JPH04235292A - Tinned copper alloy material and its manufacture - Google Patents
Tinned copper alloy material and its manufactureInfo
- Publication number
- JPH04235292A JPH04235292A JP1303191A JP1303191A JPH04235292A JP H04235292 A JPH04235292 A JP H04235292A JP 1303191 A JP1303191 A JP 1303191A JP 1303191 A JP1303191 A JP 1303191A JP H04235292 A JPH04235292 A JP H04235292A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- copper alloy
- layer
- alloy material
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 46
- 239000000956 alloy Substances 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 80
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 75
- 238000007747 plating Methods 0.000 claims abstract description 71
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 40
- 229910000765 intermetallic Inorganic materials 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims description 13
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 description 65
- 239000010949 copper Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 14
- 238000009792 diffusion process Methods 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 238000005452 bending Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910018082 Cu3Sn Inorganic materials 0.000 description 1
- 229910018471 Cu6Sn5 Inorganic materials 0.000 description 1
- 229910005113 Ni3 Sn2 Inorganic materials 0.000 description 1
- 229910005111 Ni3 Sn4 Inorganic materials 0.000 description 1
- 229910005102 Ni3Sn Inorganic materials 0.000 description 1
- 229910020923 Sn-O Inorganic materials 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、錫めっき銅合金材およ
びその製造方法に係り、より詳しくは、例えば、端子・
コネクター等の電子材料部品に好適に用いることができ
る半田付け性に優れた錫めっき銅合金材およびその製造
方法に関する。[Industrial Field of Application] The present invention relates to a tin-plated copper alloy material and a method for manufacturing the same, and more specifically relates to, for example, terminals and
The present invention relates to a tin-plated copper alloy material with excellent solderability that can be suitably used for electronic material parts such as connectors, and a method for manufacturing the same.
【０００２】0002
【従来の技術】錫めっき銅合金材は、端子・コネクター
をはじめ様々な電子部品に用いられている。錫めっきを
施す目的は、耐食性、良好な半田付け性を付与ことにあ
る。また、接点材では、接触抵抗値を低く安定に保つ目
的を持っている。BACKGROUND OF THE INVENTION Tin-plated copper alloy materials are used in various electronic parts including terminals and connectors. The purpose of tin plating is to provide corrosion resistance and good solderability. Furthermore, the purpose of contact materials is to keep the contact resistance low and stable.
【０００３】従来、これらの錫めっき銅合金材の多くは
、銅合金上に直接錫めっきを施すか、あるいは銅合金材
と錫めっき層との中間に銅下地めっきを施すかして製造
されていた。Conventionally, most of these tin-plated copper alloy materials have been manufactured by directly applying tin plating on the copper alloy, or by applying a copper base plating between the copper alloy material and the tin plating layer. Ta.
【０００４】これらの錫めっき銅合金材を用いた電子部
品は、実装の際の半田付け時や、実装後の使用環境にお
いて熱影響を受ける。この熱影響は、錫めっき層表面の
酸化という問題、銅合金中や銅下地めっき層のＣｕの錫
めっき層中への拡散の促進という問題、その他様々な問
題の原因となる。例えば、Ｃｕが錫めっき中を拡散して
、錫めっきと反応し、脆い金属間化合物が厚く形成され
てしまい、曲げ加工時のめっき層の剥離の原因となる。
また、錫めっき層全体が合金化し、純錫層がなくなると
、半田付けは不可能になる。従来の錫めっき銅合金材で
はこれらの問題が発生する場合が多くあった。これを避
けるための一つの対策として、錫めっき層を厚く施すこ
とにより拡散の時間をかせぐ方法があるが、錫は、高価
な金属であり、錫めっき材のコストを高くするという問
題がある。また、錫めっき層が厚いと、スタンピングの
際に端面に錫のバリ（スタンピングのカス）が多く発生
し、金型の寿命を短くする問題があった。そこで、従来
通りの薄い錫めっき層で耐熱剥離性、耐熱半田付け性に
すぐれた錫めっき銅合金材が望まれている。Electronic components using these tin-plated copper alloy materials are affected by heat during soldering during mounting and in the environment in which they are used after mounting. This thermal influence causes various problems such as oxidation of the surface of the tin plating layer, promotion of diffusion of Cu in the copper alloy or copper base plating layer into the tin plating layer. For example, Cu diffuses through the tin plating and reacts with the tin plating, forming a thick brittle intermetallic compound, which causes peeling of the plating layer during bending. Furthermore, when the entire tin plating layer becomes alloyed and the pure tin layer disappears, soldering becomes impossible. These problems often occur with conventional tin-plated copper alloy materials. One way to avoid this is to extend the time for diffusion by applying a thick tin plating layer, but tin is an expensive metal and has the problem of increasing the cost of the tin plating material. Further, if the tin plating layer is thick, a lot of tin burrs (stamping residue) will be generated on the end face during stamping, which will shorten the life of the mold. Therefore, there is a need for a tin-plated copper alloy material that has a conventional thin tin plating layer and has excellent heat-resistant peelability and heat-resistant solderability.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、めっき層の
耐剥離性、耐熱半田付け性に優れた安価な錫めっき銅合
金材およびその製造方法を提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide an inexpensive tin-plated copper alloy material with excellent peeling resistance of the plating layer and heat-resistant solderability, and a method for manufacturing the same.
