JPH03153856A - Solder-plated copper alloy stock - Google Patents
Solder-plated copper alloy stockInfo
- Publication number
- JPH03153856A JPH03153856A JP29464689A JP29464689A JPH03153856A JP H03153856 A JPH03153856 A JP H03153856A JP 29464689 A JP29464689 A JP 29464689A JP 29464689 A JP29464689 A JP 29464689A JP H03153856 A JPH03153856 A JP H03153856A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- solder
- copper alloy
- thickness
- plated copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 29
- 238000007747 plating Methods 0.000 claims abstract description 86
- 229910000679 solder Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 17
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 239000000956 alloy Substances 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 5
- 229910052718 tin Inorganic materials 0.000 abstract description 5
- 229910052745 lead Inorganic materials 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 238000005246 galvanizing Methods 0.000 abstract 2
- 238000002156 mixing Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910000906 Bronze Inorganic materials 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000010974 bronze Substances 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、端子、コネクター等の電子機器用銅合金条な
どに使用されるはんだめっき銅合金材に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a solder-plated copper alloy material used for copper alloy strips for electronic devices such as terminals and connectors.
従来１例えば電子機器用のはんだめっき銅合金条として
は、主としてりん青銅系等の鋼合金を母材とし、これに
はんだめっきを施したはんだめっき銅合金条が多用され
ている。その下地めっきに関しては、下地めっきを施さ
ない場合、Ｃｕめっきを施す場合、あるいはＮｉめっき
を施す場合等があり、各々下地めっきの厚さを変える等
の条件で実用に供されている。このような背景の中で、
はんだめっきの密着信頼性の要求レベルに応じて、種々
の条件による下地めっきが利用されている。Conventionally, for example, solder-plated copper alloy strips for electronic devices are often made of a base material of a steel alloy such as phosphor bronze, which is then plated with solder. Regarding the base plating, there are cases where no base plating is applied, cases where Cu plating is applied, cases where Ni plating is applied, etc., and each is put into practical use under conditions such as changing the thickness of the base plating. Against this background,
Base plating under various conditions is used depending on the required level of solder plating adhesion reliability.
近年では電子機器の小型化ならびに高出力化への移行に
伴って、電子機器用部材の使用環境も一段と厳しい条件
になってきている０例えばコネクター等においては、発
熱等の温度上昇があり、このような使用環境下で長期間
使用される場合、はんだめっきの母材との密着性が低下
し、はんだめっきの剥離に発展することがある。従って
、近年の高出力機器対応の電子機器部材ではさらに高い
信頼性が要求されている。In recent years, with the shift to smaller size and higher output of electronic devices, the environment in which electronic device parts are used has become even more severe. When used for a long period of time in such a usage environment, the adhesion of the solder plating to the base material may deteriorate, leading to peeling of the solder plating. Therefore, even higher reliability is required for electronic equipment components compatible with recent high-output equipment.
高い信頼性を有するはんだめっきを施したリン青銅から
なる接触子の製造方法として１例えば１価のＣｕイオン
濃度がｌＯ〜６０ｇ／ｌ、遊離シアン濃度が１０〜２０
ｇＩＱである青化浴を使用してりん青銅母材にＣｕ下地
めっきを薄く施し、その後上地めっきとしてはんだを電
気めっきし、続いて加熱溶融処理するか、或いは上地め
っきとしてはんだを溶融めっきする方法が提案されてい
る（特開昭５９−１８４４８２号）。As a method for manufacturing a highly reliable contact made of phosphor bronze plated with solder, for example, the concentration of monovalent Cu ions is 10 to 60 g/l, and the concentration of free cyanide is 10 to 20 g/l.
Apply a thin Cu underplating to the phosphor bronze base material using a gIQ curing bath, then electroplate solder as the top plating, and then heat and melt it, or hot-dip solder as the top plating. A method has been proposed (Japanese Unexamined Patent Publication No. 184482/1982).
また、銅合金のはんだめっきの密着性に関しては、銅合
金中のＣｕとはんだめっき中のＳｎとの相互拡散によっ
て、銅合金とはんだめっきとの界面近傍にＣｕとＳｎの
脆弱な拡散層が形成されるとともに、力−ケンダールボ
イドが発生してしまうため、はんだめっきの密着性を低
下させてしまうことが知られている。Regarding the adhesion of copper alloy solder plating, due to mutual diffusion between Cu in the copper alloy and Sn in the solder plating, a weak diffusion layer of Cu and Sn is formed near the interface between the copper alloy and the solder plating. It is known that this also causes force-Kendall voids, which deteriorates the adhesion of solder plating.
