JPH035075B2 - - Google Patents
Info
- Publication number
- JPH035075B2 JPH035075B2 JP57233705A JP23370582A JPH035075B2 JP H035075 B2 JPH035075 B2 JP H035075B2 JP 57233705 A JP57233705 A JP 57233705A JP 23370582 A JP23370582 A JP 23370582A JP H035075 B2 JPH035075 B2 JP H035075B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- ceramic circuit
- green sheet
- glass
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 239000011230 binding agent Substances 0.000 claims description 16
- 239000002241 glass-ceramic Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 13
- 238000010304 firing Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 10
- 239000004925 Acrylic resin Substances 0.000 claims description 7
- 229920000178 Acrylic resin Polymers 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 4
- 239000012298 atmosphere Substances 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- 229910052799 carbon Inorganic materials 0.000 description 9
- 239000000203 mixture Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000005388 borosilicate glass Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920005822 acrylic binder Polymers 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23370582A JPS59124149A (ja) | 1982-12-29 | 1982-12-29 | セラミツク回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23370582A JPS59124149A (ja) | 1982-12-29 | 1982-12-29 | セラミツク回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59124149A JPS59124149A (ja) | 1984-07-18 |
| JPH035075B2 true JPH035075B2 (fr) | 1991-01-24 |
Family
ID=16959251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23370582A Granted JPS59124149A (ja) | 1982-12-29 | 1982-12-29 | セラミツク回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59124149A (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60153193A (ja) * | 1984-01-23 | 1985-08-12 | 富士通株式会社 | セラミツク回路基板用導電ペ−スト |
| JPH0611018B2 (ja) * | 1988-01-07 | 1994-02-09 | 株式会社村田製作所 | セラミック生シートの積層方法 |
| JPH065656B2 (ja) * | 1988-02-19 | 1994-01-19 | 株式会社村田製作所 | セラミック積層体の製造方法 |
| US5682018A (en) * | 1991-10-18 | 1997-10-28 | International Business Machines Corporation | Interface regions between metal and ceramic in a metal/ceramic substrate |
| JPH05221760A (ja) * | 1992-02-04 | 1993-08-31 | Shinko Electric Ind Co Ltd | 回路形成用金属ペースト及びセラミック回路基板の製造方法 |
| CN103314452B (zh) * | 2011-02-04 | 2016-07-06 | 三菱电机株式会社 | 图案形成方法以及太阳能电池的制造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5396692A (en) * | 1977-02-03 | 1978-08-24 | Dainippon Printing Co Ltd | Method of making electrode plate |
| JPS55107295A (en) * | 1979-02-09 | 1980-08-16 | Hitachi Ltd | Method of fabricating ceramic circuit board |
-
1982
- 1982-12-29 JP JP23370582A patent/JPS59124149A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5396692A (en) * | 1977-02-03 | 1978-08-24 | Dainippon Printing Co Ltd | Method of making electrode plate |
| JPS55107295A (en) * | 1979-02-09 | 1980-08-16 | Hitachi Ltd | Method of fabricating ceramic circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59124149A (ja) | 1984-07-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1235711A (fr) | Methode de fabrication de cartes de circuits ceramiques multicouches | |
| JPH039636B2 (fr) | ||
| JPH0361359B2 (fr) | ||
| JPS6244879B2 (fr) | ||
| JPS63107095A (ja) | 多層セラミツク回路基板 | |
| JPH035075B2 (fr) | ||
| JP3351043B2 (ja) | 多層セラミック基板の製造方法 | |
| JPH06237081A (ja) | 多層セラミック基板の製造方法 | |
| JP2000034136A (ja) | ガラスセラミック焼結体とその製造方法、およびこの焼結体を用いたガラスセラミック配線基板とその製造方法 | |
| JPS6030196A (ja) | 多層回路基板の製造方法 | |
| JP2803421B2 (ja) | 多層セラミック基板の製造方法 | |
| JPS59217392A (ja) | 多層配線回路板 | |
| JPS59162169A (ja) | セラミック多層配線板 | |
| JPH0588557B2 (fr) | ||
| JPS622597A (ja) | セラミツク配線基板の製造方法 | |
| JPH0686327B2 (ja) | セラミツク基板用組成物 | |
| JPS63307182A (ja) | 多層セラミックス回路基板 | |
| JPH0738259A (ja) | 多層セラミック回路基板の製造方法及び多層セラミック回路基板 | |
| JP4035046B2 (ja) | 配線基板の製法 | |
| JPS62211993A (ja) | 多層セラミツク回路基板の製造方法 | |
| JPH0321108B2 (fr) | ||
| JPH0321109B2 (fr) | ||
| JPS6258680B2 (fr) | ||
| JPH0650792B2 (ja) | 耐酸化金属導体を含むセラミック構造体及びその製造方法 | |
| JPH01321691A (ja) | 厚膜セラミック多層基板の製造方法 |