JPH03188254A - Solder plated copper alloy material - Google Patents
Solder plated copper alloy materialInfo
- Publication number
- JPH03188254A JPH03188254A JP32676289A JP32676289A JPH03188254A JP H03188254 A JPH03188254 A JP H03188254A JP 32676289 A JP32676289 A JP 32676289A JP 32676289 A JP32676289 A JP 32676289A JP H03188254 A JPH03188254 A JP H03188254A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- solder
- copper alloy
- alloy material
- plated copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 41
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 33
- 239000000956 alloy Substances 0.000 title claims abstract description 17
- 238000007747 plating Methods 0.000 claims abstract description 93
- 239000010949 copper Substances 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 238000009792 diffusion process Methods 0.000 abstract description 5
- 230000007774 longterm Effects 0.000 abstract description 4
- 229910052745 lead Inorganic materials 0.000 abstract description 3
- 229910052725 zinc Inorganic materials 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 229910052718 tin Inorganic materials 0.000 abstract description 2
- 229910020816 Sn Pb Inorganic materials 0.000 abstract 1
- 229910020922 Sn-Pb Inorganic materials 0.000 abstract 1
- 229910008783 Sn—Pb Inorganic materials 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000005246 galvanizing Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 241000254137 Cicadidae Species 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
Landscapes
- Coating With Molten Metal (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、端子、コネクター等の電子機器用銅合金条な
どに使用されるはんだめっき銅合金材に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a solder-plated copper alloy material used for copper alloy strips for electronic devices such as terminals and connectors.
従来、例えば電子機器用のはんだめっき銅合金条として
は、主としてりん青銅系等の銅合金を母材とし、これに
はんだめっきを施したはんだめっき銅合金条が多用され
ている。その下地めっきに関しては、下地めっきを施さ
ない場合、 Ｃｕめっきを施す場合、あるいはＮｉめっ
きを施す場合等があり、各々下地めっきの厚さを変える
等の条件で実用に供されている。このような背景の中で
、はんだめっきの密着信頼性の要求レベルに応じて、種
々の条件による下地めっきが利用されている。Conventionally, as solder-plated copper alloy strips for electronic devices, for example, solder-plated copper alloy strips in which the base material is mainly a copper alloy such as phosphor bronze and which is plated with solder have been widely used. Regarding the base plating, there are cases where no base plating is applied, cases where Cu plating is applied, cases where Ni plating is applied, etc., and each is put into practical use under conditions such as changing the thickness of the base plating. Under such a background, base plating under various conditions is used depending on the required level of adhesion reliability of solder plating.
近年では電子機器の小型化ならびに高出力、高機能化へ
の移行に伴って、電子機器用部材の使用環境も一段と厳
しい条件になり、電子機器用部材に求められる諸特性も
非常に高度になってきている。例えばコネクター等にお
いては１発熱等の温度上昇があり、このような使用環境
下で長期間使用される場合、はんだめっきの母材との密
着性が低下し、はんだめっきの剥離に発展することがあ
る。従って、近年の高出力機器対応の電子機器部材では
さらに高い信頼性が要求されている。また、Ｓｎめっき
銅合金材の母材についても１強度、導電性、ならびに耐
熱性等に優れたものが要求されている。In recent years, as electronic equipment has become smaller, more powerful, and more sophisticated, the environment in which electronic equipment parts are used has become even more demanding, and the characteristics required of electronic equipment parts have also become more sophisticated. It's coming. For example, in connectors, etc., there is a temperature rise such as 1 heat generation, and when used for a long period of time in such a usage environment, the adhesion of the solder plating to the base material may decrease, leading to peeling of the solder plating. be. Therefore, even higher reliability is required for electronic equipment components compatible with recent high-output equipment. Furthermore, the base material of the Sn-plated copper alloy material is also required to have excellent strength, conductivity, heat resistance, and the like.
高い信頼性を有するはんだめっきを施したリン青銅から
なる接触子の製造方法として、例えば１価のＣｕイオン
濃度が１０〜６０ｇＩＱ、遊離シアン濃度が１０〜２０
ｇ／１２である青化浴を使用してりん青銅母材にＣｕ下
地めっきを薄く施し、その後上地めっきとしてはんだを
電気めっきし、続いて加熱溶融処理するか、或いは上地
めっきとしてはんだを溶融めっきする方法が提案されて
いる（特開昭５９−１８４４８２号）。As a method for manufacturing a highly reliable contact made of phosphor bronze plated with solder, for example, the concentration of monovalent Cu ions is 10 to 60 gIQ, and the concentration of free cyanide is 10 to 20.
