JPH0380348B2 - - Google Patents

Info

Publication number
JPH0380348B2
JPH0380348B2 JP60257425A JP25742585A JPH0380348B2 JP H0380348 B2 JPH0380348 B2 JP H0380348B2 JP 60257425 A JP60257425 A JP 60257425A JP 25742585 A JP25742585 A JP 25742585A JP H0380348 B2 JPH0380348 B2 JP H0380348B2
Authority
JP
Japan
Prior art keywords
cap
organic resin
adhesive
film
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60257425A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62117349A (ja
Inventor
Yoshitaka Ono
Hajime Yatsu
Keiji Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP60257425A priority Critical patent/JPS62117349A/ja
Publication of JPS62117349A publication Critical patent/JPS62117349A/ja
Publication of JPH0380348B2 publication Critical patent/JPH0380348B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/12—
    • H10W76/60—
    • H10W72/07551—
    • H10W72/50—
    • H10W90/754—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP60257425A 1985-11-16 1985-11-16 電子部品封止用キヤツプとその製造方法 Granted JPS62117349A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60257425A JPS62117349A (ja) 1985-11-16 1985-11-16 電子部品封止用キヤツプとその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60257425A JPS62117349A (ja) 1985-11-16 1985-11-16 電子部品封止用キヤツプとその製造方法

Publications (2)

Publication Number Publication Date
JPS62117349A JPS62117349A (ja) 1987-05-28
JPH0380348B2 true JPH0380348B2 (enExample) 1991-12-24

Family

ID=17306188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60257425A Granted JPS62117349A (ja) 1985-11-16 1985-11-16 電子部品封止用キヤツプとその製造方法

Country Status (1)

Country Link
JP (1) JPS62117349A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6165816A (en) * 1996-06-13 2000-12-26 Nikko Company Fabrication of electronic components having a hollow package structure with a ceramic lid

Also Published As

Publication number Publication date
JPS62117349A (ja) 1987-05-28

Similar Documents

Publication Publication Date Title
US7501309B2 (en) Standoffs for centralizing internals in packaging process
US5717252A (en) Solder-ball connected semiconductor device with a recessed chip mounting area
US5286679A (en) Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer
JPH04277636A (ja) 半導体装置とその製造方法及びこれに用いる接合体
JPH04260358A (ja) 電子装置及びその製造方法
US6650005B2 (en) Micro BGA package
JP4508396B2 (ja) チップ型半導体装置及びその製造方法
JPH01161724A (ja) 表面実装用半導体装置の製造方法
JPH0380348B2 (enExample)
JPH0358541B2 (enExample)
WO1996013066A1 (en) Method of attaching integrated circuit dies by rolling adhesives onto semiconductor wafers
JPS629728Y2 (enExample)
JPH04302457A (ja) 混成集積回路基板の製造方法
JP3707639B2 (ja) エリアアレイパッケージ型半導体装置の構造
JP2570123B2 (ja) 半導体装置及びその製造方法
CN101350335B (zh) 开窗型球栅阵列半导体封装件及其应用的网板结构
JP3956530B2 (ja) 集積回路の製造方法
TW567564B (en) Semiconductor package having a die carrier to prevent delamination and method for fabricating the package
JPH0691162B2 (ja) 電子部品封止用キヤツプとその製造方法
JPH1050882A (ja) チップキャリア並びにその製造装置及び製造方法
JP4679991B2 (ja) 半導体装置
JPH0828436B2 (ja) 気密封止型半導体装置の製造方法
JPS6240754A (ja) ピングリッドアレイ
JP3711311B2 (ja) 半導体装置の製造方法
JPS62249461A (ja) 樹脂封止型半導体装置