JPH035677B2 - - Google Patents
Info
- Publication number
- JPH035677B2 JPH035677B2 JP10420682A JP10420682A JPH035677B2 JP H035677 B2 JPH035677 B2 JP H035677B2 JP 10420682 A JP10420682 A JP 10420682A JP 10420682 A JP10420682 A JP 10420682A JP H035677 B2 JPH035677 B2 JP H035677B2
- Authority
- JP
- Japan
- Prior art keywords
- composite
- board
- substrate
- capacitor
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 35
- 239000002131 composite material Substances 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 35
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000004382 potting Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000011165 3D composite Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- -1 resistors Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10420682A JPS58220492A (ja) | 1982-06-16 | 1982-06-16 | 複合回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10420682A JPS58220492A (ja) | 1982-06-16 | 1982-06-16 | 複合回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58220492A JPS58220492A (ja) | 1983-12-22 |
| JPH035677B2 true JPH035677B2 (US20020095090A1-20020718-M00002.png) | 1991-01-28 |
Family
ID=14374494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10420682A Granted JPS58220492A (ja) | 1982-06-16 | 1982-06-16 | 複合回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58220492A (US20020095090A1-20020718-M00002.png) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3613302B2 (ja) * | 1995-07-26 | 2005-01-26 | セイコーエプソン株式会社 | インクジェット式記録ヘッド |
| JP4150552B2 (ja) * | 2002-08-28 | 2008-09-17 | 富士通株式会社 | 複合キャパシタ |
| JP6554833B2 (ja) * | 2015-03-12 | 2019-08-07 | 株式会社村田製作所 | 複合電子部品および抵抗素子 |
| JP6743602B2 (ja) * | 2016-09-09 | 2020-08-19 | 株式会社村田製作所 | 複合電子部品および抵抗素子 |
| JP2018041931A (ja) * | 2016-09-09 | 2018-03-15 | 株式会社村田製作所 | 複合電子部品 |
| JP6747202B2 (ja) * | 2016-09-09 | 2020-08-26 | 株式会社村田製作所 | 複合電子部品 |
| US10910163B2 (en) | 2018-06-29 | 2021-02-02 | Samsung Electro-Mechanics Co., Ltd. | Multilayer electronic component and board having the same mounted thereon |
-
1982
- 1982-06-16 JP JP10420682A patent/JPS58220492A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58220492A (ja) | 1983-12-22 |
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