JPH0351844U - - Google Patents

Info

Publication number
JPH0351844U
JPH0351844U JP11228489U JP11228489U JPH0351844U JP H0351844 U JPH0351844 U JP H0351844U JP 11228489 U JP11228489 U JP 11228489U JP 11228489 U JP11228489 U JP 11228489U JP H0351844 U JPH0351844 U JP H0351844U
Authority
JP
Japan
Prior art keywords
glass
melting point
point glass
bonded
sealed package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11228489U
Other languages
English (en)
Other versions
JP2510571Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989112284U priority Critical patent/JP2510571Y2/ja
Publication of JPH0351844U publication Critical patent/JPH0351844U/ja
Application granted granted Critical
Publication of JP2510571Y2 publication Critical patent/JP2510571Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図は本考案のガラス封止型半導体素子収納
用パツケージの一実施例を示す断面図、第２図は
従来のガラス封止型半導体素子収納用パツケージ
の断面図である。 １……絶縁基体、２……蓋体、４，４′……封
止用低融点ガラス、５……外部リード端子、７…
…高融点ガラス。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基体と透光性セラミツクから成る蓋体とを
    、その間に多数の外部リード端子を挟むと共に、
    低融点ガラスにより接合して成るガラス封止型半
    導体素子収納用パツケージにおいて、前記蓋体の
    低融点ガラスが接合する表面に溶融温度が５００
    ℃以上の高融点ガラスを溶着させたことを特徴と
    するガラス封止型半導体素子収納用パツケージ。
JP1989112284U 1989-09-26 1989-09-26 ガラス封止型半導体素子収納用パッケ―ジ Expired - Fee Related JP2510571Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989112284U JP2510571Y2 (ja) 1989-09-26 1989-09-26 ガラス封止型半導体素子収納用パッケ―ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989112284U JP2510571Y2 (ja) 1989-09-26 1989-09-26 ガラス封止型半導体素子収納用パッケ―ジ

Publications (2)

Publication Number Publication Date
JPH0351844U true JPH0351844U (ja) 1991-05-20
JP2510571Y2 JP2510571Y2 (ja) 1996-09-11

Family

ID=31660733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989112284U Expired - Fee Related JP2510571Y2 (ja) 1989-09-26 1989-09-26 ガラス封止型半導体素子収納用パッケ―ジ

Country Status (1)

Country Link
JP (1) JP2510571Y2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5491057A (en) * 1977-12-28 1979-07-19 Nec Corp Semiconductor device
JPS61168247A (ja) * 1985-01-19 1986-07-29 Nec Kansai Ltd セラミツクパツケ−ジ
JPH02174144A (ja) * 1988-12-26 1990-07-05 Sumitomo Electric Ind Ltd 半導体装置用パッケージ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5491057A (en) * 1977-12-28 1979-07-19 Nec Corp Semiconductor device
JPS61168247A (ja) * 1985-01-19 1986-07-29 Nec Kansai Ltd セラミツクパツケ−ジ
JPH02174144A (ja) * 1988-12-26 1990-07-05 Sumitomo Electric Ind Ltd 半導体装置用パッケージ

Also Published As

Publication number Publication date
JP2510571Y2 (ja) 1996-09-11

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees