JPH035678B2 - - Google Patents
Info
- Publication number
- JPH035678B2 JPH035678B2 JP56076882A JP7688281A JPH035678B2 JP H035678 B2 JPH035678 B2 JP H035678B2 JP 56076882 A JP56076882 A JP 56076882A JP 7688281 A JP7688281 A JP 7688281A JP H035678 B2 JPH035678 B2 JP H035678B2
- Authority
- JP
- Japan
- Prior art keywords
- paste
- base metal
- metal paste
- firing
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010953 base metal Substances 0.000 claims description 18
- 238000010304 firing Methods 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 9
- 239000012298 atmosphere Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229910000510 noble metal Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
【発明の詳細な説明】 本発明は厚膜導電路の製造方法に関する。[Detailed description of the invention] The present invention relates to a method for manufacturing thick film conductive paths.
厚膜導電路は厚膜回路において、厚膜抵抗等の
回路素子間や回路素子と外部端子との接続配線手
段として不可欠のものであるが、従来のこの種導
電路は、基板上に銀パラジウムペースト等の貴金
属ペーストを所定パターンで印刷し、乾燥、焼成
することにより形成されるのが一般的である。 Thick film conductive paths are indispensable in thick film circuits as a connection wiring means between circuit elements such as thick film resistors and between circuit elements and external terminals. It is generally formed by printing a noble metal paste such as paste in a predetermined pattern, drying, and firing.
上記従来方法の難点は導電路形成用ペーストが
高価につくということである。このペーストとし
て、安価な卑金属ペーストの使用が考えられるが
その場合、卑金属ペーストは酸化し易い特性を持
つており、このため、ペースト焼成中の酸化防止
を図らねばならない。 A disadvantage of the above conventional method is that the paste for forming conductive paths is expensive. It is conceivable to use an inexpensive base metal paste as this paste, but in that case, the base metal paste has the property of being easily oxidized, and therefore, it is necessary to prevent oxidation during paste firing.
酸化防止を目的として、窒素雰囲気焼成用卑金
属ペーストが市販されているが、焼成炉の雰囲気
を置換するには多大の設備投資を要し、更に雰囲
気を保持するガスの供給も必要である。同様の目
的で大気中焼成用卑金属（具体例としてはニツケ
ル）ペーストも市販されているが、斯るペースト
は、焼成時の酸化を防ぐためにボロンを含有して
おり、このため、焼成時酸化ボロンが生じて、形
成されたニツケル導電路は著しい耐湿強度劣化現
象を示す。 Base metal pastes for firing in a nitrogen atmosphere are commercially available for the purpose of preventing oxidation, but replacing the atmosphere in the firing furnace requires a large investment in equipment and also requires the supply of gas to maintain the atmosphere. Base metal (specifically nickel) pastes for firing in the atmosphere are also commercially available for the same purpose, but these pastes contain boron to prevent oxidation during firing, and therefore do not contain boron oxide during firing. As a result, the formed nickel conductive path exhibits a remarkable deterioration in moisture resistance.
本発明は上記の点に鑑みてなされたもので、以
下実施例を図面を参照しつつ工程順に説明する。 The present invention has been made in view of the above points, and embodiments will be described below in the order of steps with reference to the drawings.
() まず、アルミナ基板１上に銀ペーストを所
定パターンで印刷し、焼成して第１〜第３導電
性パツド２ａ〜２ｃを形成する（第１図）。() First, silver paste is printed in a predetermined pattern on an alumina substrate 1 and fired to form the first to third conductive pads 2a to 2c (FIG. 1).
() 第１、第２パツド２ａ，２ｂ間にルテニウ
ム抵抗ペースト３を印刷し、乾燥する（第２
図）。() Print ruthenium resistance paste 3 between the first and second pads 2a and 2b and dry it (second
figure).
() 第２、第３パツド２ｂ，２ｃ間に卑金属ペ
ースト４を所定パターンで印刷し、乾燥する
（第３図）。() Base metal paste 4 is printed in a predetermined pattern between the second and third pads 2b and 2c and dried (FIG. 3).
() 卑金属ペースト４をガラスペースト５にて
完全に包囲する（第４図）。この工程は同様に
印刷により形成され、ガラスペースト５は続く
乾燥処理を経る。() Base metal paste 4 is completely surrounded by glass paste 5 (Fig. 4). This step is also formed by printing, and the glass paste 5 undergoes a subsequent drying process.
