JPH032640U - - Google Patents
Info
- Publication number
- JPH032640U JPH032640U JP6339589U JP6339589U JPH032640U JP H032640 U JPH032640 U JP H032640U JP 6339589 U JP6339589 U JP 6339589U JP 6339589 U JP6339589 U JP 6339589U JP H032640 U JPH032640 U JP H032640U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- lead
- semiconductor
- semiconductor pellet
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000008188 pellet Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例に係る半導体装置の
一部破断斜視図、第２図は同実施例半導体装置の
一部破断拡大平面図、第３図は同実施例半導体装
置の要部拡大断面図、第４図は従来の半導体装置
の一部破断斜視図、第５図は従来の半導体装置の
一部破断拡大平面図である。 １……半導体ペレツト、１ａ……電極、２……
ペレツトマウント部、６……リード、６ａ……リ
ード端面、７……凹部。
一部破断斜視図、第２図は同実施例半導体装置の
一部破断拡大平面図、第３図は同実施例半導体装
置の要部拡大断面図、第４図は従来の半導体装置
の一部破断斜視図、第５図は従来の半導体装置の
一部破断拡大平面図である。 １……半導体ペレツト、１ａ……電極、２……
ペレツトマウント部、６……リード、６ａ……リ
ード端面、７……凹部。
Claims (1)
- 【実用新案登録請求の範囲】 ペレツトマウント部にマウントされた半導体ペ
レツトの電極と、一端が半導体ペレツト近傍に配
置されたリードとをワイヤボンデイングし、畔導
体ペレツト、リード基部を含む主要部分を樹脂被
覆してなる半導体装置において、 上記リードは一端部が半導体ペレツトの上面よ
り上方に位置しかつ半導体ペレツト上面と平行に
延び、その端面にワイヤをガイドする凹部を成形
したことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6339589U JPH032640U (ja) | 1989-05-30 | 1989-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6339589U JPH032640U (ja) | 1989-05-30 | 1989-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032640U true JPH032640U (ja) | 1991-01-11 |
Family
ID=31593403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6339589U Pending JPH032640U (ja) | 1989-05-30 | 1989-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032640U (ja) |
-
1989
- 1989-05-30 JP JP6339589U patent/JPH032640U/ja active Pending