JPH035075B2 - - Google Patents

Info

Publication number
JPH035075B2
JPH035075B2 JP57233705A JP23370582A JPH035075B2 JP H035075 B2 JPH035075 B2 JP H035075B2 JP 57233705 A JP57233705 A JP 57233705A JP 23370582 A JP23370582 A JP 23370582A JP H035075 B2 JPH035075 B2 JP H035075B2
Authority
JP
Japan
Prior art keywords
circuit board
ceramic circuit
green sheet
glass
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57233705A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59124149A (ja
Inventor
Hirozo Yokoyama
Koichi Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP23370582A priority Critical patent/JPS59124149A/ja
Publication of JPS59124149A publication Critical patent/JPS59124149A/ja
Publication of JPH035075B2 publication Critical patent/JPH035075B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP23370582A 1982-12-29 1982-12-29 セラミツク回路基板の製造方法 Granted JPS59124149A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23370582A JPS59124149A (ja) 1982-12-29 1982-12-29 セラミツク回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23370582A JPS59124149A (ja) 1982-12-29 1982-12-29 セラミツク回路基板の製造方法

Publications (2)

Publication Number Publication Date
JPS59124149A JPS59124149A (ja) 1984-07-18
JPH035075B2 true JPH035075B2 (OSRAM) 1991-01-24

Family

ID=16959251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23370582A Granted JPS59124149A (ja) 1982-12-29 1982-12-29 セラミツク回路基板の製造方法

Country Status (1)

Country Link
JP (1) JPS59124149A (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153193A (ja) * 1984-01-23 1985-08-12 富士通株式会社 セラミツク回路基板用導電ペ−スト
JPH0611018B2 (ja) * 1988-01-07 1994-02-09 株式会社村田製作所 セラミック生シートの積層方法
JPH065656B2 (ja) * 1988-02-19 1994-01-19 株式会社村田製作所 セラミック積層体の製造方法
US5682018A (en) * 1991-10-18 1997-10-28 International Business Machines Corporation Interface regions between metal and ceramic in a metal/ceramic substrate
JPH05221760A (ja) * 1992-02-04 1993-08-31 Shinko Electric Ind Co Ltd 回路形成用金属ペースト及びセラミック回路基板の製造方法
CN103314452B (zh) * 2011-02-04 2016-07-06 三菱电机株式会社 图案形成方法以及太阳能电池的制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5396692A (en) * 1977-02-03 1978-08-24 Dainippon Printing Co Ltd Method of making electrode plate
JPS55107295A (en) * 1979-02-09 1980-08-16 Hitachi Ltd Method of fabricating ceramic circuit board

Also Published As

Publication number Publication date
JPS59124149A (ja) 1984-07-18

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