JPH0376795B2 - - Google Patents

Info

Publication number
JPH0376795B2
JPH0376795B2 JP60013052A JP1305285A JPH0376795B2 JP H0376795 B2 JPH0376795 B2 JP H0376795B2 JP 60013052 A JP60013052 A JP 60013052A JP 1305285 A JP1305285 A JP 1305285A JP H0376795 B2 JPH0376795 B2 JP H0376795B2
Authority
JP
Japan
Prior art keywords
recess
metal plate
plating film
mounting
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60013052A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61172393A (ja
Inventor
Hajime Yatsu
Katsumi Mabuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP60013052A priority Critical patent/JPS61172393A/ja
Publication of JPS61172393A publication Critical patent/JPS61172393A/ja
Publication of JPH0376795B2 publication Critical patent/JPH0376795B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/682—
    • H10W72/884—
    • H10W74/00—

Landscapes

  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP60013052A 1985-01-26 1985-01-26 電子部品搭載用基板およびその製造方法 Granted JPS61172393A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60013052A JPS61172393A (ja) 1985-01-26 1985-01-26 電子部品搭載用基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60013052A JPS61172393A (ja) 1985-01-26 1985-01-26 電子部品搭載用基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPS61172393A JPS61172393A (ja) 1986-08-04
JPH0376795B2 true JPH0376795B2 (cg-RX-API-DMAC10.html) 1991-12-06

Family

ID=11822356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60013052A Granted JPS61172393A (ja) 1985-01-26 1985-01-26 電子部品搭載用基板およびその製造方法

Country Status (1)

Country Link
JP (1) JPS61172393A (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2520429B2 (ja) * 1987-10-27 1996-07-31 松下電工株式会社 電子部品実装用プリント配線板
JPH0379440U (cg-RX-API-DMAC10.html) * 1989-12-01 1991-08-13
JP4856470B2 (ja) * 2006-05-18 2012-01-18 日本特殊陶業株式会社 配線基板
JP2010258260A (ja) * 2009-04-27 2010-11-11 Nec Corp 放熱プリント基板
JP6138500B2 (ja) * 2013-01-30 2017-05-31 株式会社 日立パワーデバイス パワー半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946087A (ja) * 1982-09-09 1984-03-15 イビデン株式会社 プリント配線基板
JPS5946086A (ja) * 1982-09-09 1984-03-15 イビデン株式会社 プリント配線基板とその製造方法
JPS5967686A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板とその製造方法
JPS5967687A (ja) * 1982-10-12 1984-04-17 イビデン株式会社 プリント配線基板

Also Published As

Publication number Publication date
JPS61172393A (ja) 1986-08-04

Similar Documents

Publication Publication Date Title
US5631497A (en) Film carrier tape and laminated multi-chip semiconductor device incorporating the same
EP0681422B1 (en) A printed wire board assembly
JPH0378795B2 (cg-RX-API-DMAC10.html)
JPH03152985A (ja) 電子部品搭載用基板
JP2784522B2 (ja) 電子部品搭載用基板及びその製造法
JPH09213848A (ja) 電子部品のヒートシンク
JPH0376795B2 (cg-RX-API-DMAC10.html)
JPH0420279B2 (cg-RX-API-DMAC10.html)
JPH0446478B2 (cg-RX-API-DMAC10.html)
JP2784524B2 (ja) 多層電子部品搭載用基板及びその製造法
JPH0358552B2 (cg-RX-API-DMAC10.html)
JPH0263141A (ja) 電子部品搭載用基板の製造方法
JPH0358551B2 (cg-RX-API-DMAC10.html)
JPS6134989A (ja) 電子部品搭載用基板
JP2753761B2 (ja) 電子部品搭載用基板及びその製造方法
JPH04142068A (ja) 電子部品搭載用基板及びその製造方法
JP2795280B2 (ja) 電子部品搭載用基板
JPH056714Y2 (cg-RX-API-DMAC10.html)
JPS6165490A (ja) 電子部品搭載用基板の製造方法
JPH039341Y2 (cg-RX-API-DMAC10.html)
JP2784521B2 (ja) 多層電子部品塔載用基板及びその製造法
JP3036484B2 (ja) 半導体装置とその製造方法
JPH10294393A (ja) 半導体パッケージ
US7827679B1 (en) Thermal management circuit board and methods of producing the same
JPH0360191B2 (cg-RX-API-DMAC10.html)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term