JPH0366825B2 - - Google Patents
Info
- Publication number
- JPH0366825B2 JPH0366825B2 JP17383187A JP17383187A JPH0366825B2 JP H0366825 B2 JPH0366825 B2 JP H0366825B2 JP 17383187 A JP17383187 A JP 17383187A JP 17383187 A JP17383187 A JP 17383187A JP H0366825 B2 JPH0366825 B2 JP H0366825B2
- Authority
- JP
- Japan
- Prior art keywords
- mol
- polyimide
- adhesive
- acid
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001721 polyimide Polymers 0.000 claims description 25
- 239000004642 Polyimide Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 19
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 11
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 9
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 8
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 8
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 6
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 6
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 6
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 5
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 5
- -1 aziridine compound Chemical class 0.000 claims description 4
- 150000001732 carboxylic acid derivatives Chemical group 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 229920000909 polytetrahydrofuran Polymers 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 6
- 229920005575 poly(amic acid) Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000005856 abnormality Effects 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- XBFUGGOVPHCNEG-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCC(CO)(CO)CO.CCC(CO)(CO)CO XBFUGGOVPHCNEG-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001541 aziridines Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17383187A JPS6418294A (en) | 1987-07-14 | 1987-07-14 | Flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17383187A JPS6418294A (en) | 1987-07-14 | 1987-07-14 | Flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6418294A JPS6418294A (en) | 1989-01-23 |
| JPH0366825B2 true JPH0366825B2 (de) | 1991-10-18 |
Family
ID=15967963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17383187A Granted JPS6418294A (en) | 1987-07-14 | 1987-07-14 | Flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6418294A (de) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0362988A (ja) * | 1989-07-31 | 1991-03-19 | Chisso Corp | フレキシブルプリント回路用基板およびその製造法 |
| JPH05105755A (ja) * | 1991-10-15 | 1993-04-27 | Sumitomo Bakelite Co Ltd | ポリイソイミドおよびそのフイルム |
| JPH05105777A (ja) * | 1991-10-15 | 1993-04-27 | Sumitomo Bakelite Co Ltd | ポリイソイミドフイルム及びこれを用いたフレキシブル印刷回路用基板の製造方法 |
| KR101064816B1 (ko) * | 2009-04-03 | 2011-09-14 | 주식회사 두산 | 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판 |
| JP5291553B2 (ja) * | 2009-07-02 | 2013-09-18 | 三井金属鉱業株式会社 | 複合樹脂層付銅箔、複合樹脂層付銅箔の製造方法、フレキシブル両面銅張積層板及び立体成型プリント配線板の製造方法 |
| JP7490466B2 (ja) | 2020-06-23 | 2024-05-27 | 株式会社マキタ | 締結工具 |
-
1987
- 1987-07-14 JP JP17383187A patent/JPS6418294A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6418294A (en) | 1989-01-23 |
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