JPH0312158U - - Google Patents
Info
- Publication number
- JPH0312158U JPH0312158U JP7342189U JP7342189U JPH0312158U JP H0312158 U JPH0312158 U JP H0312158U JP 7342189 U JP7342189 U JP 7342189U JP 7342189 U JP7342189 U JP 7342189U JP H0312158 U JPH0312158 U JP H0312158U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- solder
- inspection pattern
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 238000007689 inspection Methods 0.000 claims description 11
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図はこの考案のプリント基板のハンダブリ
ツジ検査シートの一実施例を示す斜視図、第2図
及び第3図は第1図に示したプリント基板のハン
ダブリツジ検査シートを用いたハンダブリツジの
検査を示す斜視図、第4図はプリント基板及びプ
リント基板に生じたハンダブリツジを示す斜視図
である。
2…プリント基板、10,10a,10b…ハ
ンダ付着部、18…ハンダブリツジ、20…検査
シート、22…透明シート、24,24a,24
b…検査パターン。
FIG. 1 is a perspective view showing an embodiment of the printed circuit board solder bridge inspection sheet of this invention, and FIGS. 2 and 3 show solder bridge inspection using the printed circuit board solder bridge inspection sheet shown in FIG. 1. FIG. 4 is a perspective view showing a printed circuit board and solder bridges formed on the printed circuit board. 2... Printed circuit board, 10, 10a, 10b... Solder attachment part, 18... Solder bridge, 20... Inspection sheet, 22... Transparent sheet, 24, 24a, 24
b...Inspection pattern.
Claims (1)
なシートに不透明部分からなる検査パターンを形
成し、前記プリント基板の前記ハンダ付着部に前
記検査パターンを合致させたとき、前記検査パタ
ーンの透明部分からハンダブリツジを視認可能に
したことを特徴とするプリント基板のハンダブリ
ツジ検査シート。 2 前記検査パターンは、透明シートに前記ハン
ダ付着部を選択的に覆う不透明部分を印刷によつ
て形成したことを特徴とする請求項1記載のプリ
ント基板のハンダブリツジ検査シート。[Claims for Utility Model Registration] 1. When an inspection pattern consisting of opaque parts is formed on a transparent sheet corresponding to the solder attachment area of a printed circuit board, and the inspection pattern is matched to the solder attachment area of the printed circuit board. A printed circuit board solder bridge inspection sheet, characterized in that the solder bridges are made visible from the transparent portion of the inspection pattern. 2. The printed circuit board solder bridge inspection sheet according to claim 1, wherein the inspection pattern is formed by printing an opaque area that selectively covers the solder attachment area on a transparent sheet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7342189U JPH0720587Y2 (en) | 1989-06-22 | 1989-06-22 | Printed circuit board solder bridge inspection sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7342189U JPH0720587Y2 (en) | 1989-06-22 | 1989-06-22 | Printed circuit board solder bridge inspection sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0312158U true JPH0312158U (en) | 1991-02-07 |
JPH0720587Y2 JPH0720587Y2 (en) | 1995-05-15 |
Family
ID=31612221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7342189U Expired - Lifetime JPH0720587Y2 (en) | 1989-06-22 | 1989-06-22 | Printed circuit board solder bridge inspection sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0720587Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58143959U (en) * | 1982-03-24 | 1983-09-28 | トステム株式会社 | casement window opening angle adjuster |
-
1989
- 1989-06-22 JP JP7342189U patent/JPH0720587Y2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58143959U (en) * | 1982-03-24 | 1983-09-28 | トステム株式会社 | casement window opening angle adjuster |
Also Published As
Publication number | Publication date |
---|---|
JPH0720587Y2 (en) | 1995-05-15 |