【０００６】[0006]
【課題を解決するための手段】本発明の第１の要旨は、
銅合金材と錫めっき層との間に、０．１〜０．４μｍ厚
のニッケルと錫との金属間化合物層を持つことを特徴と
した錫めっき銅合金材に存在する。[Means for Solving the Problems] The first gist of the present invention is as follows:
It exists in a tin-plated copper alloy material characterized by having an intermetallic compound layer of nickel and tin with a thickness of 0.1 to 0.4 μm between the copper alloy material and the tin plating layer.
【０００７】本発明の第２の要旨は、銅合金材の表面に
０．０８〜０．３μｍのニッケルめっき層を施し、さら
にその上に錫めっきを施した後、錫めっき層をリフロー
させることによって、銅合金材と錫めっき層との間に０
．１〜０．４μｍ厚のニッケルと錫との金属間化合物層
を設けることを特徴とする錫めっき銅合金材の製造方法
に存在する。The second gist of the present invention is to apply a nickel plating layer of 0.08 to 0.3 μm on the surface of a copper alloy material, further apply tin plating thereon, and then reflow the tin plating layer. 0 between the copper alloy material and the tin plating layer.
．． A method for producing a tin-plated copper alloy material is provided, which is characterized by providing an intermetallic compound layer of nickel and tin with a thickness of 1 to 0.4 μm.
【０００８】本発明の第３の要旨は、銅合金材の表面に
０．０８〜０．３μｍのニッケルめっき層を施した後、
ニッケルめっき層を施した銅合金材を、溶融した錫中に
浸漬することにより錫めっき層を形成すると同時に銅合
金材と錫めっき層の中間に０．１〜０．４μｍのニッケ
ルと錫の金属間化合物層を設けることを特徴とする錫め
っき銅合金材の製造方法に存在する。The third aspect of the present invention is that after applying a nickel plating layer of 0.08 to 0.3 μm on the surface of a copper alloy material,
A copper alloy material with a nickel plating layer is immersed in molten tin to form a tin plating layer, and at the same time a nickel and tin metal of 0.1 to 0.4 μm is added between the copper alloy material and the tin plating layer. A method for manufacturing a tin-plated copper alloy material is provided, which is characterized by providing an intermediate compound layer.
【０００９】[0009]
【作用】発明の詳細な内容を以下に説明する。[Operation] The detailed content of the invention will be explained below.
