JPH0354858B2 - - Google Patents

Info

Publication number
JPH0354858B2
JPH0354858B2 JP23819685A JP23819685A JPH0354858B2 JP H0354858 B2 JPH0354858 B2 JP H0354858B2 JP 23819685 A JP23819685 A JP 23819685A JP 23819685 A JP23819685 A JP 23819685A JP H0354858 B2 JPH0354858 B2 JP H0354858B2
Authority
JP
Japan
Prior art keywords
push
die
needle
suction nozzle
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP23819685A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6298638A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP23819685A priority Critical patent/JPS6298638A/ja
Publication of JPS6298638A publication Critical patent/JPS6298638A/ja
Publication of JPH0354858B2 publication Critical patent/JPH0354858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
JP23819685A 1985-10-24 1985-10-24 ダイボンデイング装置 Granted JPS6298638A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23819685A JPS6298638A (ja) 1985-10-24 1985-10-24 ダイボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23819685A JPS6298638A (ja) 1985-10-24 1985-10-24 ダイボンデイング装置

Publications (2)

Publication Number Publication Date
JPS6298638A JPS6298638A (ja) 1987-05-08
JPH0354858B2 true JPH0354858B2 (zh) 1991-08-21

Family

ID=17026585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23819685A Granted JPS6298638A (ja) 1985-10-24 1985-10-24 ダイボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6298638A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01157548A (ja) * 1987-12-15 1989-06-20 Shinkawa Ltd ペレット突き上げ装置
JPH0625963Y2 (ja) * 1988-07-29 1994-07-06 松下電器産業株式会社 電子部品実装装置
JPH0376139A (ja) * 1989-08-18 1991-04-02 Nec Corp 半導体素子突上げ方法
JPH04137043U (ja) * 1991-06-12 1992-12-21 山形日本電気株式会社 半導体ダイボンデイング装置のダイ突き上げ機構
JP4156460B2 (ja) * 2003-07-09 2008-09-24 Ｔｄｋ株式会社 ワークのピックアップ方法及びその装置、実装機
US7238258B2 (en) * 2005-04-22 2007-07-03 Stats Chippac Ltd. System for peeling semiconductor chips from tape
WO2009056469A1 (en) * 2007-10-31 2009-05-07 Oerlikon Assembly Equipment Ag, Steinhausen Foil perforating needle for detaching a small die from a foil
JP5287276B2 (ja) * 2009-01-15 2013-09-11 Ｔｄｋ株式会社 電子部品のピックアップ方法及びピックアップ装置

Also Published As

Publication number Publication date
JPS6298638A (ja) 1987-05-08

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