JPH0376779B2 - - Google Patents

Info

Publication number
JPH0376779B2
JPH0376779B2 JP59237220A JP23722084A JPH0376779B2 JP H0376779 B2 JPH0376779 B2 JP H0376779B2 JP 59237220 A JP59237220 A JP 59237220A JP 23722084 A JP23722084 A JP 23722084A JP H0376779 B2 JPH0376779 B2 JP H0376779B2
Authority
JP
Japan
Prior art keywords
resin
pot
tablet
molding
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59237220A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61115330A (ja
Inventor
Hideto Suzuki
Ryoichi Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP59237220A priority Critical patent/JPS61115330A/ja
Publication of JPS61115330A publication Critical patent/JPS61115330A/ja
Publication of JPH0376779B2 publication Critical patent/JPH0376779B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59237220A 1984-11-10 1984-11-10 半導体装置の製造方法 Granted JPS61115330A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59237220A JPS61115330A (ja) 1984-11-10 1984-11-10 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59237220A JPS61115330A (ja) 1984-11-10 1984-11-10 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61115330A JPS61115330A (ja) 1986-06-02
JPH0376779B2 true JPH0376779B2 (OSRAM) 1991-12-06

Family

ID=17012158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59237220A Granted JPS61115330A (ja) 1984-11-10 1984-11-10 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61115330A (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2592753B2 (ja) * 1992-09-18 1997-03-19 日東電工株式会社 半導体封止用樹脂タブレット
US6173490B1 (en) * 1997-08-20 2001-01-16 National Semiconductor Corporation Method for forming a panel of packaged integrated circuits
JP2014086609A (ja) * 2012-10-25 2014-05-12 Renesas Electronics Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS61115330A (ja) 1986-06-02

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