JPH0360192B2 - - Google Patents

Info

Publication number
JPH0360192B2
JPH0360192B2 JP19444084A JP19444084A JPH0360192B2 JP H0360192 B2 JPH0360192 B2 JP H0360192B2 JP 19444084 A JP19444084 A JP 19444084A JP 19444084 A JP19444084 A JP 19444084A JP H0360192 B2 JPH0360192 B2 JP H0360192B2
Authority
JP
Japan
Prior art keywords
dividing
printed circuit
circuit board
conductive pattern
check point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP19444084A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6171691A (ja
Inventor
Sadayuki Oshibe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Ten Ltd
Original Assignee
Denso Ten Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Ten Ltd filed Critical Denso Ten Ltd
Priority to JP59194440A priority Critical patent/JPS6171691A/ja
Publication of JPS6171691A publication Critical patent/JPS6171691A/ja
Publication of JPH0360192B2 publication Critical patent/JPH0360192B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP59194440A 1984-09-17 1984-09-17 分割用プリント基板の分割溝配設もれ検出方法 Granted JPS6171691A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59194440A JPS6171691A (ja) 1984-09-17 1984-09-17 分割用プリント基板の分割溝配設もれ検出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59194440A JPS6171691A (ja) 1984-09-17 1984-09-17 分割用プリント基板の分割溝配設もれ検出方法

Publications (2)

Publication Number Publication Date
JPS6171691A JPS6171691A (ja) 1986-04-12
JPH0360192B2 true JPH0360192B2 (ko) 1991-09-12

Family

ID=16324623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59194440A Granted JPS6171691A (ja) 1984-09-17 1984-09-17 分割用プリント基板の分割溝配設もれ検出方法

Country Status (1)

Country Link
JP (1) JPS6171691A (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61140192A (ja) * 1984-12-13 1986-06-27 松下電器産業株式会社 プリント配線板の製造方法
JP2696964B2 (ja) * 1988-07-21 1998-01-14 松下電器産業株式会社 セラミック基板の分割方法
JPH03281199A (ja) * 1990-03-29 1991-12-11 Hitachi Aic Inc プリント配線板の製造方法
JPH04316392A (ja) * 1991-04-16 1992-11-06 Nec Toyama Ltd プリント配線板の製造方法
JP2002158410A (ja) * 2000-11-21 2002-05-31 Ibiden Co Ltd プリント配線板及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5713791A (en) * 1980-06-30 1982-01-23 Konishiroku Photo Ind Printed circuit board
JPS5825292A (ja) * 1981-08-08 1983-02-15 松下電器産業株式会社 印刷配線板
JPS60130884A (ja) * 1983-12-19 1985-07-12 中央銘板工業株式会社 印刷配線板のvカツト加工の確認方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5485363U (ko) * 1977-11-30 1979-06-16

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5713791A (en) * 1980-06-30 1982-01-23 Konishiroku Photo Ind Printed circuit board
JPS5825292A (ja) * 1981-08-08 1983-02-15 松下電器産業株式会社 印刷配線板
JPS60130884A (ja) * 1983-12-19 1985-07-12 中央銘板工業株式会社 印刷配線板のvカツト加工の確認方法

Also Published As

Publication number Publication date
JPS6171691A (ja) 1986-04-12

Similar Documents

Publication Publication Date Title
TWI431298B (zh) 測試圖案及使用測試圖案監視損壞的方法
JPH0360192B2 (ko)
US4642560A (en) Device for controlling continuity of printed circuits
EP0909117B1 (en) Method of making thick film circuits
JPH02224354A (ja) 半導体装置のコンタクトホールの目ずれ検査方法
US7571399B2 (en) Process for checking the quality of the metallization of a printed circuit
JP2879065B2 (ja) 電極間の短絡検出方法及びその装置
JPS58172561A (ja) プリント配線板の検査方法並びにチエツカ−治具
JPS59119276A (ja) 絶縁抵抗測定装置
JPH05235557A (ja) 位置ずれ量測定システム
JP2988294B2 (ja) ハーネスにおける導通検査方法
JPH04282886A (ja) プリント配線板の検査方法
JP2002299805A (ja) 回路基板と実装位置の検査方法
JPH0621180A (ja) プリント配線板のソルダーレジスト層の位置ずれ検査方法
JPS6042915B2 (ja) 回路基板の布線試験方法
JPS6167238A (ja) 半導体装置
JP3313684B2 (ja) 液晶表示基板、その配線検査方法およびその配線修理方法
JPH05304344A (ja) プリント配線板
JP3820854B2 (ja) プリント基板
CN118112294A (zh) 电路板检测用治具及其检测方法
JP2001085810A (ja) フレキシブルプリント基板
JPH058528Y2 (ko)
JPH05218609A (ja) プリント配線板およびそのパターンずれ検査方法
JPS6066119A (ja) 厚膜多層印刷基板の印刷ずれ検査方法
JPS62294978A (ja) スル−ホ−ルの導通不良の検出方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees