JPH0363802B2 - - Google Patents

Info

Publication number
JPH0363802B2
JPH0363802B2 JP59227466A JP22746684A JPH0363802B2 JP H0363802 B2 JPH0363802 B2 JP H0363802B2 JP 59227466 A JP59227466 A JP 59227466A JP 22746684 A JP22746684 A JP 22746684A JP H0363802 B2 JPH0363802 B2 JP H0363802B2
Authority
JP
Japan
Prior art keywords
winding
inductance element
insulated
conductive path
ultrasonic bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59227466A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61105809A (ja
Inventor
Yoshio Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP22746684A priority Critical patent/JPS61105809A/ja
Priority to DE19853536908 priority patent/DE3536908A1/de
Priority to GB08525605A priority patent/GB2166005B/en
Priority to NL8502843A priority patent/NL192157C/nl
Priority to CN85108084A priority patent/CN1007943B/zh
Priority to FR858515516A priority patent/FR2572214B1/fr
Publication of JPS61105809A publication Critical patent/JPS61105809A/ja
Priority to US07/084,332 priority patent/US4860433A/en
Publication of JPH0363802B2 publication Critical patent/JPH0363802B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
JP22746684A 1984-10-18 1984-10-29 インダクタンス素子の形成方法 Granted JPS61105809A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP22746684A JPS61105809A (ja) 1984-10-29 1984-10-29 インダクタンス素子の形成方法
DE19853536908 DE3536908A1 (de) 1984-10-18 1985-10-16 Induktivitaetselement und verfahren zur herstellung desselben
GB08525605A GB2166005B (en) 1984-10-18 1985-10-17 Inductance element and method of manufacturing the same
NL8502843A NL192157C (nl) 1984-10-18 1985-10-17 Werkwijze voor de vervaardiging van een inductantie-element.
CN85108084A CN1007943B (zh) 1984-10-18 1985-10-18 电感元件制造方法
FR858515516A FR2572214B1 (fr) 1984-10-18 1985-10-18 Element inductif et son procede de fabrication
US07/084,332 US4860433A (en) 1984-10-18 1987-08-11 Method of manufacturing an inductance element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22746684A JPS61105809A (ja) 1984-10-29 1984-10-29 インダクタンス素子の形成方法

Publications (2)

Publication Number Publication Date
JPS61105809A JPS61105809A (ja) 1986-05-23
JPH0363802B2 true JPH0363802B2 (nl) 1991-10-02

Family

ID=16861314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22746684A Granted JPS61105809A (ja) 1984-10-18 1984-10-29 インダクタンス素子の形成方法

Country Status (1)

Country Link
JP (1) JPS61105809A (nl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4340594C2 (de) * 1992-12-01 1998-04-09 Murata Manufacturing Co Verfahren zur Herstellung und zum Einstellen der Charakteristik eines oberflächenmontierbaren chipförmigen LC-Filters

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5874020A (ja) * 1981-10-29 1983-05-04 Toko Inc チツプ形インダクタの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5874020A (ja) * 1981-10-29 1983-05-04 Toko Inc チツプ形インダクタの製造方法

Also Published As

Publication number Publication date
JPS61105809A (ja) 1986-05-23

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees