JPS63119241U - - Google Patents
Info
- Publication number
- JPS63119241U JPS63119241U JP1099687U JP1099687U JPS63119241U JP S63119241 U JPS63119241 U JP S63119241U JP 1099687 U JP1099687 U JP 1099687U JP 1099687 U JP1099687 U JP 1099687U JP S63119241 U JPS63119241 U JP S63119241U
- Authority
- JP
- Japan
- Prior art keywords
- heater block
- lead
- holding member
- lead frame
- land portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Description
第１図並びに第２図は、本考案に係る半導体製
造装置の一実施例を示すもので、第１図は縦断側
面図、第２図は第１図の一部を省略した平面図、
第３図並びに第４図は、リードフレームの一例を
示す図面で、第３図は平面図、第４図は第３図の
―線に沿う断面図である。第５図並びに第６
図は、従来の半導体製造装置を示すもので、第５
図は縦断側面図、第６図は第５図の平面図である
。 １……リードフレーム、３……ランド部、４…
…リード、１０……半導体ペレツト、２０′……
ヒータブロツク、３０……押え部材、５０……保
持部材。
造装置の一実施例を示すもので、第１図は縦断側
面図、第２図は第１図の一部を省略した平面図、
第３図並びに第４図は、リードフレームの一例を
示す図面で、第３図は平面図、第４図は第３図の
―線に沿う断面図である。第５図並びに第６
図は、従来の半導体製造装置を示すもので、第５
図は縦断側面図、第６図は第５図の平面図である
。 １……リードフレーム、３……ランド部、４…
…リード、１０……半導体ペレツト、２０′……
ヒータブロツク、３０……押え部材、５０……保
持部材。
Claims (1)
- 【実用新案登録請求の範囲】 半導体ペレツトがマウントされるランド部をリ
ードより低い位置に形成したリードフレームをヒ
ータブロツク上に位置決め載置し、上記リードフ
レームのリードの先端近傍と、ランド部の基端側
とを押え部材によりヒータブロツク上に固定し、
上記半導体ペレツトのボンデイングパツドと上記
リードの先端とを超音波振動によりワイヤボンデ
イングする装置において、 上記ヒータブロツクの上面に載置したリードフ
レームのリードと、ヒータブロツク上面との間に
、先端下面に上記ランド部の周縁と当接するテー
パ面を有する保持部材を往復動により退入自在に
設けたことを特徴とする半導体製造装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1099687U JPS63119241U (ja) | 1987-01-27 | 1987-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1099687U JPS63119241U (ja) | 1987-01-27 | 1987-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63119241U true JPS63119241U (ja) | 1988-08-02 |
Family
ID=30797812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1099687U Pending JPS63119241U (ja) | 1987-01-27 | 1987-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63119241U (ja) |
-
1987
- 1987-01-27 JP JP1099687U patent/JPS63119241U/ja active Pending