【００１０】銅合金上あるいは銅下地めっき上に錫めっ
きを施すと、錫と銅が反応拡散して、Ｃｕ３ Ｓｎから
なるε層、Ｃｕ６ Ｓｎ５からなるη層ができる。錫め
っき層中における銅の拡散は非常に速く、１００〜２０
０℃において数時間から数十時間で１〜２μｍ拡散する
。銅合金と錫めっき層との間に所定の厚さを有するニッ
ケルと錫との金属間化合物層を設ける理由は、このニッ
ケルと錫との金属間化合物層が、錫めっき層中への銅の
拡散を防ぎ、ひいては錫めっき層が金属間化合物を形成
するのを防ぐようにすることにある。これにより錫めっ
き層は純錫の部分を安定して保存することができる。こ
こで、ニッケルと錫の金属間化合物とは、Ｎｉ３ Ｓｎ
、Ｎｉ３ Ｓｎ２ およびＮｉ３ Ｓｎ４ のことであ
る。[0010] When tin plating is applied on a copper alloy or on a copper base plating, tin and copper react and diffuse to form an ε layer consisting of Cu3 Sn and an η layer consisting of Cu6 Sn5. The diffusion of copper in the tin plating layer is very fast, with a speed of 100 to 20
It diffuses 1 to 2 μm in several hours to several tens of hours at 0°C. The reason why an intermetallic compound layer of nickel and tin with a predetermined thickness is provided between the copper alloy and the tin plating layer is that this intermetallic compound layer of nickel and tin prevents copper from entering the tin plating layer. The purpose is to prevent diffusion and, in turn, to prevent the tin plating layer from forming intermetallic compounds. This allows the pure tin portion of the tin plating layer to be stably preserved. Here, the intermetallic compound of nickel and tin is Ni3Sn
, Ni3 Sn2 and Ni3 Sn4.
【００１１】従来は、ニッケルと錫との金属間化合物層
のような金属間化合物ができると曲げ加工によってめっ
き層が金属間化合物層と銅合金材との界面からめっき層
が剥離すると言われていた。Conventionally, it has been said that when an intermetallic compound such as an intermetallic compound layer of nickel and tin is formed, the plating layer peels off from the interface between the intermetallic compound layer and the copper alloy material due to bending. Ta.
【００１２】しかし、経時的な拡散によってできる金属
間化合物層の場合とは異なり、溶融してできた金属間化
合物層の場合は、拡散による欠陥も界面になく、密着性
に優れていることを知見した。また、金属間化合物層が
めっき層全体に対して薄いときは、めっきの剥離は全く
発生じないことも知見した。However, unlike the case of an intermetallic compound layer formed by diffusion over time, the intermetallic compound layer formed by melting has no defects at the interface due to diffusion and has excellent adhesion. I found out. It was also found that when the intermetallic compound layer is thinner than the entire plating layer, no peeling of the plating occurs.
【００１３】このように、我々は、悪影響を及ぼすと従
来考えられてきたニッケルと錫の金属間化合物層が、そ
れを錫の融点以上の温度で生成し、かつ、限られた所定
の範囲に厚さを制御すれば、従来考えられてきたのとは
反対に、ＣｕとＳｎの相互拡散を抑制し、錫めっき層の
合金化を防ぐことを明らかにした。これによって、熱的
に経時的に安定した半田付け性を有する錫めっき銅合金
材を開発する方法を発明したのである。[0013] In this way, we have discovered that the intermetallic compound layer of nickel and tin, which was conventionally thought to have an adverse effect, can be formed at temperatures above the melting point of tin and within a limited predetermined range. It has been revealed that controlling the thickness can suppress the interdiffusion of Cu and Sn and prevent alloying of the tin plating layer, contrary to what was previously thought. This led to the invention of a method for developing a tin-plated copper alloy material that has thermally stable solderability over time.
【００１４】ここで、ニッケルと錫の金属間化合物層の
厚さを０．１μｍ以上としたのは、銅の錫中への拡散を
防ぐには、０．１μｍ以上のニッケルと錫の金属間化合
物が必要だからである。また、０．４μｍ以下としたの
は、それ以上厚くても銅の拡散防止の効果に大差は無い
ためである。また、０．４μｍ以上にニッケルと錫の金
属間化合物層が成長すると、曲げ加工時に曲げの応力が
大きくなってニッケルと錫の金属間化合物層が銅合金の
界面から剥離したり、錫めっき層の大部分が合金層にな
って半田が付かなくなったりするからである。また、合
金層が必要以上に厚いと錫めっき材をスタンピングする
際に、ダイスの寿命を短くする原因にもなる。よって、
ニッケルと錫の金属間化合物層の厚さは、０．１〜０．
４μｍとした。[0014] Here, the thickness of the intermetallic compound layer of nickel and tin is set to be 0.1 μm or more because, in order to prevent the diffusion of copper into tin, the thickness of the intermetallic compound layer of nickel and tin is 0.1 μm or more. This is because a compound is required. Further, the reason why the thickness is set to 0.4 μm or less is that even if the thickness is larger than that, there is no significant difference in the effect of preventing copper diffusion. Additionally, if the intermetallic compound layer of nickel and tin grows to a thickness of 0.4 μm or more, the bending stress increases during bending, causing the intermetallic compound layer of nickel and tin to peel off from the interface of the copper alloy, or the tin plating layer This is because most of the solder becomes an alloy layer and cannot be soldered. Further, if the alloy layer is thicker than necessary, it may shorten the life of the die when stamping tin-plated materials. Therefore,
The thickness of the nickel and tin intermetallic compound layer is 0.1 to 0.