A thin Cu underplating is applied to the phosphor bronze base material using a bluing bath of g/12, and then solder is electroplated as the top plating, followed by heat melting treatment, or solder is applied as the top plating. A hot-dip plating method has been proposed (Japanese Patent Laid-Open No. 184482/1982).
また、銅合金のはんだめっきの密着性に関しては、銅合
金中のＣｕとはんだめっき中のＳｎとの相互拡散によっ
て、銅合金とはんだめっきとの界面近傍にＣｕとＳｎお
よびＮｉ等の脆弱な拡散層が形成されるとともに、カー
ケンダールボイドが発生してしまうため、はんだめっき
の密着性を低下させてしまうことが知られている。Regarding the adhesion of copper alloy solder plating, due to mutual diffusion between Cu in the copper alloy and Sn in the solder plating, weak diffusion of Cu, Sn, Ni, etc. occurs near the interface between the copper alloy and the solder plating. It is known that as the layer is formed, Kirkendall voids are generated, which reduces the adhesion of solder plating.
はんだめっきの耐熱密着性に及ぼす下地めっきの影響と
しては、Ｎｉの下地めっきが最も高い信頼性を有し、Ｃ
ｕ下地めっきおよび下地めっきなしの場合は、長期にわ
たる耐熱密着性に関しては比較的信頼性に乏しいのが現
状である。しかしＮｉめっきは比較的硬いという特長が
あり、Ｎｉ下地めっきを施したものはプレス加工等によ
る成形加工時にクラックが発生し易いという大きな欠点
を有し、工業的に利用しにくい問題点がある。Regarding the influence of base plating on the heat-resistant adhesion of solder plating, Ni base plating has the highest reliability, and C
At present, in the case of U-base plating and no base plating, reliability is relatively poor in terms of long-term heat-resistant adhesion. However, Ni plating has the advantage of being relatively hard, and products coated with Ni underplating have a major drawback in that cracks are likely to occur during forming processes such as press working, making them difficult to use industrially.
本発明は、従来の問題点を改善するためのもので、はん
だめっきの耐熱長期信頼性が著しく優れ、母材の強度や
導電性ならびに耐熱性も優れたはんだめっき銅合金材を
提供することを目的とする６〔課題を解決するための手
段〕
本発明のはんだめっき銅合金材は、重量％でＮｉ２．０
〜８．０％、ＰＯｌｌを超え〜０．８％、Ｓｉ ０．０
６〜１．０％およびＺｎ ０．５〜８．０％を含有し、
残部がＣｕおよび不可避の不純物からなる銅合金に、下
地めっきおよびはんだめっきを施したはんだめっき銅合
金材において、下地めっきとして厚さ０．０５〜２趨の
Ｚｎめっきを施し、はんだめっきとして重量％で５ｎ５
５〜９５％およびＰｂ５〜４５％からなるはんだめっき
を施したものである。The present invention is intended to improve the conventional problems, and aims to provide a solder-plated copper alloy material that has extremely excellent heat resistance and long-term reliability of solder plating, and has excellent base material strength, conductivity, and heat resistance. Objective 6 [Means for Solving the Problems] The solder-plated copper alloy material of the present invention has Ni2.0 in weight%.
~8.0%, exceeding POll ~0.8%, Si 0.0
Contains 6-1.0% and Zn 0.5-8.0%,
In a solder-plated copper alloy material in which base plating and solder plating are applied to a copper alloy in which the remainder consists of Cu and unavoidable impurities, Zn plating with a thickness of 0.05 to 2 lines is applied as the base plating, and the weight % as solder plating is applied. 5n5
It is plated with solder consisting of 5-95% Pb and 5-45% Pb.
本発明では、下地めっきとして、厚さ０．０５〜２趨の
Ｚｎ下地めっきを単独で施すこともできるが、０．０５
〜５蝉のＣｕ下地めっきと組合せて２相または３相構成
の下地めっきを施すこともできる。In the present invention, Zn base plating with a thickness of 0.05 to 2 layers can be applied alone as the base plating, but
It is also possible to perform base plating with a two-phase or three-phase configuration in combination with the Cu base plating of ~5 cicadas.
