JPH0350405B2 - - Google Patents
Info
- Publication number
- JPH0350405B2 JPH0350405B2 JP61005643A JP564386A JPH0350405B2 JP H0350405 B2 JPH0350405 B2 JP H0350405B2 JP 61005643 A JP61005643 A JP 61005643A JP 564386 A JP564386 A JP 564386A JP H0350405 B2 JPH0350405 B2 JP H0350405B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- plating
- circuit
- paste
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61005643A JPS62163302A (ja) | 1986-01-14 | 1986-01-14 | ポリマ基板に抵抗回路を形成する方法 |
US06/940,733 US4724040A (en) | 1986-01-14 | 1986-12-11 | Method for producing electric circuits on a base boad |
NL8700053A NL8700053A (nl) | 1986-01-14 | 1987-01-12 | Werkwijze voor het vormen van elektrische bedrading op een basisplaat. |
FR878700273A FR2593015B1 (fr) | 1986-01-14 | 1987-01-13 | Procede pour la realisation de circuits electriques sur une plaque de base |
KR1019870000191A KR900003158B1 (ko) | 1986-01-14 | 1987-01-13 | 기판상의 전기회로 형성방법 |
GB8700716A GB2186433B (en) | 1986-01-14 | 1987-01-13 | A method for producing electric circuits on a base board |
DE19873700912 DE3700912A1 (de) | 1986-01-14 | 1987-01-14 | Verfahren zum herstellen elektrischer schaltkreise auf grundplatten |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61005643A JPS62163302A (ja) | 1986-01-14 | 1986-01-14 | ポリマ基板に抵抗回路を形成する方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62163302A JPS62163302A (ja) | 1987-07-20 |
JPH0350405B2 true JPH0350405B2 (enrdf_load_stackoverflow) | 1991-08-01 |
Family
ID=11616814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61005643A Granted JPS62163302A (ja) | 1986-01-14 | 1986-01-14 | ポリマ基板に抵抗回路を形成する方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS62163302A (enrdf_load_stackoverflow) |
GB (1) | GB2186433B (enrdf_load_stackoverflow) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5731320A (en) * | 1980-07-31 | 1982-02-19 | Matsushita Electric Works Ltd | Leakage current detector |
-
1986
- 1986-01-14 JP JP61005643A patent/JPS62163302A/ja active Granted
-
1987
- 1987-01-13 GB GB8700716A patent/GB2186433B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2186433B (en) | 1990-02-14 |
GB2186433A (en) | 1987-08-12 |
GB8700716D0 (en) | 1987-02-18 |
JPS62163302A (ja) | 1987-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |