JPH039637B2 - - Google Patents
Info
- Publication number
- JPH039637B2 JPH039637B2 JP59262133A JP26213384A JPH039637B2 JP H039637 B2 JPH039637 B2 JP H039637B2 JP 59262133 A JP59262133 A JP 59262133A JP 26213384 A JP26213384 A JP 26213384A JP H039637 B2 JPH039637 B2 JP H039637B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- lead wire
- lead wires
- wiring board
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 38
- 238000005476 soldering Methods 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 2
- 210000002105 tongue Anatomy 0.000 description 15
- 230000000694 effects Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26213384A JPS60143697A (ja) | 1984-12-12 | 1984-12-12 | 印刷配線基板へのリード線固定方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26213384A JPS60143697A (ja) | 1984-12-12 | 1984-12-12 | 印刷配線基板へのリード線固定方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60143697A JPS60143697A (ja) | 1985-07-29 |
| JPH039637B2 true JPH039637B2 (US20020051482A1-20020502-M00012.png) | 1991-02-08 |
Family
ID=17371510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26213384A Granted JPS60143697A (ja) | 1984-12-12 | 1984-12-12 | 印刷配線基板へのリード線固定方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60143697A (US20020051482A1-20020502-M00012.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63178382U (US20020051482A1-20020502-M00012.png) * | 1987-05-08 | 1988-11-18 | ||
| JP4062531B2 (ja) * | 2003-08-08 | 2008-03-19 | 船井電機株式会社 | ノイズ吸収装置 |
| WO2020002963A1 (ja) * | 2018-06-28 | 2020-01-02 | 日産自動車株式会社 | 電気装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333489Y2 (US20020051482A1-20020502-M00012.png) * | 1980-03-19 | 1988-09-06 |
-
1984
- 1984-12-12 JP JP26213384A patent/JPS60143697A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60143697A (ja) | 1985-07-29 |
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