このようなはんだめっき銅合金材として次のようなもの
があげられる。Examples of such solder-plated copper alloy materials include the following.
（１）下地めっきとして、厚さ０．０５〜２趨のＺｎめ
っきを施したはんだめっき銅合金材。(1) Solder-plated copper alloy material coated with Zn plating with a thickness of 0.05 to 2 lines as base plating.
（２）下地めっきとして、厚さ０．０５〜２ＩｓのＺｎ
めっきを施し、次いで厚さ０．０５〜５ＩａのＣｕめっ
きを施したはんだめっき銅合金材。(2) Zn with a thickness of 0.05 to 2Is as the base plating
A solder-plated copper alloy material that is plated and then Cu-plated to a thickness of 0.05 to 5 Ia.
（３）下地めっきとして、厚さ０．０５〜５趨のＣｕめ
っきを施し、次いで厚さ０．ＯＳ〜２／ａのＺｎめっき
を施したはんだめっき銅合金材。(3) As base plating, apply Cu plating with a thickness of 0.05 to 5 mm, and then apply Cu plating with a thickness of 0.05 to 5. Solder-plated copper alloy material with Zn plating of OS~2/a.
（４）下地めっきとして、厚さ０．０５〜５ｔｓのＣｕ
めっきを施し、次いで厚さ０．０５〜２／ａのＺｎめっ
きを施し、さらに厚さ０．０５〜５７ａのＣｕめつきを
施したはんだめっき銅合金材。(4) Cu with a thickness of 0.05 to 5 ts as base plating
A solder-plated copper alloy material that has been plated, then Zn plating with a thickness of 0.05 to 2/a, and further Cu plating with a thickness of 0.05 to 57a.
本発明のはんだめっき銅合金材においては、銅合金とは
んだめっきの界面におけるＣｕとはんだめっき中のＳｎ
との一連の拡散現象の過程において、下地めっき中のＺ
ｎの移動によりカーケンダールボイドの発生が抑制され
、その結果はんだめっきの密着性が改善される。In the solder-plated copper alloy material of the present invention, Cu at the interface between the copper alloy and the solder plating and Sn in the solder plating
In the process of a series of diffusion phenomena with
The movement of n suppresses the occurrence of Kirkendahl voids, and as a result, the adhesion of solder plating is improved.
Ｚｎ下地めっきの効果は、Ｚｎめっきの厚さ０．０５゜
で認められ、めっきの厚さを増すにつれてその効果は顕
著になる。しかし、Ｚｎ下地めっきの厚さが２４を超え
ると、めっき後のはんだ濡れ性の低下が認められる。The effect of Zn underplating is recognized at a Zn plating thickness of 0.05°, and the effect becomes more pronounced as the plating thickness increases. However, when the thickness of the Zn base plating exceeds 24 mm, a decrease in solder wettability after plating is observed.
ＺｎめっきおよびＣｕめっきからなる２相あるいは３相
構成の複合下地めっきとした場合、ＣｕめつきはＺｎめ
っきと母材、あるいはＺｎめっきとはんだめっきとのめ
っき付着性の向上、ならびに母材とはんだめっき間の拡
散現象の進行抑制等を目的としており、それぞれのめっ
きの厚さは工業的に利用可能な効果の得られる範囲とさ
れている。When using a two-phase or three-phase composite base plating consisting of Zn plating and Cu plating, Cu plating improves plating adhesion between Zn plating and base material, or between Zn plating and solder plating, and improves plating adhesion between base material and solder. The purpose is to suppress the progress of the diffusion phenomenon between the platings, and the thickness of each plating is set within a range that provides an industrially usable effect.
母材として、表１に示すような実用段階にある代表組成
の２種類の銅合金からなる板厚０．２５ｍｍの条材を用
い、工業的規模の電気めっき装置により、表１に示すよ
うな各種下地めっきを施した後、はんだめっき厚３．０
癖のはんだめっきを施してはんだめっき銅合金条を作成
した。As the base material, strips with a thickness of 0.25 mm made of two types of copper alloys with typical compositions at the practical stage as shown in Table 1 were used. After applying various base plating, solder plating thickness is 3.0
A solder-plated copper alloy strip was created by applying special solder plating.
