 0.08 μm or more is that if the thickness is less than 0.08 μm, the thickness of the intermetallic compound layer of nickel and tin becomes insufficient and the Cu plating into the Sn plating layer This is because the effect of preventing the diffusion of the compound becomes insufficient. The reason why the thickness is 0.3 μm or less is that if the thickness is more than 0.3 μm, an unnecessary thickness of an intermetallic compound layer of nickel and tin is formed, and the workability is deteriorated. Therefore, the thickness of the nickel plating is 0.08-O. It was 3 μm.
【００１８】なお、リフローを行う雰囲気温度は、２７
０〜 ７００℃が好ましく、２８０〜３５０℃がより好
ましい。また、溶融めっきの温度は、２４０〜３００℃
が好ましく、２５０〜２７０℃がより好ましい。処理時
間は、銅合金材の板厚さ、リフロー処理温度、溶融錫浴
温度によって適切な値を設定する。The ambient temperature at which the reflow is performed is 27
0-700 degreeC is preferable, and 280-350 degreeC is more preferable. The temperature of the hot-dip plating is 240 to 300 ° C.
Is preferable, and 250 to 270 ° C is more preferable. The treatment time is set to an appropriate value depending on the thickness of the copper alloy material, the reflow treatment temperature, and the molten tin bath temperature.
【００１９】ニッケルめっきは、リフロー処理後および
溶融錫めっき後に完全に無くなっていることが重要であ
る。なぜならば、ニッケルめっき層が残っていると本材
が電子部品となって使用される間に、ニッケルと錫の相
互拡散が進行して、ニッケルと錫からなる金属間化合物
層がさらに成長し、本発明で規定した以上の厚さになる
恐れがあるからである。拡散によってできる金属間化合
物はめっき層の界面に欠陥を伴ったりして剥離の原因に
なりかねない。また、必要以上の厚さの金属間化合物層
は加工性を低下させる。It is important that the nickel plating is completely eliminated after the reflow treatment and after the hot-dip tin plating. Because, when the nickel plating layer remains, while the material is used as an electronic component, the interdiffusion of nickel and tin progresses, and the intermetallic compound layer composed of nickel and tin further grows, This is because there is a possibility that the thickness may exceed the thickness specified in the present invention. Intermetallic compounds formed by diffusion may cause defects at the interface of the plating layer or cause peeling. Further, an intermetallic compound layer having an unnecessarily thick thickness lowers workability.
【００２０】また、錫めっきの厚さは、コストやスタン
ピング時の層の発生を考慮すると薄い方が望ましい。し
かし、一方、耐熱剥離性、半田付け性の観点からは厚い
方が望ましい。めっきを行ってから部品に加工され、機
器に実装される際の半田付けを行うまでの期間をおよそ
１年とすると、その期間、半田付け性を保持するために
は、少なくとも０．８μｍは必要であると考える。詳細
はめっき材の用途に応じて適宜決定すればよい。It is desirable that the thickness of the tin plating is thin in consideration of cost and generation of a layer at the time of stamping. However, on the other hand, from the viewpoints of heat-peelability and solderability, a thicker one is desirable. Assuming that the period from plating to processing into parts and soldering when mounted on equipment is about one year, at least 0.8 μm is required to maintain solderability during that period. I believe that. The details may be appropriately determined according to the use of the plating material.
【００２１】本発明において用いる銅合金としては、り
ん青銅、５ｗｔ％Ｚｎ−Ｃｕ、２ｗｔ％Ｓｎ−０．１ｗ
ｔ％Ｆｅ−０．０３ｗｔ％Ｐ−Ｃｕ、２．２５ｗｔ％Ｚ
ｎ−２ｗｔ％Ｓｎ−０．１ｗｔ％Ｆｅ−０．０３ｗｔ％
Ｐ−Ｃｕ等の使用が望ましい。As the copper alloy used in the present invention, phosphor bronze, 5 wt% Zn-Cu, 2 wt% Sn-0.1 w
t% Fe-0.03wt% P-Cu, 2.25wt% Z
n-2 wt% Sn-0.1 wt% Fe-0.03 wt%
It is desirable to use P-Cu or the like.