It was set to 4 μm.
【００１５】次に、製造方法について説明する。錫めっ
きを施す方法は、電気めっき後にリフロー処理する方法
、溶融錫の中に浸漬する方法のいずれでもよい。Next, the manufacturing method will be explained. The method of applying tin plating may be either a method of reflow treatment after electroplating or a method of immersion in molten tin.
【００１６】前者では、電気めっき皮膜をリフロー（再
溶解）させる時にニッケルめっきと錫めっきが溶融して
、ニッケルと錫の金属間化合物層をつくる。また、溶融
めっきの場合も同様にニッケルと錫の金属間化合物層を
つくる。これらはいずれも錫めっきを施す工程とニッケ
ルめっきを金属間化合物層に変化させることを行うもの
である。In the former case, when the electroplated film is reflowed (remelted), the nickel plating and the tin plating melt to form an intermetallic compound layer of nickel and tin. In addition, in the case of hot-dip plating, an intermetallic compound layer of nickel and tin is similarly created. All of these involve the process of applying tin plating and converting the nickel plating into an intermetallic compound layer.
【００１７】両方法において、ニッケルめっきの厚さを
０．０８μｍ以上としたのは、それよりも薄いとニッケ
ルと錫の金属間化合物層の厚さが不十分となり、Ｃｕの
Ｓｎめっき層中への拡散防止効果が不十分になるからで
ある。また、０．３μｍ以下としたのは、それ以上厚い
と不必要な厚さのニッケルと錫の金属間化合物層ができ
てしまい、加工性を悪化させるためである。よって、ニ
ッケルめっきの厚さは０．０８〜Ｏ．３μｍとした。[0017] In both methods, the thickness of the nickel plating was set to 0.08 μm or more because if it was thinner, the thickness of the intermetallic compound layer of nickel and tin would be insufficient, and Cu would not penetrate into the Sn plating layer. This is because the anti-diffusion effect becomes insufficient. Further, the reason why the thickness is set to 0.3 μm or less is that if it is thicker than that, an unnecessarily thick intermetallic compound layer of nickel and tin will be formed, which will deteriorate the workability. Therefore, the thickness of nickel plating is 0.08~0. It was set to 3 μm.
【００１８】なお、リフローを行う雰囲気温度は、２７
０〜 ７００℃が好ましく、２８０〜３５０℃がより
好ましい。また、溶融めっきの温度は、２４０〜３００
℃が好ましく、２５０〜２７０℃がより好ましい。処理
時間は、銅合金材の板厚さ、リフロー処理温度、溶融錫
浴温度によって適切な値を設定する。Note that the ambient temperature for reflow is 27
The temperature is preferably 0 to 700°C, more preferably 280 to 350°C. In addition, the temperature of hot-dip plating is 240 to 300
C is preferable, and 250 to 270 C is more preferable. The processing time is set to an appropriate value depending on the plate thickness of the copper alloy material, the reflow processing temperature, and the molten tin bath temperature.
