JPS62165301A - Thick film printed circuit board - Google Patents
Thick film printed circuit boardInfo
- Publication number
- JPS62165301A JPS62165301A JP61006284A JP628486A JPS62165301A JP S62165301 A JPS62165301 A JP S62165301A JP 61006284 A JP61006284 A JP 61006284A JP 628486 A JP628486 A JP 628486A JP S62165301 A JPS62165301 A JP S62165301A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- thick film
- film printed
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、厚膜印刷回路基板に係り、そのスルーホール
に抵抗体を設けるようにしたものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a thick film printed circuit board in which a resistor is provided in a through hole of the thick film printed circuit board.
（従来の技術）
従来、アルミナ基板の両面を用いた厚膜回路におけるス
ルーホールは、第３図に示されるように、スクリーン印
刷する際に、アルミナ基板１を下方から真空吸引する方
法等により、アルミナ基板１の孔５の内壁に導体ペース
ト２を付着させて導体を形成するようにしている。即ち
、アルミナ基板１を、第３図に示されるように、吸引治
具３にセントしてスクリーン印刷を行い、吸引口４より
真空吸引することより、基板の孔５の内壁に導体ペース
ト２が付着される。(Prior Art) Conventionally, as shown in FIG. 3, through holes in thick film circuits using both sides of an alumina substrate have been formed by vacuum suction of the alumina substrate 1 from below during screen printing, etc. A conductor paste 2 is attached to the inner wall of the hole 5 of the alumina substrate 1 to form a conductor. That is, as shown in FIG. 3, the alumina substrate 1 is placed in a suction jig 3, screen printing is performed, and the conductor paste 2 is applied to the inner wall of the hole 5 of the substrate by vacuum suction from the suction port 4. attached.
次に、上記アルミナ基板１を１５０℃前後の乾燥炉に入
れ、導体ペースト２中の有機溶剤を蒸発させる。Next, the alumina substrate 1 is placed in a drying oven at around 150° C. to evaporate the organic solvent in the conductive paste 2.
次に、上記アルミナ基板１を焼成炉に入れ、上記ペース
ト２を９００℃前後の温度で焼く。Next, the alumina substrate 1 is placed in a firing furnace, and the paste 2 is fired at a temperature of about 900°C.
このようにして、上記ペースト２を焼成することにより
スルーホールを含む配線パターンが形成される。In this way, by firing the paste 2, a wiring pattern including through holes is formed.
第４図は係る厚膜印刷回路基板の断面図である。FIG. 4 is a sectional view of such a thick film printed circuit board.
この図に示されるように、上記基板１上に形成したスル
ーホール７を含む配線パターン８．８′に、抵抗体ペー
ストを印刷して乾燥、焼成させて抵抗体ＩＯを形成し、
更に、チップ部品６を半田付けする。As shown in this figure, a resistor paste is printed on the wiring pattern 8.8' including the through hole 7 formed on the substrate 1, dried and fired to form a resistor IO.
Furthermore, the chip component 6 is soldered.
このように基板両面を用いる厚膜印刷回路基板の孔は導
体により形成されていて、所謂、スルーホール７が構成
されている。In this way, the holes in the thick film printed circuit board using both sides of the board are formed of a conductor, and constitute so-called through holes 7.
なお、上記した先行技術としては、例えば、特開昭６０
−５３０９７号、特開昭６０−１０２７９７号などが挙
げられる。In addition, as the above-mentioned prior art, for example, Japanese Patent Application Laid-open No. 1983
-53097, JP-A-60-102797, etc.
（発明が解決しようとする問題点）
しかしながら、上記した基板両面を用いた厚膜印刷回路
基板のスルーホールは、単に基板の表面と裏面を結ぶ導
体の機能を果たしているだけであった。(Problems to be Solved by the Invention) However, the through-holes of the above-mentioned thick film printed circuit board using both sides of the board merely function as conductors connecting the front and back sides of the board.
