JPH0370373B2 - - Google Patents

Info

Publication number
JPH0370373B2
JPH0370373B2 JP56133372A JP13337281A JPH0370373B2 JP H0370373 B2 JPH0370373 B2 JP H0370373B2 JP 56133372 A JP56133372 A JP 56133372A JP 13337281 A JP13337281 A JP 13337281A JP H0370373 B2 JPH0370373 B2 JP H0370373B2
Authority
JP
Japan
Prior art keywords
lead frame
plating
semiconductor element
layer
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56133372A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5834930A (ja
Inventor
Yoshio Ito
Mitsuo Kobayashi
Toshio Tetsuya
Osamu Usuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56133372A priority Critical patent/JPS5834930A/ja
Publication of JPS5834930A publication Critical patent/JPS5834930A/ja
Publication of JPH0370373B2 publication Critical patent/JPH0370373B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/417—
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/42—Servomotor, servo controller kind till VSS
    • G05B2219/42268—Safety, excess in error
    • H10W72/075—
    • H10W72/07532—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5522—
    • H10W72/59—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP56133372A 1981-08-27 1981-08-27 半導体装置の製造方法 Granted JPS5834930A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56133372A JPS5834930A (ja) 1981-08-27 1981-08-27 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56133372A JPS5834930A (ja) 1981-08-27 1981-08-27 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5834930A JPS5834930A (ja) 1983-03-01
JPH0370373B2 true JPH0370373B2 (enExample) 1991-11-07

Family

ID=15103181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56133372A Granted JPS5834930A (ja) 1981-08-27 1981-08-27 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5834930A (enExample)

Also Published As

Publication number Publication date
JPS5834930A (ja) 1983-03-01

Similar Documents

Publication Publication Date Title
KR100381302B1 (ko) 반도체 장치 및 그 제조방법
JPH0612796B2 (ja) 半導体装置
JPS6050343B2 (ja) 半導体装置製造用リ−ドフレ−ム
US7329944B2 (en) Leadframe for semiconductor device
JPH0445985B2 (enExample)
JPH01257356A (ja) 半導体用リードフレーム
JPH0370373B2 (enExample)
JPH1074879A (ja) 半導体装置用リードフレーム
JPH0590465A (ja) 半導体装置
JPS61140160A (ja) 半導体用リ−ドフレ−ム
JP2858197B2 (ja) 半導体装置用リードフレーム
JPS60241241A (ja) 半導体装置
JPH03274755A (ja) 樹脂封止半導体装置とその製造方法
JPS5834929A (ja) 半導体装置の製造方法
JPS61139050A (ja) リ−ドフレ−ム
JPS607162A (ja) 半導体装置の製造方法
JPS639957A (ja) 半導体リ−ドフレ−ム
JPH06260577A (ja) 配線電極の被膜構造
JPS60149154A (ja) 半導体装置の製造方法
JPH10261749A (ja) 半導体装置
JPS60119765A (ja) 樹脂封止型半導体装置およびそれに用いるリ−ドフレ−ム
JPH0558259B2 (enExample)
JPS6050342B2 (ja) 半導体装置製造用リ−ドフレ−ム
JPH01115151A (ja) 半導体装置用リードフレーム
JPS5948545B2 (ja) 半導体装置用のリ−ド線