【００１９】ニッケルめっきは、リフロー処理後および
溶融錫めっき後に完全に無くなっていることが重要であ
る。なぜならば、ニッケルめっき層が残っていると本材
が電子部品となって使用される間に、ニッケルと錫の相
互拡散が進行して、ニッケルと錫からなる金属間化合物
層がさらに成長し、本発明で規定した以上の厚さになる
恐れがあるからである。拡散によってできる金属間化合
物はめっき層の界面に欠陥を伴ったりして剥離の原因に
なりかねない。また、必要以上の厚さの金属間化合物層
は加工性を低下させる。It is important that the nickel plating is completely removed after reflow treatment and hot-dip tin plating. This is because if the nickel plating layer remains, while the material is being used as an electronic component, interdiffusion of nickel and tin will progress, and an intermetallic compound layer consisting of nickel and tin will grow further. This is because there is a possibility that the thickness will exceed the thickness specified in the present invention. Intermetallic compounds formed by diffusion may cause defects at the interface of the plating layer, causing peeling. Furthermore, an intermetallic compound layer having a thickness greater than necessary reduces workability.
【００２０】また、錫めっきの厚さは、コストやスタン
ピング時の層の発生を考慮すると薄い方が望ましい。し
かし、一方、耐熱剥離性、半田付け性の観点からは厚い
方が望ましい。めっきを行ってから部品に加工され、機
器に実装される際の半田付けを行うまでの期間をおよそ
１年とすると、その期間、半田付け性を保持するために
は、少なくとも０．８μｍは必要であると考える。詳細
はめっき材の用途に応じて適宜決定すればよい。Further, the thickness of the tin plating is desirably thinner in consideration of cost and generation of a layer during stamping. However, on the other hand, from the viewpoint of heat-resistant peelability and solderability, the thicker the layer is, the more desirable it is. Assuming that the period from plating to soldering when processed into parts and mounted on equipment is approximately one year, a thickness of at least 0.8 μm is required to maintain solderability during that period. I believe that. The details may be determined as appropriate depending on the use of the plating material.
【００２１】本発明において用いる銅合金としては、り
ん青銅、５ｗｔ％Ｚｎ−Ｃｕ、２ｗｔ％Ｓｎ−０．１ｗ
ｔ％Ｆｅ−０．０３ｗｔ％Ｐ−Ｃｕ、２．２５ｗｔ％Ｚ
ｎ−２ｗｔ％Ｓｎ−０．１ｗｔ％Ｆｅ−０．０３ｗｔ％
Ｐ−Ｃｕ等の使用が望ましい。[0021] The copper alloys used in the present invention include phosphor bronze, 5wt% Zn-Cu, and 2wt% Sn-0.1w.
t%Fe-0.03wt%P-Cu, 2.25wt%Z
n-2wt% Sn-0.1wt% Fe-0.03wt%
It is desirable to use P-Cu or the like.
【００２２】[0022]
【実施例】表１に示す錫めっき材を作成した。なお、リ
ン青銅材は６ｗｔ％Ｓｎ−０．０４５ｗｔ％Ｐ−Ｃｕか
らなるリン青銅二種材を用いた。また、表１に示すＫＬ
Ｆ５銅合金は、２ｗｔ％Ｓｎ−Ｏ．１ｗｔ％Ｆｅ−０．
０３ｗｔ％Ｐ−Ｃｕからなる銅合金である。いずれの場
合も銅合金材の板厚さは、０．２５ｍｍである。[Example] The tin-plated materials shown in Table 1 were prepared. In addition, the phosphor bronze material used was a phosphor bronze type 2 material consisting of 6 wt% Sn-0.045 wt% P-Cu. In addition, KL shown in Table 1
F5 copper alloy contains 2wt% Sn-O. 1wt%Fe-0.
It is a copper alloy consisting of 03wt% P-Cu. In either case, the thickness of the copper alloy material is 0.25 mm.
【００２３】なお、リフローめっきに用いためっき液の
組成を表２に示した。リフローめっきは３２０℃の雰囲
気中に１５秒間保持して行った。一方溶融めっきは２６
０℃の溶融錫中に銅合金材を５秒間浸漬することにより
行った。[0023] Table 2 shows the composition of the plating solution used in reflow plating. Reflow plating was performed by holding the sample in an atmosphere at 320° C. for 15 seconds. On the other hand, hot-dip plating is 26
This was done by immersing the copper alloy material in molten tin at 0°C for 5 seconds.
【００２４】これらの錫めっき材を１５０℃で１００、
５００、１０００時間熱処理した後、これらの材料の９
０°繰り返し曲げを２回行い、曲げ部表面を実態顕微鏡
で観察し、めっき層の剥離の有無を確認した。[0024] These tin-plated materials were heated to 100°C at 150°C.