本発明は、上記問題点を除去し、基板両面を用いた厚膜
印刷回路基板のスルーホールに抵抗体を形成することに
より、高密度な実装を行い得る厚膜印刷回路基板を提供
することを目的とする。The present invention aims to eliminate the above-mentioned problems and provide a thick film printed circuit board that can be mounted with high density by forming resistors in through holes of the thick film printed circuit board using both sides of the board. purpose.
（問題点を解決するための手段）
本発明は、上記問題点を解決するために、基板両面を用
いた厚膜印刷回路基板において、従来はアルミナ基板の
表面と裏面のパターンを導体で接続するスルーホールと
して使用していた基板の孔に、スクリーン印刷で抵抗ペ
ーストを付着させ、抵抗体を設けるようにしたものであ
る。(Means for Solving the Problems) In order to solve the above problems, the present invention, in a thick film printed circuit board using both sides of the board, conventionally connects the patterns on the front and back sides of an alumina board with a conductor. Resistor paste was applied by screen printing to holes in the board that were used as through holes, and resistors were provided.
（作用）
本発明によれば、基板のスルーホールにスクリーン印刷
によって、抵抗ペーストを付着させ、抵抗体を設ける。(Function) According to the present invention, a resistor paste is attached to a through hole of a substrate by screen printing to provide a resistor.
従って、基板上に、より高密度な実装を行うことができ
る。Therefore, it is possible to perform higher density mounting on the substrate.
（実施例）
以下、本発明の実施例について図面を参照しながら詳細
に説明する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
第１図は本発明の実施例を示した厚膜印刷回路基板の断
面図である。FIG. 1 is a sectional view of a thick film printed circuit board showing an embodiment of the present invention.
まず、スクリーン印刷でアルミナ基板１上に導体パター
ン８を形成する。First, the conductive pattern 8 is formed on the alumina substrate 1 by screen printing.
次に、第１図に示される真空吸引法を用いて、上記基板
１上に抵抗ペーストを印刷して、抵抗体１０を形成させ
る。Next, using the vacuum suction method shown in FIG. 1, a resistor paste is printed on the substrate 1 to form a resistor 10.
上記基板１のスルーホールの内壁には抵抗体１０が形成
される。また、抵抗体１０は導体パターン８と接続する
。A resistor 10 is formed on the inner wall of the through hole of the substrate 1. Further, the resistor 10 is connected to the conductive pattern 8.
次に、上記導体パターン８と反対側の上記基板１上にス
クリーン印刷で導体パターン８′を形成する。この導体
パターン８′の印刷の際には、上記真空吸引法は用いな
いでスクリーン印刷を行う。Next, a conductor pattern 8' is formed on the substrate 1 on the opposite side to the conductor pattern 8 by screen printing. When printing this conductor pattern 8', screen printing is performed without using the vacuum suction method described above.
また、導体パターン８′が上記抵抗体１０に接続される
ようなスクリーンマスクを使用してスクリーン印刷を行
う。Further, screen printing is performed using a screen mask such that the conductive pattern 8' is connected to the resistor 10.
以上の工程により、第１図に示されるように、上記基板
１の両面の配線パターン８，８′と接続した抵抗体１０
が、上記基板１のスルーホールの中に形成される。Through the above steps, as shown in FIG.
are formed in the through holes of the substrate 1.
また、上記基板ｌのスルーホールの直径ｔを変えること
により抵抗体１０の抵抗値を変えることができる。即ち
、上記基板１内に直径ｔの異なる多数のスルーホールを
形成することにより、一度に多数の抵抗値の異なる抵抗
体が基板の孔の中に形成できる。Furthermore, the resistance value of the resistor 10 can be changed by changing the diameter t of the through hole in the substrate l. That is, by forming a large number of through holes with different diameters t in the substrate 1, a large number of resistors with different resistance values can be formed in the holes of the substrate at once.
第２図は基板両面を用いた厚膜印刷回路基板の断面図で
ある。FIG. 2 is a cross-sectional view of a thick film printed circuit board using both sides of the board.
この図に示されるように、上記基板１の異なる直径の孔
の中に各々抵抗体１０が形成され、配線パターン８．８
′は抵抗体１０に接続し、更に、配線パターン８，８′
にチップ部品６を半田付けする。As shown in this figure, resistors 10 are formed in holes of different diameters in the substrate 1, and wiring patterns 8.8 and 8.