【００２２】[0022]
【実施例】表１に示す錫めっき材を作成した。なお、リ
ン青銅材は６ｗｔ％Ｓｎ−０．０４５ｗｔ％Ｐ−Ｃｕか
らなるリン青銅二種材を用いた。また、表１に示すＫＬ
Ｆ５銅合金は、２ｗｔ％Ｓｎ−０．１ｗｔ％Ｆｅ−０．
０３ｗｔ％Ｐ−Ｃｕからなる銅合金である。いずれの場
合も銅合金材の板厚さは、０．２５ｍｍである。なお、
表１におけるニッケルの厚さは錫めっきを施す前の厚さ
である。 EXAMPLE A tin-plated material shown in Table 1 was prepared. The phosphor bronze material used was a phosphor bronze binary material composed of 6 wt% Sn-0.045 wt% P-Cu. In addition, KL shown in Table 1
F5 copper alloy is 2 wt% Sn- 0 . 1 wt% Fe-0.
It is a copper alloy made of 03 wt% P-Cu. In any case, the plate thickness of the copper alloy material is 0.25 mm. In addition,
The thickness of nickel in Table 1 is the thickness before tin plating
It is.
【００２３】なお、リフローめっきに用いためっき液の
組成を表２に示した。リフローめっきは３２０℃の雰囲
気中に１５秒間保持して行った。一方溶融めっきは２６
０℃の溶融錫中に銅合金材を５秒間浸漬することにより
行った。Table 2 shows the composition of the plating solution used for the reflow plating. The reflow plating was performed in an atmosphere of 320 ° C. for 15 seconds. On the other hand, hot-dip
This was performed by immersing the copper alloy material in molten tin at 0 ° C. for 5 seconds.
【００２４】これらの錫めっき材を１５０℃で１００、
５００、１０００時間熱処理した後、これらの材料の９
０°繰り返し曲げを２回行い、曲げ部表面を実態顕微鏡
で観察し、めっき層の剥離の有無を確認した。These tin-plated materials were treated at 150 ° C. for 100,
After heat treatment for 500 or 1000 hours, 9
Bending was repeated twice at 0 °, and the surface of the bent portion was observed with an actual microscope to confirm the presence or absence of peeling of the plating layer.
【００２５】また、半田付け性は、最近のコネクターの
表面実装化に伴い増加してきたリフロー半田付け方法を
考慮した２２０℃で１０分までの範囲の熱処理後に評価
した。半田付け性の評価は、半田付け後に半田の付着面
積が８５％以上を”良好”とし、それ以下を”不良”と
した。 結果は表３に示した。なお、表３において、Ａ
ｓは熱処理をしない状態を示す。The solderability was evaluated after a heat treatment at 220 ° C. for up to 10 minutes in consideration of a reflow soldering method which has been increasing with recent surface mounting of connectors. The solderability was evaluated as "good" when the solder adhesion area was 85% or more after soldering, and "poor" when less than 85%. The results are shown in Table 3. In Table 3, A
s indicates a state without heat treatment.
【００２６】ニッケルと錫の金属間化合物層の厚さが
０．１μｍ以上の時、熱剥離は起こらなかった。これ
は、Ｃｕ3Ｓｎ からなるε層、Ｃｕ6 Ｓｎ5からなるη層
がほとんど成長しないためであると考えられる。また、
従来材は、１５０℃×５００時間でめっきの剥離が発生
した。ニッケルと錫との金属間化合物層の厚さが０．５
μｍ以上では曲げ試験によって剥離が発生した。よっ
て、ニッケルと錫の金属間化合物層の厚さは０．１〜
０．４μｍが適当である。また、ニッケルめっきを施さ
ないものは、２２０℃×５分の熱処理で半田付け不良が
発生するのに対し、本発明による錫めっき材は、１０分
でも良好な半田付け性が得られた。半田付け性への熱影
響の点でも、本発明材は優れていた。The thickness of the intermetallic compound layer of nickel and tin is
When the thickness was 0.1 μm or more, thermal peeling did not occur. this
Is CuThreeSn Layer made of Cu6 SnFiveΗ layer consisting of
Is thought to be because it hardly grows. Also,
Conventional material peels off plating at 150 ° C x 500 hours
did. The thickness of the intermetallic compound layer of nickel and tin is 0.5
Above μm, peeling occurred in the bending test. Yo
The thickness of the intermetallic compound layer of nickel and tin is 0.1 to
0.4 μm is appropriate. Also nickel plated
If there is no soldering, poor soldering will occur after heat treatment at 220 ° C for 5 minutes.
On the other hand, the tin-plated material according to the present invention,
However, good solderability was obtained. Hot shadow on solderability
The material of the present invention was also excellent in terms of sound.