After heat treatment for 500, 1000 hours, 9 of these materials
Repeated bending at 0° was performed twice, and the surface of the bent portion was observed under a microscope to confirm the presence or absence of peeling of the plating layer.
【００２５】また、半田付け性は、最近のコネクターの
表面実装化に伴い増加してきたリフロー半田付け方法を
考慮した２２０℃で１０分までの範囲の熱処理後に評価
した。半田付け性の評価は、半田付け後に半田の付着面
積が８５％以上を”良好”とし、それ以下を”不良”と
した。 結果は表３に示した。なお、表３において、
Ａｓは熱処理をしない状態を示す。Furthermore, the solderability was evaluated after heat treatment at 220° C. for up to 10 minutes, taking into consideration the reflow soldering method that has been increasing with the recent trend toward surface mounting of connectors. For evaluation of solderability, if the solder adhesion area after soldering was 85% or more, it was considered "good", and if it was less than that, it was considered "poor". The results are shown in Table 3. In addition, in Table 3,
As indicates a state without heat treatment.
【００２６】ニッケルと錫の金属間化合物層の厚さが０
．１μｍ以上の時、熱剥離は起こらなかった。これは、
Ｃｕ３Ｓｎからなるε層、Ｃｕ６ Ｓｎ５からなるη層
がほとんど成長しないためであると考えられる。また、
従来材は、１５０℃×５００時間でめっきの剥離が発生
した。ニッケルと錫との金属間化合物層の厚さが０．５
μｍ以上では曲げ試験によって剥離が発生した。よって
、ニッケルと錫の金属間化合物層の厚さは０．１〜０．
４μｍが適当である。また、ニッケルめっきを施さない
ものは、２２０℃×５分の熱処理で半田付け不良が発生
するのに対し、本発明による錫めっき材は、１０分でも
良好な半田付け性が得られた。半田付け性への熱影響の
点でも、本発明材は優れていた。[0026] The thickness of the intermetallic compound layer of nickel and tin is 0.
．． No thermal peeling occurred when the thickness was 1 μm or more. this is,
This is considered to be because the ε layer made of Cu3Sn and the η layer made of Cu6Sn5 hardly grow. Also,
In the conventional material, peeling of the plating occurred at 150°C for 500 hours. The thickness of the intermetallic compound layer of nickel and tin is 0.5
When the thickness was greater than μm, peeling occurred during the bending test. Therefore, the thickness of the intermetallic compound layer of nickel and tin is 0.1 to 0.
4 μm is appropriate. Further, in contrast to the non-nickel-plated material, poor soldering occurred after heat treatment at 220° C. for 5 minutes, the tin-plated material according to the present invention had good solderability even after 10 minutes. The material of the present invention was also excellent in terms of thermal influence on solderability.
【００２７】[0027]
【発明の効果】本発明によって、耐熱剥離性、耐熱半田
付け性に優れた錫めっき銅合金材およびその製造方法を
提供することが出来る。これらの錫めっき銅合金材は、
端子・コネクター等の電気・電子部品の耐熱剥離性、耐
熱半田付け性を向上させることになり、機器の信頼性を
たかめることに貢献できる。表１
表２
表３[Effects of the Invention] According to the present invention, it is possible to provide a tin-plated copper alloy material with excellent heat-resistant peelability and heat-resistant solderability, and a method for manufacturing the same. These tin-plated copper alloy materials are
It improves the heat-resistant peelability and heat-resistant solderability of electrical and electronic components such as terminals and connectors, contributing to increased reliability of equipment. Table 1 Table 2 Table 3
Claims (3)
１〜０．４μｍ厚のニッケルと錫との金属間化合物層を
持つことを特徴とした錫めっき銅合金材。Claim 1: Between the copper alloy material and the tin plating layer, 0.
A tin-plated copper alloy material characterized by having an intermetallic compound layer of nickel and tin with a thickness of 1 to 0.4 μm.
ｍのニッケルめっき層を施し、さらにその上に錫めっき
を施した後、錫めっき層をリフローさせることによって
、銅合金材と錫めっき層との間に０．１〜０．４μｍ厚
のニッケルと錫との金属間化合物層を設けることを特徴
とする錫めっき銅合金材の製造方法。Claim 2: 0.08 to 0.3μ on the surface of the copper alloy material.
