JPH0558259B2 - - Google Patents

Info

Publication number
JPH0558259B2
JPH0558259B2 JP59081058A JP8105884A JPH0558259B2 JP H0558259 B2 JPH0558259 B2 JP H0558259B2 JP 59081058 A JP59081058 A JP 59081058A JP 8105884 A JP8105884 A JP 8105884A JP H0558259 B2 JPH0558259 B2 JP H0558259B2
Authority
JP
Japan
Prior art keywords
wire
lead frame
bonding
atmosphere
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59081058A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60225450A (ja
Inventor
Shoji Shiga
Tooru Tanigawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP59081058A priority Critical patent/JPS60225450A/ja
Publication of JPS60225450A publication Critical patent/JPS60225450A/ja
Publication of JPH0558259B2 publication Critical patent/JPH0558259B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/04—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/015—
    • H10W72/075—
    • H10W72/07541—
    • H10W72/50—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP59081058A 1984-04-24 1984-04-24 半導体装置の製造法 Granted JPS60225450A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59081058A JPS60225450A (ja) 1984-04-24 1984-04-24 半導体装置の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59081058A JPS60225450A (ja) 1984-04-24 1984-04-24 半導体装置の製造法

Publications (2)

Publication Number Publication Date
JPS60225450A JPS60225450A (ja) 1985-11-09
JPH0558259B2 true JPH0558259B2 (enExample) 1993-08-26

Family

ID=13735801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59081058A Granted JPS60225450A (ja) 1984-04-24 1984-04-24 半導体装置の製造法

Country Status (1)

Country Link
JP (1) JPS60225450A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4771330A (en) * 1987-05-13 1988-09-13 Lsi Logic Corporation Wire bonds and electrical contacts of an integrated circuit device
JP2679158B2 (ja) * 1988-09-29 1997-11-19 日本電気株式会社 半導体装置の製造装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6022826B2 (ja) * 1977-08-22 1985-06-04 株式会社日立製作所 ボンデイングワイヤ
JPS54162471A (en) * 1978-06-13 1979-12-24 Nec Corp Semiconductor device
DE2923440A1 (de) * 1979-06-09 1980-12-11 Itt Ind Gmbh Deutsche Verfahren zum befestigen und/oder elektrischen verbinden von halbleiterkoerpern und/oder von deren elektrisch leitenden metallteilen
JPS5958833A (ja) * 1982-09-28 1984-04-04 Shinkawa Ltd 半導体装置

Also Published As

Publication number Publication date
JPS60225450A (ja) 1985-11-09

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