JPH0374514B2 - - Google Patents

Info

Publication number
JPH0374514B2
JPH0374514B2 JP60103664A JP10366485A JPH0374514B2 JP H0374514 B2 JPH0374514 B2 JP H0374514B2 JP 60103664 A JP60103664 A JP 60103664A JP 10366485 A JP10366485 A JP 10366485A JP H0374514 B2 JPH0374514 B2 JP H0374514B2
Authority
JP
Japan
Prior art keywords
superconducting
insulator
contact hole
etching
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60103664A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61263181A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60103664A priority Critical patent/JPS61263181A/ja
Publication of JPS61263181A publication Critical patent/JPS61263181A/ja
Publication of JPH0374514B2 publication Critical patent/JPH0374514B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
JP60103664A 1985-05-17 1985-05-17 超電導線路の形成方法 Granted JPS61263181A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60103664A JPS61263181A (ja) 1985-05-17 1985-05-17 超電導線路の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60103664A JPS61263181A (ja) 1985-05-17 1985-05-17 超電導線路の形成方法

Publications (2)

Publication Number Publication Date
JPS61263181A JPS61263181A (ja) 1986-11-21
JPH0374514B2 true JPH0374514B2 (enrdf_load_stackoverflow) 1991-11-27

Family

ID=14360051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60103664A Granted JPS61263181A (ja) 1985-05-17 1985-05-17 超電導線路の形成方法

Country Status (1)

Country Link
JP (1) JPS61263181A (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817689A (ja) * 1981-07-24 1983-02-01 Fujitsu Ltd ジヨセフソン回路の製造方法
JPS605235A (ja) * 1983-06-23 1985-01-11 井関農機株式会社 穀粒供給装置

Also Published As

Publication number Publication date
JPS61263181A (ja) 1986-11-21

Similar Documents

Publication Publication Date Title
US4172004A (en) Method for forming dense dry etched multi-level metallurgy with non-overlapped vias
US4554567A (en) Superconductive integrated circuit incorporating a magnetically controlled interferometer
US5897367A (en) Low inductance superconductive integrated circuit
US4289834A (en) Dense dry etched multi-level metallurgy with non-overlapped vias
JPH0774250A (ja) コンタクトホール形成方法
KR900001834B1 (ko) 반도체장치의 제조방법
KR100435137B1 (ko) 두꺼운도체를갖는모노리식마이크로파집적회로를제조하는방법
US4176029A (en) Subminiature bore and conductor formation
US4263603A (en) Subminiature bore and conductor formation
JPH05102547A (ja) ジヨセフソン集積回路装置の製造方法
JPS6146081A (ja) ジヨセフソン接合素子の製造方法
JPH0766462A (ja) 超伝導回路
JPH0374514B2 (enrdf_load_stackoverflow)
JP2938341B2 (ja) 同軸構造の配線の形成方法
KR950006343B1 (ko) 반도체 장치의 제조방법
US4797375A (en) Fabrication of metal interconnect for semiconductor device
JP2563180B2 (ja) 半導体装置の製造方法
JPH0376791B2 (enrdf_load_stackoverflow)
JPS6260241A (ja) 多層配線構造の製造方法
JPS5979585A (ja) ジヨセフソン接合素子とその製造方法
US4979012A (en) Semiconductor device with bonding pad contacts
KR100361210B1 (ko) 반도체 소자의 콘택홀 형성방법
JP2000012683A (ja) 集積回路とその製造方法
JPS61244078A (ja) 超伝導線路の作製方法
JPS58147183A (ja) ジヨセフソン集積回路の製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term