JPH0350416B2 - - Google Patents
Info
- Publication number
- JPH0350416B2 JPH0350416B2 JP60121683A JP12168385A JPH0350416B2 JP H0350416 B2 JPH0350416 B2 JP H0350416B2 JP 60121683 A JP60121683 A JP 60121683A JP 12168385 A JP12168385 A JP 12168385A JP H0350416 B2 JPH0350416 B2 JP H0350416B2
- Authority
- JP
- Japan
- Prior art keywords
- leg
- legs
- detecting
- electronic component
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 7
- 230000002950 deficient Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 230000005856 abnormality Effects 0.000 claims description 3
- 230000007547 defect Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60121683A JPS61279145A (ja) | 1985-06-05 | 1985-06-05 | 電子部品の脚片の不良検出装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60121683A JPS61279145A (ja) | 1985-06-05 | 1985-06-05 | 電子部品の脚片の不良検出装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61279145A JPS61279145A (ja) | 1986-12-09 |
JPH0350416B2 true JPH0350416B2 (fr) | 1991-08-01 |
Family
ID=14817288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60121683A Granted JPS61279145A (ja) | 1985-06-05 | 1985-06-05 | 電子部品の脚片の不良検出装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61279145A (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03203251A (ja) * | 1989-12-28 | 1991-09-04 | Fuji Mach Mfg Co Ltd | 電子部品のリード線曲がり検出装置 |
JP4848160B2 (ja) * | 2005-09-08 | 2011-12-28 | 株式会社 東京ウエルズ | 外観検査装置 |
-
1985
- 1985-06-05 JP JP60121683A patent/JPS61279145A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61279145A (ja) | 1986-12-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100334862B1 (ko) | 3각측량법에기초한3차원화상화를위한방법및시스템 | |
US6055055A (en) | Cross optical axis inspection system for integrated circuits | |
US10107853B2 (en) | Apparatus and method for inspecting PCB-mounted integrated circuits | |
JP2890578B2 (ja) | Icリード検査装置とicリード検査方法 | |
US5208463A (en) | Method and apparatus for detecting deformations of leads of semiconductor device | |
KR102515369B1 (ko) | 3차원 측정 장치 | |
WO2002023123A1 (fr) | Capteur optique | |
WO2009094489A1 (fr) | Système d'inspection optique à haute vitesse avec imagerie par multiples éclairages | |
US4875779A (en) | Lead inspection system for surface-mounted circuit packages | |
JPH0350416B2 (fr) | ||
JPS61246609A (ja) | 形状検査装置 | |
JPH0756446B2 (ja) | 棒状突起物体の検査方法 | |
US11982522B2 (en) | Three-dimensional measuring device | |
JP2525261B2 (ja) | 実装基板外観検査装置 | |
JP2002267415A (ja) | 半導体測定装置 | |
JPH04147043A (ja) | 半田付状態の外観検査方法 | |
JPS61279143A (ja) | 電子部品の脚片の不良検出装置 | |
JP3645340B2 (ja) | フラットパッケージのピン曲がりの検出装置 | |
JPH0350417B2 (fr) | ||
JPS6135302A (ja) | ピンの曲りを検出する方法 | |
JPH1123239A (ja) | 検査装置 | |
JPS59182301A (ja) | ワ−ク外形寸法測定装置 | |
JPH06258041A (ja) | 半導体パッケージのリード検査方法及びその検査装置 | |
JPS61279144A (ja) | 電子部品の脚片の不良検出装置 | |
JPH05256622A (ja) | 表面実装icリードずれ検査装置 |