JPH0375550U - - Google Patents
Info
- Publication number
- JPH0375550U JPH0375550U JP13571089U JP13571089U JPH0375550U JP H0375550 U JPH0375550 U JP H0375550U JP 13571089 U JP13571089 U JP 13571089U JP 13571089 U JP13571089 U JP 13571089U JP H0375550 U JPH0375550 U JP H0375550U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component module
- semiconductor element
- board
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図はこの考案による電子部品モジユールの
一実施例を示した斜視図、第２図は同モジユール
の断面図である。
図中、１……金属ベース基板、２……金属上蓋
、３……外部端子、４……回路を構成する電子部
品、５……電子部品を固着している樹脂、６……
制御基板、７……支持部材、８……半導体素子（
中央演算処理回路）である。
FIG. 1 is a perspective view showing an embodiment of an electronic component module according to this invention, and FIG. 2 is a sectional view of the module. In the figure, 1...metal base board, 2...metal top cover, 3...external terminal, 4...electronic components forming the circuit, 5...resin fixing the electronic components, 6...
Control board, 7... Support member, 8... Semiconductor element (
central processing circuit).
Claims (1)
属ベース基板と、それを覆うべく凹状にした金属
上蓋とから成る電子部品モジユールにおいて、前
記基板を制御する半導体素子を備えた配線基板を
前記電子回路金属ベース基板上に支持部材をもつ
て保持し、前記半導体素子の上面が、前記金属上
蓋の内面に接するようにしたことを特徴とする電
子部品モジユール。 In an electronic component module consisting of an electronic circuit metal base board on which components that generate heat during operation are mounted, and a concave metal top cover to cover it, a wiring board equipped with a semiconductor element that controls the board is mounted on the electronic circuit metal base. An electronic component module, characterized in that the electronic component module is held on a substrate with a support member, and the upper surface of the semiconductor element is in contact with the inner surface of the metal upper lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13571089U JPH0375550U (en) | 1989-11-22 | 1989-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13571089U JPH0375550U (en) | 1989-11-22 | 1989-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375550U true JPH0375550U (en) | 1991-07-29 |
Family
ID=31682958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13571089U Pending JPH0375550U (en) | 1989-11-22 | 1989-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375550U (en) |
-
1989
- 1989-11-22 JP JP13571089U patent/JPH0375550U/ja active Pending