はんだめっきの耐熱密着性に及ぼす下地めっきの影響と
しては、Ｎｉの下地めっきが最も高い信頼性を有し、Ｃ
ｕ下地めっきおよび下地めっきなしの場合は、長期にわ
たる耐熱密着性に関しては比較的信頼性に乏しいのが現
状である。しかしＮｉめっきは比較的硬いという特長が
あり、Ｎｉ下地めっきを施したものはプレス加工等によ
る成形加工時にクラックが発生し易いという大きな欠点
を有し。Regarding the influence of base plating on the heat-resistant adhesion of solder plating, Ni base plating has the highest reliability, and C
At present, in the case of U-base plating and no base plating, reliability is relatively poor in terms of long-term heat-resistant adhesion. However, Ni plating has the advantage of being relatively hard, and products coated with Ni underplating have a major drawback in that cracks are likely to occur during forming processes such as press working.
工業的に利用しにくい問題点がある。There are problems that make it difficult to use industrially.
本発明は、従来の問題点を改善するためのもので、はん
だめっきの耐熱密着性が著しく優れたはんだめっき銅合
金材を提供することを目的とする。The present invention is intended to improve the conventional problems, and an object of the present invention is to provide a solder-plated copper alloy material that has extremely excellent heat-resistant adhesion of solder plating.
本発明のはんだめっき銅合金材は、重量％でＳｎ０．５
〜１０％およびＰ ０．０１〜０．３５％を含有し、残
部がＣｕおよび不可避の不純物からなる銅合金に、下地
めっきおよびはんだめっきを施したはんだめっき銅合金
材において、下地めっきとして厚さ０．０５〜２−のＺ
ｎめっきを施し、はんだめっきとして重量％でＳｎ ５
５〜９５％およびＰｂ ５〜４５％からなるはんだめっ
きを施したものである。The solder-plated copper alloy material of the present invention has Sn0.5 in weight%.
~10% and P 0.01~0.35%, with the balance consisting of Cu and unavoidable impurities, in a solder-plated copper alloy material that has been subjected to base plating and solder plating. Z of 0.05 to 2-
Sn 5 by weight% as solder plating
It is plated with solder consisting of 5-95% Pb and 5-45% Pb.
本発明では、下地めっきとして、厚さ０．０５〜２趨の
Ｚｎ下地めっきを単独で施すこともできるが、０．０５
〜５−のＣｕ下地めっきと組合せて２相または３相構成
の下地めっきを施すこともできる。In the present invention, Zn base plating with a thickness of 0.05 to 2 layers can be applied alone as the base plating, but
It is also possible to perform base plating with a two-phase or three-phase configuration in combination with the Cu base plating in ~5-.
このようなはんだめっき銅合金材として次のようなもの
があげられる。Examples of such solder-plated copper alloy materials include the following.
（１）下地めっきとして、厚さ０．０５〜２μｍのＺｎ
めっきを施したはんだめっき銅合金材。(1) Zn with a thickness of 0.05 to 2 μm as the base plating
Solder plated copper alloy material with plating.
（２）下地めっきとして、厚さ０．０５〜２Ｉ１ｍのＺ
ｎめっきを施し、次いで厚さ０．０５〜５７ａのＣｕめ
っきを施したはんだめっき銅合金材。(2) As base plating, Z with a thickness of 0.05 to 2I1m
A solder-plated copper alloy material that has been subjected to N plating and then Cu plating with a thickness of 0.05 to 57 mm.
（３）下地めっきとして、厚さ０．０５〜５ｐのＣｕめ
っきを施し、次いで厚さ０．０５〜２ＩａのＺｎめっき
を施したはんだめっき銅合金材。(3) A solder-plated copper alloy material which is coated with Cu plating with a thickness of 0.05 to 5p as the base plating, and then with Zn plating with a thickness of 0.05 to 2Ia.
（４）下地めっきとして、厚さ０．０５〜５陣のＣｕめ
っきを施し、次いで厚さ０．０５〜２μｍのＺｎめっき
を施し、さらに厚さ０．０５〜５−のＣｕめっきを施し
たはんだめっき銅合金材。(4) As base plating, Cu plating with a thickness of 0.05 to 5 layers was applied, followed by Zn plating with a thickness of 0.05 to 2 μm, and further Cu plating with a thickness of 0.05 to 5-μm. Solder plated copper alloy material.
