JPH04208593A - Thick film printed board - Google Patents

Thick film printed board

Info

Publication number
JPH04208593A
JPH04208593A JP40015390A JP40015390A JPH04208593A JP H04208593 A JPH04208593 A JP H04208593A JP 40015390 A JP40015390 A JP 40015390A JP 40015390 A JP40015390 A JP 40015390A JP H04208593 A JPH04208593 A JP H04208593A
Authority
JP
Japan
Prior art keywords
thick film
printed board
solderability
film printed
baked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP40015390A
Other languages
Japanese (ja)
Inventor
Toshiaki Nishikawa
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP40015390A priority Critical patent/JPH04208593A/en
Publication of JPH04208593A publication Critical patent/JPH04208593A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps

Abstract

PURPOSE: To obtain a thick film printed board having excellent solderability by covering soldering pads made of copper thick film conductors formed by a screen printing method with a metal film which has excellent solderability and is hardly oxidized.
CONSTITUTION: After a pattern is first formed by using copper conductor paste on an alumina ceramic board 4 by a screen printing method, it is dried, and then baked in a nitrogen atmosphere at 900°C. After a pattern is formed of silver palladium (Ag.Pd) paste only on soldering pads on the conductor, it is dried, and then baked in a nitrogen atmosphere at 900°C. Thus, since the surface of the pad 1 is covered with an Ag.Pd film 3, surface oxidation due to heat is not generated, and a thick film printed board having excellent solderability can be obtained.
COPYRIGHT: (C)1992,JPO&Japio
JP40015390A 1990-12-03 1990-12-03 Thick film printed board Pending JPH04208593A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP40015390A JPH04208593A (en) 1990-12-03 1990-12-03 Thick film printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP40015390A JPH04208593A (en) 1990-12-03 1990-12-03 Thick film printed board

Publications (1)

Publication Number Publication Date
JPH04208593A true JPH04208593A (en) 1992-07-30

Family

ID=18510070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP40015390A Pending JPH04208593A (en) 1990-12-03 1990-12-03 Thick film printed board

Country Status (1)

Country Link
JP (1) JPH04208593A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0730242A (en) * 1993-07-14 1995-01-31 Nec Corp Thin-film circuit substrate
US5424093A (en) * 1991-11-15 1995-06-13 Murata Mfg. Co., Ltd. Method of manufacturing electronic elements
JPH08232072A (en) * 1994-12-09 1996-09-10 Alpha Metals Ltd Silver plating
JP2002124744A (en) * 2000-10-12 2002-04-26 Eastern Co Ltd Circuit board
US6885104B2 (en) * 1998-10-05 2005-04-26 Kulicke & Soffa Investments, Inc. Semiconductor copper bond pad surface protection
JP2007103816A (en) * 2005-10-07 2007-04-19 Nec Electronics Corp Interconnect substrate and electronic circuit device
JP2007103840A (en) * 2005-10-07 2007-04-19 Nec Electronics Corp Method of manufacturing electronic circuit device
JP2012221983A (en) * 2011-04-04 2012-11-12 Murata Mfg Co Ltd Ceramic substrate
JPWO2014103541A1 (en) * 2012-12-27 2017-01-12 日本碍子株式会社 Electronic component and manufacturing method thereof

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5424093A (en) * 1991-11-15 1995-06-13 Murata Mfg. Co., Ltd. Method of manufacturing electronic elements
JPH0730242A (en) * 1993-07-14 1995-01-31 Nec Corp Thin-film circuit substrate
JPH08232072A (en) * 1994-12-09 1996-09-10 Alpha Metals Ltd Silver plating
US6885104B2 (en) * 1998-10-05 2005-04-26 Kulicke & Soffa Investments, Inc. Semiconductor copper bond pad surface protection
JP2002124744A (en) * 2000-10-12 2002-04-26 Eastern Co Ltd Circuit board
JP2007103816A (en) * 2005-10-07 2007-04-19 Nec Electronics Corp Interconnect substrate and electronic circuit device
JP2007103840A (en) * 2005-10-07 2007-04-19 Nec Electronics Corp Method of manufacturing electronic circuit device
JP2012221983A (en) * 2011-04-04 2012-11-12 Murata Mfg Co Ltd Ceramic substrate
JPWO2014103541A1 (en) * 2012-12-27 2017-01-12 日本碍子株式会社 Electronic component and manufacturing method thereof

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