JPH04760U - - Google Patents
Info
- Publication number
- JPH04760U JPH04760U JP3973890U JP3973890U JPH04760U JP H04760 U JPH04760 U JP H04760U JP 3973890 U JP3973890 U JP 3973890U JP 3973890 U JP3973890 U JP 3973890U JP H04760 U JPH04760 U JP H04760U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component module
- power circuit
- input
- output terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図は本考案による電子部品モジユールの斜
視図、第２図は同電子部品モジユールの断面図、
第３図は従来の電子部品モジユールの斜視図であ
る。
図中、１……パワー素子金属ベース基板、２…
…パワー素子、３……制御素子基板、４……制御
素子、５……金属上蓋、６……パワー回路入出力
端子、７……合成樹脂、８……制御回路入出力端
子、９……端子板である。
FIG. 1 is a perspective view of an electronic component module according to the present invention, FIG. 2 is a sectional view of the same electronic component module,
FIG. 3 is a perspective view of a conventional electronic component module. In the figure, 1... power element metal base substrate, 2...
...Power element, 3... Control element board, 4... Control element, 5... Metal top cover, 6... Power circuit input/output terminal, 7... Synthetic resin, 8... Control circuit input/output terminal, 9... It is a terminal board.
Claims (1)
を実装した金属ベース基板と、それらを覆うべく
凹状にした金属上蓋とから成る電子部品モジユー
ルにおいて、前記パワー回路の入出力端子を前記
電子部品モジユールの側面に設置し、前記制御回
路の入出力端子は前記金属上蓋の上部に設けたこ
とを特徴とする電子部品モジユール。 In an electronic component module consisting of a metal base board on which a power circuit and a control circuit for controlling the power circuit are mounted, and a metal top lid formed in a concave shape to cover them, the input/output terminals of the power circuit are connected to a side surface of the electronic component module. An electronic component module, characterized in that the input/output terminals of the control circuit are provided at the upper part of the metal top cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3973890U JPH04760U (en) | 1990-04-13 | 1990-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3973890U JPH04760U (en) | 1990-04-13 | 1990-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04760U true JPH04760U (en) | 1992-01-07 |
Family
ID=31548911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3973890U Pending JPH04760U (en) | 1990-04-13 | 1990-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04760U (en) |
-
1990
- 1990-04-13 JP JP3973890U patent/JPH04760U/ja active Pending