JPH0369138B2 - - Google Patents
Info
- Publication number
- JPH0369138B2 JPH0369138B2 JP59021760A JP2176084A JPH0369138B2 JP H0369138 B2 JPH0369138 B2 JP H0369138B2 JP 59021760 A JP59021760 A JP 59021760A JP 2176084 A JP2176084 A JP 2176084A JP H0369138 B2 JPH0369138 B2 JP H0369138B2
- Authority
- JP
- Japan
- Prior art keywords
- sample
- holding
- wafer
- support member
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 37
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000609 electron-beam lithography Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electron Beam Exposure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59021760A JPS60167245A (ja) | 1984-02-10 | 1984-02-10 | 試料保持装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59021760A JPS60167245A (ja) | 1984-02-10 | 1984-02-10 | 試料保持装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60167245A JPS60167245A (ja) | 1985-08-30 |
JPH0369138B2 true JPH0369138B2 (enrdf_load_stackoverflow) | 1991-10-31 |
Family
ID=12064019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59021760A Granted JPS60167245A (ja) | 1984-02-10 | 1984-02-10 | 試料保持装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60167245A (enrdf_load_stackoverflow) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0749789Y2 (ja) * | 1986-11-19 | 1995-11-13 | 富士通株式会社 | 電子ビ−ム露光装置 |
US4817556A (en) * | 1987-05-04 | 1989-04-04 | Varian Associates, Inc. | Apparatus for retaining wafers |
US6509564B1 (en) | 1998-04-20 | 2003-01-21 | Hitachi, Ltd. | Workpiece holder, semiconductor fabricating apparatus, semiconductor inspecting apparatus, circuit pattern inspecting apparatus, charged particle beam application apparatus, calibrating substrate, workpiece holding method, circuit pattern inspecting method, and charged particle beam application method |
EP2197027A3 (en) * | 2005-05-18 | 2017-04-26 | Murata Manufacturing Co., Ltd. | Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage |
JP6731668B2 (ja) * | 2016-08-08 | 2020-07-29 | 国立研究開発法人産業技術総合研究所 | 顕微鏡観察方法及び顕微鏡観察補助装置 |
-
1984
- 1984-02-10 JP JP59021760A patent/JPS60167245A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60167245A (ja) | 1985-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2001298072A (ja) | 静電吸着装置及びこれを用いた真空処理装置 | |
US5532903A (en) | Membrane electrostatic chuck | |
US3920233A (en) | Spherical support and translation device for wafers | |
JPH0828205B2 (ja) | ウエハ搬送装置 | |
US4711438A (en) | Mask holding | |
JPH07136885A (ja) | 真空チャック | |
JPH0369138B2 (enrdf_load_stackoverflow) | ||
ATE319185T1 (de) | Anordnung zum tragen eines substrates während eines angepassten schneidverfahrens | |
KR100508858B1 (ko) | 가공재료 진동 댐퍼 | |
JP3349572B2 (ja) | 薄板固定装置 | |
JPH07302831A (ja) | 共用試料ホールダ | |
JPH08313815A (ja) | 基板部材の位置決め保持装置 | |
JPH0729814A (ja) | マスク基板保持機構 | |
JPH04177856A (ja) | 試料固定装置 | |
US20020124964A1 (en) | Wafer support plate assembly having recessed upper pad and vacuum processing apparatus comprising the same | |
JPH08115871A (ja) | 試料ホルダの固定装置 | |
JP2000100920A (ja) | ウエハ把持装置 | |
JP2922408B2 (ja) | 基板固定方法及び基板固定構造 | |
JPH0722035Y2 (ja) | 試料固定装置 | |
JPH08264629A (ja) | 真空ピンセット | |
JPH05109791A (ja) | ペレツトボンダおよびペレツト吸着部交換装置 | |
JP3116498B2 (ja) | 板材の位置決め装置 | |
JPH10144777A (ja) | 真空吸着装置 | |
JP2006324312A (ja) | 基板保持装置 | |
JPH0617299Y2 (ja) | 半導体製造装置用ステージへの被処理材固定装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |