JPH0355981B2 - - Google Patents

Info

Publication number
JPH0355981B2
JPH0355981B2 JP57230288A JP23028882A JPH0355981B2 JP H0355981 B2 JPH0355981 B2 JP H0355981B2 JP 57230288 A JP57230288 A JP 57230288A JP 23028882 A JP23028882 A JP 23028882A JP H0355981 B2 JPH0355981 B2 JP H0355981B2
Authority
JP
Japan
Prior art keywords
power supply
integrated circuit
package
pad
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57230288A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59124151A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57230288A priority Critical patent/JPS59124151A/ja
Priority to DE8383303805T priority patent/DE3381460D1/de
Priority to DE89202021T priority patent/DE3382726D1/de
Priority to DE89202020T priority patent/DE3382727D1/de
Priority to EP89202020A priority patent/EP0348017B1/en
Priority to EP89202021A priority patent/EP0344873B1/en
Priority to EP83303805A priority patent/EP0098173B1/en
Publication of JPS59124151A publication Critical patent/JPS59124151A/ja
Priority to US07/229,724 priority patent/US4904887A/en
Priority to US07/325,913 priority patent/US4891729A/en
Priority to US07/325,914 priority patent/US4952997A/en
Publication of JPH0355981B2 publication Critical patent/JPH0355981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W70/682—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5449—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP57230288A 1982-06-30 1982-12-29 半導体集積回路装置 Granted JPS59124151A (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP57230288A JPS59124151A (ja) 1982-12-29 1982-12-29 半導体集積回路装置
EP89202021A EP0344873B1 (en) 1982-06-30 1983-06-30 Semiconductor integrated-circuit apparatus
DE89202021T DE3382726D1 (de) 1982-06-30 1983-06-30 Integrierte Halbleiterschaltungsanordnung.
DE89202020T DE3382727D1 (de) 1982-06-30 1983-06-30 Integrierte Halbleiterschaltungsanordnung.
EP89202020A EP0348017B1 (en) 1982-06-30 1983-06-30 Semiconductor integrated-circuit apparatus
DE8383303805T DE3381460D1 (de) 1982-06-30 1983-06-30 Integrierte halbleiterschaltungsanordnung.
EP83303805A EP0098173B1 (en) 1982-06-30 1983-06-30 Semiconductor integrated-circuit apparatus
US07/229,724 US4904887A (en) 1982-06-30 1988-08-04 Semiconductor integrated circuit apparatus
US07/325,913 US4891729A (en) 1982-06-30 1989-03-20 Semiconductor integrated-circuit apparatus
US07/325,914 US4952997A (en) 1982-06-30 1989-03-20 Semiconductor integrated-circuit apparatus with internal and external bonding pads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57230288A JPS59124151A (ja) 1982-12-29 1982-12-29 半導体集積回路装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP6006908A Division JP2520225B2 (ja) 1994-01-26 1994-01-26 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS59124151A JPS59124151A (ja) 1984-07-18
JPH0355981B2 true JPH0355981B2 (enExample) 1991-08-27

Family

ID=16905459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57230288A Granted JPS59124151A (ja) 1982-06-30 1982-12-29 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS59124151A (enExample)

Also Published As

Publication number Publication date
JPS59124151A (ja) 1984-07-18

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