本発明のはんだめっき銅合金材においては、銅合金とは
んだめっきの界面におけるＣｕとはんだめっき中のＳｎ
との一連の拡散現象の過程において、下地めっき中のＺ
ｎの移動によりカーケンダールボイドの発生が抑制され
、その結果はんだめっきの密着性が改善される。In the solder-plated copper alloy material of the present invention, Cu at the interface between the copper alloy and the solder plating and Sn in the solder plating
In the process of a series of diffusion phenomena with
The movement of n suppresses the occurrence of Kirkendahl voids, and as a result, the adhesion of solder plating is improved.
Ｚｎ下地めっきの効果は、 Ｚｎめっきの厚さｏ、ｏｓ
Ｉｓで認められ、めっきの厚さを増すにつれてその効果
は顕著になる。しかし、 Ｚｎ下地めっきの厚さが°２
虜を超えると、めっき後のはんだ濡れ性の低下が認めら
れる。The effect of Zn base plating is as follows: Zn plating thickness o, os
Is, and the effect becomes more pronounced as the plating thickness increases. However, the thickness of the Zn undercoat is 2°
If it exceeds the limit, a decrease in solder wettability after plating will be observed.
ＺｎめっきおよびＣｕめっきからなる２相あるいは３相
構成の複合下地めっきとした場合、ＣｕめっきはＺｎめ
っきと母材、あるいはＺｎめっきとはんだめっきとのめ
っき付着性の向上、ならびに母材とはんだめっき間の拡
散現象の進行抑制等を目的としており、それぞれのめっ
きの厚さは工業的に利用可能な効果の得られる範囲とさ
れている。When using a two-phase or three-phase composite base plating consisting of Zn plating and Cu plating, Cu plating improves plating adhesion between Zn plating and the base material, or between Zn plating and solder plating, and improves the adhesion between the base material and solder plating. The purpose of this is to suppress the progress of the diffusion phenomenon, etc., and the thickness of each plating is set within a range that provides an industrially usable effect.
母材として市販のＪＩＳ Ｃ５１１１またはＣ５２１０
銅合金からなる板厚０．２５＋１１１１の条材を用い、
工業的規模の電気めっき装置により、表１に示すような
各種下地めっきを施した後、はんだめっき厚２．５ｐの
はんだめっきを施してはんだめっき銅合金条を作成した
。Commercially available JIS C5111 or C5210 as base material
Using a strip made of copper alloy with a thickness of 0.25+1111,
After applying various base plating as shown in Table 1 using an industrial-scale electroplating apparatus, solder plating was performed to a solder plating thickness of 2.5p to create a solder-plated copper alloy strip.
めっき密着性は、幅２０ｎ１、長さ８０ａｍの短冊状の
試片を用い、温度１００℃の恒温槽内で加熱による加速
試験を行い、密着性低下の経時変化により評価した。ま
た密着性劣化の有無については、所定時間の加熱を終え
た試片に密着曲げ試験を実施し。Plating adhesion was evaluated by conducting an accelerated test by heating in a constant temperature bath at a temperature of 100° C. using a rectangular specimen with a width of 20 n1 and a length of 80 am, and evaluating the change in adhesion decrease over time. In addition, to check for adhesion deterioration, an adhesion bending test was conducted on specimens that had been heated for a predetermined period of time.
さらに元の状態に曲げもどしを行い、その曲げ部分を実
体顕微鏡（２０倍）でＩＩＩ察して、はんだめっき剥離
の有無により判断した。Furthermore, the bent portion was bent back to its original state, and the bent portion was observed using a stereoscopic microscope (20x magnification), and judgment was made based on the presence or absence of peeling of the solder plating.
また、各々の試片について、めっき直後のはんだ濡れ性
および成形加工性を比較評価した。In addition, the solder wettability and moldability of each specimen immediately after plating were comparatively evaluated.
表１に実施例および比較例の諸特性の比較を示した。Table 1 shows a comparison of various properties of Examples and Comparative Examples.
