JPS62140742U - - Google Patents

Info

Publication number
JPS62140742U
JPS62140742U JP1986028407U JP2840786U JPS62140742U JP S62140742 U JPS62140742 U JP S62140742U JP 1986028407 U JP1986028407 U JP 1986028407U JP 2840786 U JP2840786 U JP 2840786U JP S62140742 U JPS62140742 U JP S62140742U
Authority
JP
Japan
Prior art keywords
semiconductor device
mounting structure
protrusion
substrate
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986028407U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986028407U priority Critical patent/JPS62140742U/ja
Publication of JPS62140742U publication Critical patent/JPS62140742U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

Description

【図面の簡単な説明】
第１図ａは本考案の半導体装置の取付構造の一
実施例を示す平面図、第１図ｂは同図ａのＡ―Ａ
′線断面図、第２図は本考案の他の実施例を示す
平面図、第３図は本考案のその他の実施例を示す
断面図、第４図ａ，ｂ，ｃは半導体装置のダイボ
ンデイング工程を説明するための概略図である。 １：被着基板、２：熱硬化性樹脂ペースト、３
：半導体装置、６：突起部。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 半導体装置を熱硬化性樹脂ペーストを用い
    て被着基板上に接着する半導体装置の取付構造に
    おいて、前記半導体装置を平行に維持できるよう
    に前記被着基板上に突起部を設けたことを特徴と
    する半導体装置の取付構造。 (2) 前記突起部は断面略半球状に形成されてい
    ることを特徴とする実用新案登録請求の範囲第１
    項に記載の半導体装置の取付構造。
JP1986028407U 1986-02-27 1986-02-27 Pending JPS62140742U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986028407U JPS62140742U (ja) 1986-02-27 1986-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986028407U JPS62140742U (ja) 1986-02-27 1986-02-27

Publications (1)

Publication Number Publication Date
JPS62140742U true JPS62140742U (ja) 1987-09-05

Family

ID=30831339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986028407U Pending JPS62140742U (ja) 1986-02-27 1986-02-27

Country Status (1)

Country Link
JP (1) JPS62140742U (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH118335A (ja) * 1997-02-17 1999-01-12 Anam Ind Co Inc 回路基板及びその製造方法とこれを用いた半導体パッケージの製造方法
JP2006332686A (ja) * 2006-07-03 2006-12-07 Matsushita Electric Ind Co Ltd 固体撮像装置
JP2009087964A (ja) * 2007-09-27 2009-04-23 Kyocera Corp 電子部品
JP6068645B2 (ja) * 2013-07-30 2017-01-25 京セラ株式会社 配線基板および電子装置
JP2017199762A (ja) * 2016-04-26 2017-11-02 京セラ株式会社 印刷配線板およびその製造方法
JP2018107181A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 電子装置および電子モジュール
JPWO2020175619A1 (ja) * 2019-02-28 2021-12-16 京セラ株式会社 電子部品搭載用パッケージ、電子装置及び発光装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50109676A (ja) * 1974-02-04 1975-08-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50109676A (ja) * 1974-02-04 1975-08-28

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH118335A (ja) * 1997-02-17 1999-01-12 Anam Ind Co Inc 回路基板及びその製造方法とこれを用いた半導体パッケージの製造方法
JP2006332686A (ja) * 2006-07-03 2006-12-07 Matsushita Electric Ind Co Ltd 固体撮像装置
JP2009087964A (ja) * 2007-09-27 2009-04-23 Kyocera Corp 電子部品
JP6068645B2 (ja) * 2013-07-30 2017-01-25 京セラ株式会社 配線基板および電子装置
JPWO2015016289A1 (ja) * 2013-07-30 2017-03-02 京セラ株式会社 配線基板および電子装置
JP2017199762A (ja) * 2016-04-26 2017-11-02 京セラ株式会社 印刷配線板およびその製造方法
JP2018107181A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 電子装置および電子モジュール
JPWO2020175619A1 (ja) * 2019-02-28 2021-12-16 京セラ株式会社 電子部品搭載用パッケージ、電子装置及び発光装置

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