JPH01121929U - - Google Patents
Info
- Publication number
- JPH01121929U JPH01121929U JP1988017865U JP1786588U JPH01121929U JP H01121929 U JPH01121929 U JP H01121929U JP 1988017865 U JP1988017865 U JP 1988017865U JP 1786588 U JP1786588 U JP 1786588U JP H01121929 U JPH01121929 U JP H01121929U
- Authority
- JP
- Japan
- Prior art keywords
- wedge
- wire
- view
- bonding
- thin metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第1図は本考案にかかるウエツジの斜視図、第
2図は、本考案にかかるウエツジによりワイヤボ
ンデイングを行つている状態の正面図、第3図は
第2図A―A線断面図、第4図は本考案にかかる
ウエツジによりボンデイングされたワイヤの部分
平面図である。第5図はリードフレームのペレツ
トマウント部にマウントした半導体ペレツトとリ
ードとをワイヤボンデイングした半導体装置の一
具体例を示す要部正面図、第6図と第7図はワイ
ヤボンデイング装置の構成部品であるウエツジの
正面図と側面図、第8図はウエツジによりボンデ
イングされたワイヤの要部正面図である。 4……金属細線(ワイヤ)、6……ウエツジ、
6a……溝部、6c……突起部、B……ボンデイ
ング面。
2図は、本考案にかかるウエツジによりワイヤボ
ンデイングを行つている状態の正面図、第3図は
第2図A―A線断面図、第4図は本考案にかかる
ウエツジによりボンデイングされたワイヤの部分
平面図である。第5図はリードフレームのペレツ
トマウント部にマウントした半導体ペレツトとリ
ードとをワイヤボンデイングした半導体装置の一
具体例を示す要部正面図、第6図と第7図はワイ
ヤボンデイング装置の構成部品であるウエツジの
正面図と側面図、第8図はウエツジによりボンデ
イングされたワイヤの要部正面図である。 4……金属細線(ワイヤ)、6……ウエツジ、
6a……溝部、6c……突起部、B……ボンデイ
ング面。
Claims (1)
- 【実用新案登録請求の範囲】 下端面に金属細線をガイドする溝部を有し、金
属細線をボンデイング面に押し付けて加圧・振動
させワイヤボンデイングするウエツジにおいて、 上記溝部の上底面の中間部に突起部を形成した
ことを特徴とするワイヤボンデイング用ウエツジ
。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988017865U JPH01121929U (ja) | 1988-02-13 | 1988-02-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988017865U JPH01121929U (ja) | 1988-02-13 | 1988-02-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01121929U true JPH01121929U (ja) | 1989-08-18 |
Family
ID=31232018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988017865U Pending JPH01121929U (ja) | 1988-02-13 | 1988-02-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01121929U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014116334A (ja) * | 2012-12-06 | 2014-06-26 | Mitsubishi Electric Corp | ウェッジボンディング用ツール、及びウェッジボンディング方法 |
WO2019155547A1 (ja) * | 2018-02-07 | 2019-08-15 | 三菱電機株式会社 | ウェッジツール、ボンディング装置、および、ボンディング検査方法 |
-
1988
- 1988-02-13 JP JP1988017865U patent/JPH01121929U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014116334A (ja) * | 2012-12-06 | 2014-06-26 | Mitsubishi Electric Corp | ウェッジボンディング用ツール、及びウェッジボンディング方法 |
WO2019155547A1 (ja) * | 2018-02-07 | 2019-08-15 | 三菱電機株式会社 | ウェッジツール、ボンディング装置、および、ボンディング検査方法 |
JPWO2019155547A1 (ja) * | 2018-02-07 | 2020-05-07 | 三菱電機株式会社 | ウェッジツール、ボンディング装置、および、ボンディング検査方法 |