JPH0351864U - - Google Patents

Info

Publication number
JPH0351864U
JPH0351864U JP11214789U JP11214789U JPH0351864U JP H0351864 U JPH0351864 U JP H0351864U JP 11214789 U JP11214789 U JP 11214789U JP 11214789 U JP11214789 U JP 11214789U JP H0351864 U JPH0351864 U JP H0351864U
Authority
JP
Japan
Prior art keywords
electronic components
board body
carved
mold
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11214789U
Other languages
Japanese (ja)
Other versions
JPH075650Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989112147U priority Critical patent/JPH075650Y2/en
Publication of JPH0351864U publication Critical patent/JPH0351864U/ja
Application granted granted Critical
Publication of JPH075650Y2 publication Critical patent/JPH075650Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

図は本考案の一実施例を示し、第1図はセラミ
ツク基板の平面図、第2図はセラミツク基板に配
線パターンを印刷した状態を示す平面図、第3図
は回路基板の平面図、第4図は変形例を示し、同
図はグリーンシートにモブリデン等にて形成した
マークを設けた状態を示す平面図である。 1,13……セラミツク基板、2……光センサ
、4,5,6,14……マーク、7……配線パタ
ーン、10……IC、11……回路基板。
The figures show one embodiment of the present invention; FIG. 1 is a plan view of a ceramic substrate, FIG. 2 is a plan view showing a wiring pattern printed on the ceramic substrate, FIG. 3 is a plan view of the circuit board, and FIG. FIG. 4 shows a modified example, and is a plan view showing a state in which a green sheet is provided with marks made of mobriden or the like. 1, 13... Ceramic board, 2... Optical sensor, 4, 5, 6, 14... Mark, 7... Wiring pattern, 10... IC, 11... Circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板本体の表面に配線パターンを設け、各種電
子部品等を搭載して形成される回路基板に於て、
前記基板本体に電子部品の位置決め用モークを刻
設したことを特徴とする回路基板。
In circuit boards formed by providing wiring patterns on the surface of the board body and mounting various electronic components,
A circuit board characterized in that a mold for positioning electronic components is carved into the board body.
JP1989112147U 1989-09-26 1989-09-26 Circuit board Expired - Lifetime JPH075650Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989112147U JPH075650Y2 (en) 1989-09-26 1989-09-26 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989112147U JPH075650Y2 (en) 1989-09-26 1989-09-26 Circuit board

Publications (2)

Publication Number Publication Date
JPH0351864U true JPH0351864U (en) 1991-05-20
JPH075650Y2 JPH075650Y2 (en) 1995-02-08

Family

ID=31660598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989112147U Expired - Lifetime JPH075650Y2 (en) 1989-09-26 1989-09-26 Circuit board

Country Status (1)

Country Link
JP (1) JPH075650Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6214760U (en) * 1985-07-10 1987-01-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6214760U (en) * 1985-07-10 1987-01-29

Also Published As

Publication number Publication date
JPH075650Y2 (en) 1995-02-08

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