JPH039355Y2 - - Google Patents
Info
- Publication number
- JPH039355Y2 JPH039355Y2 JP1986116504U JP11650486U JPH039355Y2 JP H039355 Y2 JPH039355 Y2 JP H039355Y2 JP 1986116504 U JP1986116504 U JP 1986116504U JP 11650486 U JP11650486 U JP 11650486U JP H039355 Y2 JPH039355 Y2 JP H039355Y2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- conductor
- irregularly shaped
- alignment jig
- large number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 50
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986116504U JPH039355Y2 (fr) | 1986-07-29 | 1986-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986116504U JPH039355Y2 (fr) | 1986-07-29 | 1986-07-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6322799U JPS6322799U (fr) | 1988-02-15 |
| JPH039355Y2 true JPH039355Y2 (fr) | 1991-03-08 |
Family
ID=31001158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986116504U Expired JPH039355Y2 (fr) | 1986-07-29 | 1986-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH039355Y2 (fr) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4977271A (fr) * | 1972-11-29 | 1974-07-25 | ||
| JPS502258A (fr) * | 1975-04-26 | 1975-01-10 | ||
| JPS541532U (fr) * | 1977-06-03 | 1979-01-08 |
-
1986
- 1986-07-29 JP JP1986116504U patent/JPH039355Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4977271A (fr) * | 1972-11-29 | 1974-07-25 | ||
| JPS502258A (fr) * | 1975-04-26 | 1975-01-10 | ||
| JPS541532U (fr) * | 1977-06-03 | 1979-01-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6322799U (fr) | 1988-02-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5751556A (en) | Method and apparatus for reducing warpage of an assembly substrate | |
| US5643835A (en) | Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs | |
| US4787853A (en) | Printed circuit board with through-hole connection | |
| JP3751413B2 (ja) | プリント基板間の接続手段 | |
| JPH039355Y2 (fr) | ||
| JPH0442940Y2 (fr) | ||
| JPS61138476A (ja) | ターミナルアセンブリ | |
| US6182883B1 (en) | Method and apparatus for precisely registering solder paste in a printed circuit board repair operation | |
| JPS63102177A (ja) | 分割型コネクタ | |
| DE19919743A1 (de) | Halbleiterbauelement und Verfahren zum Koppeln einer Halbleitereinrichtung | |
| EP0616367A1 (fr) | Structure de broches et procédé de connexion par broches pour dispositif à semi-conducteur | |
| JP2687899B2 (ja) | 表面実装型端子 | |
| JPH0447965Y2 (fr) | ||
| JPH11251727A (ja) | グリッドアレイ型半導体パッケージの実装方法 | |
| JPH08330716A (ja) | ボールグリッドアレイの製造方法 | |
| JPS6023899Y2 (ja) | プリント配線基板 | |
| JPH07249861A (ja) | 表面実装型部品の実装治具 | |
| US20030153201A1 (en) | Circuit board electrical lead frame | |
| JPH0739260Y2 (ja) | 混成集積回路装置 | |
| JP2681702B2 (ja) | 面実装部品の実装方法 | |
| JPH06164117A (ja) | コネクタ付き配線基板の製造方法 | |
| JPS6129164A (ja) | 半導体装置 | |
| JPH01308095A (ja) | リード付き電子部品 | |
| JPH0590745A (ja) | 挿入部品の浮き防止方法 | |
| JPH08204292A (ja) | 電子部品の実装基板、実装治具及びその実装方法 |