JPH0381633U - - Google Patents

Info

Publication number
JPH0381633U
JPH0381633U JP1989143680U JP14368089U JPH0381633U JP H0381633 U JPH0381633 U JP H0381633U JP 1989143680 U JP1989143680 U JP 1989143680U JP 14368089 U JP14368089 U JP 14368089U JP H0381633 U JPH0381633 U JP H0381633U
Authority
JP
Japan
Prior art keywords
nozzle
outer lead
suction device
synthetic resin
grounding body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989143680U
Other languages
English (en)
Other versions
JP2514798Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989143680U priority Critical patent/JP2514798Y2/ja
Publication of JPH0381633U publication Critical patent/JPH0381633U/ja
Application granted granted Critical
Publication of JP2514798Y2 publication Critical patent/JP2514798Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
図は本考案の実施例を示すものであつて、第１
図は吸着装置の斜視図、第２図はボンデイング中
の断面図、第３図は他の実施例の斜視図、第４図
は更に他の実施例の斜視図、第５図はボンデイン
グ中の断面図、第６図は更に他の実施例の斜視図
である。 Ａ，Ｂ，Ｃ，Ｄ……吸着装置、Ｐ……半導体チ
ツプ、Ｌ……アウターリード、１，１１……ノズ
ル、２，６，１２，１６……接地体。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) ノズルの下端部に、このノズルに吸着され
    た半導体チツプの側方に延出する合成樹脂アウタ
    ーリードの上面に接地して、このアウターリード
    の姿勢を規正する接地体を設けたことを特徴とす
    る半導体チツプの吸着装置。 (2) ノズルの下端部に、このノズルに吸着され
    た半導体チツプの側方に延出する合成樹脂製アウ
    ターリードの上面に接地して、このアウターリー
    ドを吸着する接地体を設けたことを特徴とする半
    導体チツプの吸着装置。
JP1989143680U 1989-12-13 1989-12-13 半導体チップの吸着装置 Expired - Fee Related JP2514798Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989143680U JP2514798Y2 (ja) 1989-12-13 1989-12-13 半導体チップの吸着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989143680U JP2514798Y2 (ja) 1989-12-13 1989-12-13 半導体チップの吸着装置

Publications (2)

Publication Number Publication Date
JPH0381633U true JPH0381633U (ja) 1991-08-21
JP2514798Y2 JP2514798Y2 (ja) 1996-10-23

Family

ID=31690437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989143680U Expired - Fee Related JP2514798Y2 (ja) 1989-12-13 1989-12-13 半導体チップの吸着装置

Country Status (1)

Country Link
JP (1) JP2514798Y2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073839A (ja) * 2004-09-03 2006-03-16 Oki Electric Ind Co Ltd 半導体素子保持装置およびそれを用いて製造した半導体装置
JP2013149823A (ja) * 2012-01-20 2013-08-01 Panasonic Corp 吸着ノズル及び部品実装装置
JP2019096641A (ja) * 2017-11-17 2019-06-20 浜松ホトニクス株式会社 吸着方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4735964U (ja) * 1971-05-17 1972-12-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4735964U (ja) * 1971-05-17 1972-12-21

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073839A (ja) * 2004-09-03 2006-03-16 Oki Electric Ind Co Ltd 半導体素子保持装置およびそれを用いて製造した半導体装置
JP4541807B2 (ja) * 2004-09-03 2010-09-08 Ｏｋｉセミコンダクタ株式会社 半導体素子保持装置および半導体素子の搬送方法
JP2013149823A (ja) * 2012-01-20 2013-08-01 Panasonic Corp 吸着ノズル及び部品実装装置
JP2019096641A (ja) * 2017-11-17 2019-06-20 浜松ホトニクス株式会社 吸着方法
US11947140B2 (en) 2017-11-17 2024-04-02 Hamamatsu Photonics K.K. Suctioning method

Also Published As

Publication number Publication date
JP2514798Y2 (ja) 1996-10-23

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees