JPH0356911B2 - - Google Patents
Info
- Publication number
- JPH0356911B2 JPH0356911B2 JP28012686A JP28012686A JPH0356911B2 JP H0356911 B2 JPH0356911 B2 JP H0356911B2 JP 28012686 A JP28012686 A JP 28012686A JP 28012686 A JP28012686 A JP 28012686A JP H0356911 B2 JPH0356911 B2 JP H0356911B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- glass fiber
- fiber cloth
- flatness
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000004744 fabric Substances 0.000 claims description 18
- 239000003365 glass fiber Substances 0.000 claims description 18
- 239000011888 foil Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28012686A JPS63132044A (ja) | 1986-11-25 | 1986-11-25 | 金属箔張積層板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28012686A JPS63132044A (ja) | 1986-11-25 | 1986-11-25 | 金属箔張積層板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63132044A JPS63132044A (ja) | 1988-06-04 |
| JPH0356911B2 true JPH0356911B2 (enrdf_load_stackoverflow) | 1991-08-29 |
Family
ID=17620696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28012686A Granted JPS63132044A (ja) | 1986-11-25 | 1986-11-25 | 金属箔張積層板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63132044A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03128239A (ja) * | 1989-10-16 | 1991-05-31 | Sumitomo Bakelite Co Ltd | 積層板の製造方法 |
| JP2501038B2 (ja) * | 1990-10-15 | 1996-05-29 | 松下電工株式会社 | 積層板の製造方法 |
| US5435877A (en) * | 1992-05-07 | 1995-07-25 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of copper-clad laminate |
| WO1999028126A1 (fr) * | 1997-12-01 | 1999-06-10 | Nitto Boseki Co., Ltd. | Preimpregne pour cartes de circuits imprimes multicouches et leur procede de fabrication |
-
1986
- 1986-11-25 JP JP28012686A patent/JPS63132044A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63132044A (ja) | 1988-06-04 |
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