After applying a nickel plating layer of m and tin plating on top of the nickel plating layer, the tin plating layer is reflowed to form a 0.1 to 0.4 μm thick nickel layer between the copper alloy material and the tin plating layer. A method for producing a tin-plated copper alloy material, which comprises providing an intermetallic compound layer with tin.
ｍのニッケルめっき層を施した後、ニッケルめっき層を
施した銅合金材を、溶融した錫中に浸漬することにより
錫めっき層を形成すると同時に銅合金材と錫めっき層の
中間に０．１〜０．４μｍのニッケルと錫の金属間化合
物層を設けることを特徴とする錫めっき銅合金材の製造
方法。Claim 3: 0.08 to 0.3μ on the surface of the copper alloy material
After applying a nickel plating layer of m, the copper alloy material with the nickel plating layer is immersed in molten tin to form a tin plating layer. A method for manufacturing a tin-plated copper alloy material, characterized by providing a nickel-tin intermetallic compound layer of ~0.4 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3013031A JP2798512B2 (en) | 1991-01-10 | 1991-01-10 | Tin-plated copper alloy material and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3013031A JP2798512B2 (en) | 1991-01-10 | 1991-01-10 | Tin-plated copper alloy material and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04235292A true JPH04235292A (en) | 1992-08-24 |
| JP2798512B2 JP2798512B2 (en) | 1998-09-17 |
Family
ID=11821762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3013031A Expired - Lifetime JP2798512B2 (en) | 1991-01-10 | 1991-01-10 | Tin-plated copper alloy material and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2798512B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003147579A (en) * | 2001-11-13 | 2003-05-21 | Yazaki Corp | Terminal |
| WO2006077827A1 (en) * | 2005-01-18 | 2006-07-27 | Autonetworks Technologies, Ltd. | Press-fit terminal, press-fit terminal manufacturing method and structure for connecting press-fit terminal and circuit board |
| JP2010242220A (en) * | 2010-05-07 | 2010-10-28 | Kobe Steel Ltd | Production method of plated copper alloy material for fuse |
| US8013428B2 (en) | 2004-09-28 | 2011-09-06 | Lsi Corporation | Whisker-free lead frames |
| JP2012238784A (en) * | 2011-05-13 | 2012-12-06 | Murata Mfg Co Ltd | Electronic component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4838247A (en) * | 1971-09-20 | 1973-06-05 | ||
| JPS5021272A (en) * | 1973-06-28 | 1975-03-06 | ||
| JPS61198507A (en) * | 1985-02-28 | 1986-09-02 | 日本鉱業株式会社 | Composite material for electronic component and manufacture |
-
1991
- 1991-01-10 JP JP3013031A patent/JP2798512B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4838247A (en) * | 1971-09-20 | 1973-06-05 | ||
| JPS5021272A (en) * | 1973-06-28 | 1975-03-06 | ||
| JPS61198507A (en) * | 1985-02-28 | 1986-09-02 | 日本鉱業株式会社 | Composite material for electronic component and manufacture |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003147579A (en) * | 2001-11-13 | 2003-05-21 | Yazaki Corp | Terminal |
| US8013428B2 (en) | 2004-09-28 | 2011-09-06 | Lsi Corporation | Whisker-free lead frames |
| WO2006077827A1 (en) * | 2005-01-18 | 2006-07-27 | Autonetworks Technologies, Ltd. | Press-fit terminal, press-fit terminal manufacturing method and structure for connecting press-fit terminal and circuit board |
| JPWO2006077827A1 (en) * | 2005-01-18 | 2008-08-07 | 株式会社オートネットワーク技術研究所 | Press-fit terminal, manufacturing method thereof, and connection structure between press-fit terminal and circuit board |
| JP2010242220A (en) * | 2010-05-07 | 2010-10-28 | Kobe Steel Ltd | Production method of plated copper alloy material for fuse |
| JP2012238784A (en) * | 2011-05-13 | 2012-12-06 | Murata Mfg Co Ltd | Electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2798512B2 (en) | 1998-09-17 |
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