JPH0477264U - - Google Patents
Info
- Publication number
- JPH0477264U JPH0477264U JP12151190U JP12151190U JPH0477264U JP H0477264 U JPH0477264 U JP H0477264U JP 12151190 U JP12151190 U JP 12151190U JP 12151190 U JP12151190 U JP 12151190U JP H0477264 U JPH0477264 U JP H0477264U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- integrated circuit
- circuit device
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂはそれぞれ本考案の一実施例の正
面図および側面図、第２図は従来の樹脂封止型集
積回路装置の正面図である。 １……樹脂封止体、２，４……リード、３……
はんだ付け部。
面図および側面図、第２図は従来の樹脂封止型集
積回路装置の正面図である。 １……樹脂封止体、２，４……リード、３……
はんだ付け部。
Claims (1)
- 外装の樹脂封止体の下面からリードが外部に引
出されていることを特徴とする樹脂封止型集積回
路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12151190U JPH0477264U (ja) | 1990-11-20 | 1990-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12151190U JPH0477264U (ja) | 1990-11-20 | 1990-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0477264U true JPH0477264U (ja) | 1992-07-06 |
Family
ID=31869364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12151190U Pending JPH0477264U (ja) | 1990-11-20 | 1990-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0477264U (ja) |
-
1990
- 1990-11-20 JP JP12151190U patent/JPH0477264U/ja active Pending