表１の結果より、Ｚｎの下地めっきを施した実施例１〜
１２および比較例４．８は、比較例１．２．５．６に比
べてめっきの耐熱密着性に著しい改善の効果が認められ
る。From the results in Table 1, Examples 1 to 1 with Zn underplating
In Comparative Example 4.12 and Comparative Example 4.8, a significant improvement in the heat-resistant adhesion of the plating was observed compared to Comparative Example 1.2.5.6.
一方、比較例４．８は、めっきの耐熱密着性の面では実
施例同様に優れているものの、 Ｓｎめっき直後のはん
だの濡れ性では低下が認められるため。On the other hand, although Comparative Example 4.8 is as excellent as the examples in terms of heat-resistant adhesion of plating, a decrease in solder wettability immediately after Sn plating is observed.
工業的な利用の面では万全とは言い難い。It cannot be said that it is perfect for industrial use.
また比較例３．７は、めっきの耐熱密着性およびはんだ
濡れ性は実施例と同等に優れているが、成形加工性に劣
り、やはり工業的な利用には不向きである。Further, Comparative Example 3.7 has excellent plating heat-resistant adhesion and solder wettability equivalent to those of the Examples, but is inferior in moldability and is therefore unsuitable for industrial use.
なお、前記実施例では、りん青銅系合金の素条段階のは
んだめっき品を対象としたが、はんだめっきを施してい
ないりん青銅をプレスあるいはエツチング加工等によっ
て、電子機器用の部材に成形加工後、はんだめっきを施
して実用に供する場合においても、本発明による下地め
っきを応用することにより１本発明と同様な効果が当然
期待できる。また、はんだ濡れ性やめっき密着性等の向
上を目的として、はんだめっき後に再加熱、リフロー処
理を施して使用することも当然可能である。In the above examples, the target was solder-plated products at the raw stage of phosphor bronze alloys, but phosphor bronze without solder plating was formed into parts for electronic devices by pressing or etching. Even when solder plating is applied for practical use, the same effects as the present invention can naturally be expected by applying the base plating according to the present invention. Furthermore, it is naturally possible to perform reheating and reflow treatment after solder plating for the purpose of improving solder wettability, plating adhesion, and the like.
以上のように、本発明では、銅合金に下地めっきとして
、または下地めっきの一部として厚さ０．０５〜２−の
Ｚｎめっきを施した後、はんだめっきを施すようにした
ので、はんだめっきの耐熱密着性が著しく優れたはんだ
めっき銅合金材が得られる。As described above, in the present invention, after applying Zn plating to a thickness of 0.05 to 2-2 as base plating or as a part of base plating on a copper alloy, solder plating is applied. A solder-plated copper alloy material with extremely excellent heat-resistant adhesion can be obtained.
Claims (1)
０．３５％を含有し、残部がＣｕおよび不可避の不純物
からなる銅合金に、下地めっきおよびはんだめっきを施
したはんだめっき銅合金材において、下地めっきとして
厚さ０．０５〜２μｍのＺｎめっきを施し、はんだめっ
きとして重量％でＳｎ５５〜９５％およびＰｂ５〜４５
％からなるはんだめっきを施したことを特徴とするはん
だめっき銅合金材。(1) Sn0.5~10% and P0.01~ in weight%
In a solder-plated copper alloy material in which base plating and solder plating are applied to a copper alloy containing 0.35% Cu and the remainder consisting of Cu and unavoidable impurities, Zn plating with a thickness of 0.05 to 2 μm is applied as the base plating. As solder plating, Sn55-95% and Pb5-45% by weight
% solder-plated copper alloy material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29464689A JPH03153856A (en) | 1989-11-13 | 1989-11-13 | Solder-plated copper alloy stock |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29464689A JPH03153856A (en) | 1989-11-13 | 1989-11-13 | Solder-plated copper alloy stock |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03153856A true JPH03153856A (en) | 1991-07-01 |
Family
ID=17810461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29464689A Pending JPH03153856A (en) | 1989-11-13 | 1989-11-13 | Solder-plated copper alloy stock |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03153856A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0804058A1 (en) * | 1996-04-26 | 1997-10-29 | International Business Machines Corporation | Solder method |
-
1989
- 1989-11-13 JP JP29464689A patent/JPH03153856A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0804058A1 (en) * | 1996-04-26 | 1997-10-29 | International Business Machines Corporation | Solder method |
| US5759379A (en) * | 1996-04-26 | 1998-06-02 | International Business Machines Corporation | Solder method |
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