' is connected to the resistor 10, and furthermore, wiring patterns 8, 8'
Solder the chip component 6 to.
なお、本発明は上記実施例に限定されるものではなく、
本発明の趣旨に基づいて種々の変形が可能であり、これ
らを本発明の範囲から排除するものではない。Note that the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.
（発明の効果）
以上、詳細に説明したように、本発明によれば、基板両
面を用いた厚膜印刷回路基板において、基板のスルーホ
ールにスクリーン印刷によって抵抗ペーストを付着させ
、抵抗体を設けるようにしたので、
（１）より高密度な実装が可能な厚膜印刷回路基板を得
ることができる。(Effects of the Invention) As described in detail above, according to the present invention, in a thick film printed circuit board using both sides of the board, a resistor paste is attached to the through holes of the board by screen printing, and a resistor is provided. (1) It is possible to obtain a thick film printed circuit board that can be mounted at a higher density.
（２）スルーホールを複数設け、それらのスルーホール
の直径を互いに異ならせる場合には、容易に基板内に多
数の抵抗値の異なる抵抗体を形成することができる。(2) When a plurality of through holes are provided and the diameters of the through holes are different from each other, a large number of resistors having different resistance values can be easily formed in the substrate.
第１図は本発明の一実施例を示ず厚膜印刷回路基板の断
面図、第２図は本発明の他の実施例を示す厚膜印刷回路
基板の断面図、第３図は従来の厚膜印刷回路基板の製造
状態を示す断面図、第４図は従来の厚膜印刷回路基板の
断面図である。
１・・・アルミナ基板、２・・・導体ペースト、３・・
・吸引治具、４・・・吸引口、５，７・・・スルーホー
ル、６・・・チップ部品、８．８′・・・導体パターン
、９・・・半田、ＩＯ・・・抵抗体。FIG. 1 is a sectional view of a thick film printed circuit board that does not show one embodiment of the present invention, FIG. 2 is a sectional view of a thick film printed circuit board that shows another embodiment of the present invention, and FIG. A cross-sectional view showing the manufacturing state of a thick-film printed circuit board, FIG. 4 is a cross-sectional view of a conventional thick-film printed circuit board. 1... Alumina substrate, 2... Conductor paste, 3...
・Suction jig, 4... Suction port, 5, 7... Through hole, 6... Chip component, 8.8'... Conductor pattern, 9... Solder, IO... Resistor .
Claims (2)
抗ペーストを付着させ、抵抗体を設けるようにしたこと
を特徴とする厚膜印刷回路基板。(1) A thick film printed circuit board characterized in that a resistor paste is attached to a through hole of the board by screen printing to provide a resistor.
ホールの直径を異ならしめて、基板内に多数の抵抗値の
異なる抵抗体を形成するようにしたことを特徴とする特
許請求の範囲第１項記載の厚膜印刷回路基板。(2) A plurality of the through holes are provided, and the diameters of the through holes are made to be different, so that a large number of resistors having different resistance values are formed in the substrate. Thick film printed circuit board as described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61006284A JPS62165301A (en) | 1986-01-17 | 1986-01-17 | Thick film printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61006284A JPS62165301A (en) | 1986-01-17 | 1986-01-17 | Thick film printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62165301A true JPS62165301A (en) | 1987-07-21 |
Family
ID=11634092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61006284A Pending JPS62165301A (en) | 1986-01-17 | 1986-01-17 | Thick film printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62165301A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01181453A (en) * | 1988-01-11 | 1989-07-19 | Toshiba Corp | Pin grid array |
| US7535724B2 (en) | 2004-12-01 | 2009-05-19 | Ricoh Company, Ltd. | Printed wiring board and a method of manufacturing the same |
-
1986
- 1986-01-17 JP JP61006284A patent/JPS62165301A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01181453A (en) * | 1988-01-11 | 1989-07-19 | Toshiba Corp | Pin grid array |
| US7535724B2 (en) | 2004-12-01 | 2009-05-19 | Ricoh Company, Ltd. | Printed wiring board and a method of manufacturing the same |
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