() 抵抗ペースト３、卑金属ペースト４及びガ
ラスペースト５を同時に大気中で焼成し、抵抗
体３′、卑金属導電路４′及びガラス絶縁体５′
を得る（第５図）。このとき、卑金属ペースト
４はガラスペースト５で包囲されて大気雰囲気
から遮断されているので酸化することはない。() Resistance paste 3, base metal paste 4, and glass paste 5 are fired simultaneously in the atmosphere to form resistor 3', base metal conductive path 4', and glass insulator 5'.
(Figure 5). At this time, the base metal paste 4 is surrounded by the glass paste 5 and is shielded from the atmosphere, so it does not oxidize.
() 抵抗体３′を包囲すべく樹脂オーバコート
皮膜７が設けられる（第６図）。() A resin overcoat film 7 is provided to surround the resistor 3' (FIG. 6).
上記実施例において、卑金属ペースト４として
はEngel hard社製のフリツトレスニツケルペー
ストＡ−2964、フリツト入りニツケルペーストＡ
−4107、Ａ−3207、又はアルミニウムペーストＡ
−3113が、又ガラスペースト５としては昭栄化学
製のＧ−5128が夫々効適である。 In the above embodiment, the base metal paste 4 is fritless nickel paste A-2964 manufactured by Engel Hard, fritted nickel paste A
-4107, A-3207, or aluminum paste A
-3113, and as the glass paste 5, G-5128 manufactured by Shoei Chemical Co., Ltd. are effective.
かくして、本発明によれば、予め導電性パツド
を酸化されにくい貴金属で形成しておき、第３頁
第２行乃至第３行目にも明記されている如く酸化
され易い卑金属ペーストのみを全てガラスペース
トで包囲した状態で焼成するので、卑金属ペース
トが酸化するのが防止され、これにより安価な卑
金属ペーストを用い、しかも大気中焼成により厚
膜導電路が形成でき、厚膜回路の製造価格低減を
図れる。 Thus, according to the present invention, the conductive pad is formed in advance from a noble metal that is difficult to oxidize, and only the base metal paste that is easily oxidized is entirely made of glass, as specified in the second and third lines of page 3. Since the base metal paste is fired while being surrounded by the paste, oxidation of the base metal paste is prevented.This allows the formation of thick film conductive paths using inexpensive base metal paste and firing in the atmosphere, which reduces the manufacturing cost of thick film circuits. I can figure it out.
第１図乃至第６図は本発明実施例を示す工程別
断面図である。
１……基板、４……卑金属ペースト。
FIGS. 1 to 6 are cross-sectional views showing steps of an embodiment of the present invention. 1...Substrate, 4...Base metal paste.
Claims (1)
刷し、焼成して複数の導電性パツドを形成する工
程と、該導電性パツド間を跨ぐようにして卑金属
ペーストを印刷する工程と、該卑金属ペーストを
全て包囲するように酸化防止用のガラスペースト
を印刷する工程と、その後前記卑金属ペーストを
前記ガラスペーストと共に大気中で焼成する工程
と、からなることを特徴とする厚膜導電路の製造
方法。1. A step of printing a noble metal paste in a predetermined pattern on a substrate and firing it to form a plurality of conductive pads, a step of printing the base metal paste so as to span between the conductive pads, and a step of printing the base metal paste in a predetermined pattern. A method for manufacturing a thick film conductive path, comprising the steps of: printing an oxidation-preventing glass paste so as to surround it; and then firing the base metal paste together with the glass paste in the atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7688281A JPS57192003A (en) | 1981-05-20 | 1981-05-20 | Method of producing thick film conductive path |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7688281A JPS57192003A (en) | 1981-05-20 | 1981-05-20 | Method of producing thick film conductive path |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57192003A JPS57192003A (en) | 1982-11-26 |
| JPH035678B2 true JPH035678B2 (en) | 1991-01-28 |
Family
ID=13618001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7688281A Granted JPS57192003A (en) | 1981-05-20 | 1981-05-20 | Method of producing thick film conductive path |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57192003A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01133396A (en) * | 1987-11-19 | 1989-05-25 | Matsushita Electric Ind Co Ltd | Manufacture of hybrid thick film integrated circuit |
| JP2746774B2 (en) * | 1991-06-05 | 1998-05-06 | 株式会社ミツバ | Circuit board manufacturing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50155514A (en) * | 1974-06-07 | 1975-12-15 |
-
1981
- 1981-05-20 JP JP7688281A patent/JPS57192003A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50155514A (en) * | 1974-06-07 | 1975-12-15 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57192003A (en) | 1982-11-26 |
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