JPH0365894B2 - - Google Patents

Info

Publication number
JPH0365894B2
JPH0365894B2 JP59228507A JP22850784A JPH0365894B2 JP H0365894 B2 JPH0365894 B2 JP H0365894B2 JP 59228507 A JP59228507 A JP 59228507A JP 22850784 A JP22850784 A JP 22850784A JP H0365894 B2 JPH0365894 B2 JP H0365894B2
Authority
JP
Japan
Prior art keywords
bonding
wire
pads
wire bonding
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59228507A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61105851A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP59228507A priority Critical patent/JPS61105851A/ja
Publication of JPS61105851A publication Critical patent/JPS61105851A/ja
Publication of JPH0365894B2 publication Critical patent/JPH0365894B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/07553—
    • H10W72/07554—
    • H10W72/50—
    • H10W72/531—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/537—
    • H10W72/547—
    • H10W72/59—
    • H10W72/932—
    • H10W72/9445—
    • H10W90/753—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP59228507A 1984-10-30 1984-10-30 ワイヤボンデイング方法 Granted JPS61105851A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59228507A JPS61105851A (ja) 1984-10-30 1984-10-30 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59228507A JPS61105851A (ja) 1984-10-30 1984-10-30 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS61105851A JPS61105851A (ja) 1986-05-23
JPH0365894B2 true JPH0365894B2 (cg-RX-API-DMAC10.html) 1991-10-15

Family

ID=16877521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59228507A Granted JPS61105851A (ja) 1984-10-30 1984-10-30 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS61105851A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140095044A (ko) * 2010-11-25 2014-07-31 미쓰비시덴키 가부시키가이샤 반도체장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0695538B2 (ja) * 1987-06-29 1994-11-24 日本電気株式会社 半導体装置の製造方法
JP6196092B2 (ja) 2013-07-30 2017-09-13 ルネサスエレクトロニクス株式会社 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140095044A (ko) * 2010-11-25 2014-07-31 미쓰비시덴키 가부시키가이샤 반도체장치

Also Published As

Publication number Publication date
JPS61105851A (ja) 1986-05-23

Similar Documents

Publication Publication Date Title
KR950030328A (ko) 반도체 장치 및 그 제조방법과 리드프레임
US6091089A (en) Semiconductor integrated circuit device
JPH0365894B2 (cg-RX-API-DMAC10.html)
JPS62130549A (ja) 集積回路チツプ
JPH0256942A (ja) 半導体装置
WO2000009341A1 (en) Thermal head, thermal head unit, and method of manufacture thereof
JPH0770553B2 (ja) 半導体集積回路装置の製造方法
US20230209713A1 (en) Pad arranging method and pad arrangement structure
JP2911351B2 (ja) サーマルプリントヘッドにおける駆動用半導体チップの構造
JPH04119641A (ja) Ｔａｂ　ｉｃの製造方法
JPH0514518Y2 (cg-RX-API-DMAC10.html)
JP2659286B2 (ja) 半導体装置のワイヤボンディング方法
JPS6185832A (ja) ワイヤボンデイング方法
JPH0695538B2 (ja) 半導体装置の製造方法
JPH0479144B2 (cg-RX-API-DMAC10.html)
JPS62191161A (ja) 感熱記録ヘツド
JPH04207045A (ja) リードフレームのワイヤボンディング方法
JPS6359558A (ja) サ−マルヘツドの製造方法
JPS61154056A (ja) ボンデイングパツト
JPH01282825A (ja) ワイヤボンディング用キャピラリ
JPH0543294B2 (cg-RX-API-DMAC10.html)
JPH0621260A (ja) 電子部品搭載用基板
JPS62147763A (ja) 半導体記憶装置
KR20080088965A (ko) 크랙 방지용 더미 금속 패턴
JPH08330432A (ja) 半導体集積回路