【００２７】[0027]
【発明の効果】本発明によって、耐熱剥離性、耐熱半田
付け性に優れた錫めっき銅合金材およびその製造方法を
提供することが出来る。これらの錫めっき銅合金材は、
端子・コネクター等の電気・電子部品の耐熱剥離性、耐
熱半田付け性を向上させることになり、機器の信頼性を
たかめることに貢献できる。表１ 表２ 表３ According to the present invention, it is possible to provide a tin-plated copper alloy material excellent in heat-resistant peeling resistance and heat-resistant solderability, and a method for producing the same. These tinned copper alloy materials are
This improves the heat-peelability and heat-solderability of electrical and electronic components such as terminals and connectors, and can contribute to enhancing the reliability of equipment. Table 1 Table 2 Table 3
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) C23C 24/00 - 30/00 C25D 5/00 - 7/12 C23C 2/00 - 2/40──────────────────────────────────────────────────続 き Continuation of front page (58) Field surveyed (Int. Cl. 6 , DB name) C23C 24/00-30/00 C25D 5/00-7/12 C23C 2/00-2/40
Claims (3)
ル層のない、０．１〜０．４μｍ厚のニッケルと錫との
金属間化合物層を持つことを特徴とした錫めっき銅合金
材。1. A nickel layer between a copper alloy material and a tin plating layer.
A tin-plated copper alloy material having a 0.1 to 0.4 μm thick intermetallic compound layer of nickel and tin without a metal layer.
のニッケルめっき層を施し、さらにその上に錫めっきを
施した後、錫めっき層をリフローさせることによって、
銅合金材と錫めっき層との間に、ニッケル層のない、
０．１〜０．４μｍ厚のニッケルと錫との金属間化合物
層を設けることを特徴とする錫めっき銅合金材の製造方
法。2. The thickness of the copper alloy material is 0.08 to 0.3 μm.
Nickel plating layer, and then tin plating
After applying, by reflowing the tin plating layer,
Between copper alloy material and tin plating layerWithout nickel layer,
An intermetallic compound of nickel and tin having a thickness of 0.1 to 0.4 μm
Method for producing tin-plated copper alloy material characterized by providing a layer
Law.
のニッケルめっき層を施した後、ニッケルめっき層を施
した銅合金材を、溶融した錫中に浸漬することにより錫
めっき層を形成すると同時に銅合金材と錫めっき層の中
間に、ニッケル層のない、０．１〜０．４μｍのニッケ
ルと錫の金属間化合物のみからなる層を設けることを特
徴とする錫めっき銅合金材の製造方法。3. A copper alloy material having a thickness of 0.08 to 0.3 μm
After the nickel plating layer is applied, the copper alloy material provided with the nickel plating layer is immersed in molten tin to form a tin plating layer, and at the same time , the nickel layer is provided between the copper alloy material and the tin plating layer. A method for producing a tin-plated copper alloy material, comprising: providing a layer of only 0.1 to 0.4 μm of an intermetallic compound of nickel and tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3013031A JP2798512B2 (en) | 1991-01-10 | 1991-01-10 | Tin-plated copper alloy material and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3013031A JP2798512B2 (en) | 1991-01-10 | 1991-01-10 | Tin-plated copper alloy material and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04235292A JPH04235292A (en) | 1992-08-24 |
| JP2798512B2 true JP2798512B2 (en) | 1998-09-17 |
Family
ID=11821762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3013031A Expired - Lifetime JP2798512B2 (en) | 1991-01-10 | 1991-01-10 | Tin-plated copper alloy material and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2798512B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3562719B2 (en) * | 2001-11-13 | 2004-09-08 | 矢崎総業株式会社 | Terminal |
| US20060068218A1 (en) | 2004-09-28 | 2006-03-30 | Hooghan Kultaransingh N | Whisker-free lead frames |
| DE112006000095T5 (en) * | 2005-01-18 | 2008-04-17 | AUTONETWORKS Technologies, LTD., Yokkaichi | Press fit connection, method for the manufacture thereof, and connection arrangement between a press-fit connection and a circuit board |
| JP5137998B2 (en) * | 2010-05-07 | 2013-02-06 | 株式会社神戸製鋼所 | Method for producing plated copper alloy material for fuse |
| JP5516501B2 (en) * | 2011-05-13 | 2014-06-11 | 株式会社村田製作所 | Electronic components |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4838247A (en) * | 1971-09-20 | 1973-06-05 | ||
| JPS5021272A (en) * | 1973-06-28 | 1975-03-06 | ||
| JPS61198507A (en) * | 1985-02-28 | 1986-09-02 | 日本鉱業株式会社 | Composite material for electronic component and manufacture |
-
1991
- 1991-01-10 JP JP3013031A patent/JP2798512B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04235292A (en) | 1992-08-24 |
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