めっき密着性は、幅２０ＤＩ、長さ８０＋ｍ＋の短冊状
の試片を用い、温度１５０℃の恒温槽内で加熱による加
速試験を行い、密着性低下の経時変化により評価した。Plating adhesion was evaluated by conducting an accelerated test by heating in a constant temperature bath at a temperature of 150° C. using a strip-shaped test piece with a width of 20 DI and a length of 80+ m+, and based on the change in adhesion decrease over time.
また密着性劣化の有無については、所定時間の加熱を終
えた試片に密着曲げ試験を実施し、さらに元の状態に曲
げもどしを行い、その曲げ部分を実体顕微鏡（２０倍）
で観察して、はんだめっき剥離の有無により判断した。In addition, to check whether there is any deterioration in adhesion, we conduct a contact bending test on the specimen after heating it for a predetermined time, then bend it back to its original state, and examine the bent part under a stereoscopic microscope (20x magnification).
It was observed and judged based on the presence or absence of peeling of the solder plating.
また、各々の試片について、めっき直後のはんだ濡れ性
および成形加工性を比較評価した。In addition, the solder wettability and moldability of each specimen immediately after plating were comparatively evaluated.
表１に実施例および比較例の諸特性の比較を示した。Table 1 shows a comparison of various properties of Examples and Comparative Examples.
表１の結果より、 Ｚｎの下地めっきを施した実施例１
〜１２および比較例３．４．７．８は、比較例１．２．
５．６に比べてめっきの耐熱密着性に著しい改善の効果
が認められる。From the results in Table 1, Example 1 with Zn underplating
~12 and Comparative Example 3.4.7.8 are Comparative Example 1.2.
A significant improvement in the heat-resistant adhesion of the plating was observed compared to 5.6.
一方、比較例４．８は、めっきの耐熱密着性の面では実
施例同様に優れているものの、 Ｓｎめっき直後のはん
だの濡れ性では低下が認められるため、工業的な利用の
面では万全とは言い難い。On the other hand, although Comparative Example 4.8 is excellent in terms of heat-resistant adhesion of the plating, similar to the examples, a decrease in solder wettability immediately after Sn plating is observed, so it is not perfect for industrial use. It's hard to say.
また比較例３．７は、めっきの耐熱密着性およびはんだ
濡れ性は実施例と同等に優れているが、成形加工性に劣
り、やはり工業的な利用には不向きである。Further, Comparative Example 3.7 has excellent plating heat-resistant adhesion and solder wettability equivalent to those of the Examples, but is inferior in moldability and is therefore unsuitable for industrial use.
なお、前記実施例では、銅合金の素条段階のはんだめっ
き品を対象としたが、はんだめっきを施していない銅合
金をプレスあるいはエツチング加工等によって、電子機
器用の部材に成形加工後、はんだめっきを施して実用に
供する場合においても、本発明による下地めっきを応用
することにより、本発明と同様な効果が当然期待できる
。また、はんだ濡れ性やめっき密着性等の向上を目的と
して、はんだめっき後に再加熱、リフロー処理を施して
使用することも当然可能である。In the above example, the solder-plated copper alloy was used as a raw material. However, after forming the unsolder-plated copper alloy into a member for electronic equipment by pressing or etching, it is soldered. Even when plating is applied for practical use, the same effects as the present invention can naturally be expected by applying the base plating according to the present invention. Furthermore, it is naturally possible to perform reheating and reflow treatment after solder plating for the purpose of improving solder wettability, plating adhesion, and the like.
以上のように１本発明では、強度、導電性、ならびに耐
熱性等の優れた銅合金に下地めっきとして、または下地
めっきの一部として厚さ０．０５〜２−のＺｎめっきを
施した後、はんだめっきを施すようにしたので、はんだ
めっきの耐熱長期信頼性が著しく優れたはんだめっき銅
合金材が得られる。As described above, in the present invention, after applying Zn plating to a thickness of 0.05 to 2-2 as a base plating or as a part of the base plating to a copper alloy having excellent strength, conductivity, and heat resistance, etc. Since the solder plating is applied, a solder-plated copper alloy material with extremely excellent heat resistance and long-term reliability of the solder plating can be obtained.
