JPH0388369U - - Google Patents
Info
- Publication number
- JPH0388369U JPH0388369U JP14920089U JP14920089U JPH0388369U JP H0388369 U JPH0388369 U JP H0388369U JP 14920089 U JP14920089 U JP 14920089U JP 14920089 U JP14920089 U JP 14920089U JP H0388369 U JPH0388369 U JP H0388369U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- positioning mark
- mark
- positioning
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Automatic Assembly (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を示す正面図及び側
面図、及び第２図は本考案に採用することのでき
るマークの形状を示す正面図、第３図は他の実施
例を示す正面図及び断面図を各々示す。
図において、１……電子部品の本体、２……接
点パターン、３，４，７，８……マーク、５……
リード部、９……マーク周辺部、１０……プリン
ト基板。
Fig. 1 is a front view and side view showing one embodiment of the present invention, Fig. 2 is a front view showing the shape of a mark that can be adopted in the present invention, and Fig. 3 is a front view showing another embodiment. Figures and cross-sectional views are shown, respectively. In the figure, 1... Main body of electronic component, 2... Contact pattern, 3, 4, 7, 8... Mark, 5...
Lead part, 9... mark peripheral part, 10... printed circuit board.
Claims (1)
上の接点に連結される複数本のリード部が設けら
れている電子部品において、該回路基板の所定位
置に付与されているマークに対応し、且つ光学的
検出手段によつて検出できる位置決めマークが前
記電子部品の本体に形成されていることを特徴と
する電子部品の位置合わせマーク。 ２ 位置決めマークが電子部品の本体に互いの位
置を異にして複数個形成されている請求項第１項
記載の電子部品の位置合わせマーク。 ３ 位置決めマークの周辺に梨地加工が施されて
いる請求項第１項又は第２項記載の電子部品の位
置合わせマーク。[Claims for Utility Model Registration] 1. In an electronic component mounted at a predetermined position on a circuit board and provided with a plurality of lead parts connected to contacts on the board, 1. A positioning mark for an electronic component, characterized in that a positioning mark corresponding to a mark that is placed on the electronic component and detectable by an optical detection means is formed on the main body of the electronic component. 2. The positioning mark for an electronic component according to claim 1, wherein a plurality of positioning marks are formed on the main body of the electronic component at different positions. 3. The positioning mark for electronic components according to claim 1 or 2, wherein the periphery of the positioning mark has a satin finish.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14920089U JPH0388369U (en) | 1989-12-25 | 1989-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14920089U JPH0388369U (en) | 1989-12-25 | 1989-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0388369U true JPH0388369U (en) | 1991-09-10 |
Family
ID=31695614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14920089U Pending JPH0388369U (en) | 1989-12-25 | 1989-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0388369U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020160325A (en) * | 2019-03-27 | 2020-10-01 | 日東電工株式会社 | Wiring circuit board and manufacturing method thereof |
-
1989
- 1989-12-25 JP JP14920089U patent/JPH0388369U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020160325A (en) * | 2019-03-27 | 2020-10-01 | 日東電工株式会社 | Wiring circuit board and manufacturing method thereof |
| US11825598B2 (en) | 2019-03-27 | 2023-11-21 | Nitto Denko Corporation | Wiring circuit board and producing method thereof |