JPH0356138U - - Google Patents

Info

Publication number
JPH0356138U
JPH0356138U JP1989116903U JP11690389U JPH0356138U JP H0356138 U JPH0356138 U JP H0356138U JP 1989116903 U JP1989116903 U JP 1989116903U JP 11690389 U JP11690389 U JP 11690389U JP H0356138 U JPH0356138 U JP H0356138U
Authority
JP
Japan
Prior art keywords
cooling
clip terminal
board
wire
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989116903U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989116903U priority Critical patent/JPH0356138U/ja
Publication of JPH0356138U publication Critical patent/JPH0356138U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す構成説明図、
第２図は本考案の他の実施例を示す構成説明図で
ある。 １……ハイブリツドＩＣ基板、２……クリツプ
端子、３……ハンダ、４……半導体チツプ、５，
６……接続パツド、７……ワイヤ、８……ヒータ
ー、９，１０，１４，１５……ペルチエ素子、１
１，１２，１６，１７……熱良導体（アルミニウ
ム板）、１３……フアン、１８，１９……ばね。

Claims (1)

  1. 【実用新案登録請求の範囲】 クリツプ端子がハンダ付けされた基板と、この
    基板に実装された半導体チツプと間にワイヤを熱
    圧着ボンデイングするワイヤボンデイング装置に
    おいて、 前記クリツプ端子を冷却する第１の冷却機構と
    、前記クリツプ端子と基板との中間部分を冷却す
    る第２の冷却機構の少なくともいずれかの冷却機
    構を設けたことを特徴とするワイヤボンデイング
    装置。
JP1989116903U 1989-10-04 1989-10-04 Pending JPH0356138U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989116903U JPH0356138U (ja) 1989-10-04 1989-10-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989116903U JPH0356138U (ja) 1989-10-04 1989-10-04

Publications (1)

Publication Number Publication Date
JPH0356138U true JPH0356138U (ja) 1991-05-30

Family

ID=31665160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989116903U Pending JPH0356138U (ja) 1989-10-04 1989-10-04

Country Status (1)

Country Link
JP (1) JPH0356138U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020008607A1 (ja) 2018-07-05 2020-01-09 平田機工株式会社 搬送装置、被駆動ユニット、補助ユニット及びパレット

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020008607A1 (ja) 2018-07-05 2020-01-09 平田機工株式会社 搬送装置、被駆動ユニット、補助ユニット及びパレット

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