JPH035660B2 - - Google Patents

Info

Publication number
JPH035660B2
JPH035660B2 JP16791383A JP16791383A JPH035660B2 JP H035660 B2 JPH035660 B2 JP H035660B2 JP 16791383 A JP16791383 A JP 16791383A JP 16791383 A JP16791383 A JP 16791383A JP H035660 B2 JPH035660 B2 JP H035660B2
Authority
JP
Japan
Prior art keywords
lead frame
guide pin
guide
guide hole
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16791383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6058626A (ja
Inventor
Hiroyuki Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Nippon Electric Co Ltd
Original Assignee
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Nippon Electric Co Ltd filed Critical Kansai Nippon Electric Co Ltd
Priority to JP16791383A priority Critical patent/JPS6058626A/ja
Publication of JPS6058626A publication Critical patent/JPS6058626A/ja
Publication of JPH035660B2 publication Critical patent/JPH035660B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Reciprocating Conveyors (AREA)
JP16791383A 1983-09-12 1983-09-12 リ−ドフレ−ムの送り装置 Granted JPS6058626A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16791383A JPS6058626A (ja) 1983-09-12 1983-09-12 リ−ドフレ−ムの送り装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16791383A JPS6058626A (ja) 1983-09-12 1983-09-12 リ−ドフレ−ムの送り装置

Publications (2)

Publication Number Publication Date
JPS6058626A JPS6058626A (ja) 1985-04-04
JPH035660B2 true JPH035660B2 (enrdf_load_stackoverflow) 1991-01-28

Family

ID=15858368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16791383A Granted JPS6058626A (ja) 1983-09-12 1983-09-12 リ−ドフレ−ムの送り装置

Country Status (1)

Country Link
JP (1) JPS6058626A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH052490Y2 (enrdf_load_stackoverflow) * 1985-10-08 1993-01-21
JPS63184345A (ja) * 1987-01-27 1988-07-29 Toshiba Corp 半導体組立部品の搬送方法
JP2800950B2 (ja) * 1990-10-12 1998-09-21 ローム株式会社 半導体部品製造用短冊状リードフレームの間欠移送装置
JPH06263225A (ja) * 1993-03-15 1994-09-20 Ishikawa Kikai:Kk 間歇送り装置

Also Published As

Publication number Publication date
JPS6058626A (ja) 1985-04-04

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