JPH0361336B2 - - Google Patents

Info

Publication number
JPH0361336B2
JPH0361336B2 JP58005665A JP566583A JPH0361336B2 JP H0361336 B2 JPH0361336 B2 JP H0361336B2 JP 58005665 A JP58005665 A JP 58005665A JP 566583 A JP566583 A JP 566583A JP H0361336 B2 JPH0361336 B2 JP H0361336B2
Authority
JP
Japan
Prior art keywords
heat treatment
tube
cap
processing tube
heating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58005665A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59130418A (ja
Inventor
Keiji Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP566583A priority Critical patent/JPS59130418A/ja
Publication of JPS59130418A publication Critical patent/JPS59130418A/ja
Publication of JPH0361336B2 publication Critical patent/JPH0361336B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP566583A 1983-01-17 1983-01-17 加熱処理システム Granted JPS59130418A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP566583A JPS59130418A (ja) 1983-01-17 1983-01-17 加熱処理システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP566583A JPS59130418A (ja) 1983-01-17 1983-01-17 加熱処理システム

Publications (2)

Publication Number Publication Date
JPS59130418A JPS59130418A (ja) 1984-07-27
JPH0361336B2 true JPH0361336B2 (cs) 1991-09-19

Family

ID=11617396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP566583A Granted JPS59130418A (ja) 1983-01-17 1983-01-17 加熱処理システム

Country Status (1)

Country Link
JP (1) JPS59130418A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5007992A (en) * 1989-05-15 1991-04-16 Weber Daniel K Method and apparatus for removing oxygen from a semiconductor processing reactor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54184078U (cs) * 1978-06-19 1979-12-27
JPS5824436Y2 (ja) * 1978-08-24 1983-05-25 九州日本電気株式会社 半導体基板熱処理用ボ−ト

Also Published As

Publication number Publication date
JPS59130418A (ja) 1984-07-27

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