Claims (1)
〜０．８％、Ｓｉ０．０６〜１．０％およびＺｎ０．５
〜８．０％を含有し、残部がＣｕおよび不可避の不純物
からなる銅合金に、下地めっきおよびはんだめっきを施
したはんだめっき銅合金材において、下地めっきとして
厚さ０．０５〜２μｍのＺｎめっきを施し、はんだめっ
きとして重量％でＳｎ５５〜９５％およびＰｂ５〜４５
％からなるはんだめっきを施したことを特徴とするはん
だめっき銅合金材。(1) Ni2.0-8.0% by weight, P0.1 over ~0.8%, Si0.06-1.0% and Zn0.5
~8.0%, with the balance consisting of Cu and unavoidable impurities, in a solder-plated copper alloy material that has been subjected to base plating and solder plating, and Zn plating with a thickness of 0.05 to 2 μm as the base plating. and solder plating with Sn55-95% and Pb5-45% by weight.
% solder-plated copper alloy material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32676289A JPH03188254A (en) | 1989-12-16 | 1989-12-16 | Solder plated copper alloy material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32676289A JPH03188254A (en) | 1989-12-16 | 1989-12-16 | Solder plated copper alloy material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03188254A true JPH03188254A (en) | 1991-08-16 |
Family
ID=18191407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32676289A Pending JPH03188254A (en) | 1989-12-16 | 1989-12-16 | Solder plated copper alloy material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03188254A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0649613A (en) * | 1992-07-02 | 1994-02-22 | Nippon Alum Co Ltd | Plating treatment |
| AU679631B2 (en) * | 1994-06-13 | 1997-07-03 | Nihon Almit Co., Ltd. | High-strength solder alloy |
| CN109706342A (en) * | 2018-12-29 | 2019-05-03 | 郑州机械研究所有限公司 | A kind of copper zinc silicon substrate powdery brazing filler metal material and preparation method thereof containing alterant |
-
1989
- 1989-12-16 JP JP32676289A patent/JPH03188254A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0649613A (en) * | 1992-07-02 | 1994-02-22 | Nippon Alum Co Ltd | Plating treatment |
| AU679631B2 (en) * | 1994-06-13 | 1997-07-03 | Nihon Almit Co., Ltd. | High-strength solder alloy |
| CN109706342A (en) * | 2018-12-29 | 2019-05-03 | 郑州机械研究所有限公司 | A kind of copper zinc silicon substrate powdery brazing filler metal material and preparation method thereof containing alterant |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100215623B1 (en) | Electrical contact pair | |
| JP2002317295A (en) | REFLOW TREATED Sn ALLOY PLATING MATERIAL AND FIT TYPE CONNECTING TERMINAL USING THE SAME | |
| JP2001059197A (en) | Plating material for connector | |
| JPH08176883A (en) | Production of tin alloy plated material | |
| US6641930B2 (en) | Electrically conductive metal tape and plug connector | |
| JPH11222659A (en) | Process for producing metal composite strip | |
| CN101426961A (en) | Heat-resistant Sn-plated Cu-Zn alloy strip suppressed in whiskering | |
| JPH04329891A (en) | Tin plated copper alloy material and its production | |
| JP2002025334A (en) | Conductive metal band and connector made of the same | |
| JP4740814B2 (en) | Copper alloy reflow Sn plating material with excellent whisker resistance | |
| JPH06228684A (en) | Connector for electric and electronic appliance made of cu alloy | |
| JPH07126779A (en) | Copper-base alloy and its production | |
| JP2005251762A (en) | Tin coated electrical connector | |
| JPH03188254A (en) | Solder plated copper alloy material | |
| JPH03188253A (en) | Tinned copper alloy material | |
| KR100874396B1 (en) | Materials for metal strip | |
| JPH0681189A (en) | Production of plated copper sheet or plated copper alloy sheet for producing electric connector | |
| JP2851245B2 (en) | Sn alloy plating material | |
| JP4570948B2 (en) | Sn-plated strip of Cu-Zn alloy with reduced whisker generation and method for producing the same | |
| JPH03153856A (en) | Solder-plated copper alloy stock | |
| JP2647656B2 (en) | Method of manufacturing contacts | |
| JPH03271395A (en) | Tin plated copper alloy material | |
| JPH03271394A (en) | Soldered copper alloy material | |
| JPH03188252A (en) | Tinned copper alloy material | |
| JPH03188251A (en) | Soldered copper alloy material |