JPH0348231U - - Google Patents

Info

Publication number
JPH0348231U
JPH0348231U JP1989108668U JP10866889U JPH0348231U JP H0348231 U JPH0348231 U JP H0348231U JP 1989108668 U JP1989108668 U JP 1989108668U JP 10866889 U JP10866889 U JP 10866889U JP H0348231 U JPH0348231 U JP H0348231U
Authority
JP
Japan
Prior art keywords
black
bonding
semiconductor components
pedestal
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989108668U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0610684Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989108668U priority Critical patent/JPH0610684Y2/ja
Publication of JPH0348231U publication Critical patent/JPH0348231U/ja
Application granted granted Critical
Publication of JPH0610684Y2 publication Critical patent/JPH0610684Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W70/682—

Landscapes

  • Wire Bonding (AREA)
JP1989108668U 1989-09-19 1989-09-19 ボンディング装置 Expired - Lifetime JPH0610684Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989108668U JPH0610684Y2 (ja) 1989-09-19 1989-09-19 ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989108668U JPH0610684Y2 (ja) 1989-09-19 1989-09-19 ボンディング装置

Publications (2)

Publication Number Publication Date
JPH0348231U true JPH0348231U (enExample) 1991-05-08
JPH0610684Y2 JPH0610684Y2 (ja) 1994-03-16

Family

ID=31657293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989108668U Expired - Lifetime JPH0610684Y2 (ja) 1989-09-19 1989-09-19 ボンディング装置

Country Status (1)

Country Link
JP (1) JPH0610684Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998001902A1 (en) * 1996-07-08 1998-01-15 Kabushiki Kaisha Toshiba Semiconductor component fixing jig, table for placement of semiconductor component and bonding apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754278U (enExample) * 1980-09-18 1982-03-30
JPS5790943A (en) * 1980-11-26 1982-06-05 Mitsubishi Electric Corp Heating base for bonding of semiconductor element
JPS59174576A (ja) * 1983-03-18 1984-10-03 日立化成工業株式会社 ＳｉＣ治具
JPS61143686A (ja) * 1984-12-18 1986-07-01 イビデン株式会社 寸法精度の優れた耐熱性治具用炭化珪素質焼結体
JPH0265245A (ja) * 1988-08-31 1990-03-05 Nec Yamagata Ltd 半導体製造装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754278U (enExample) * 1980-09-18 1982-03-30
JPS5790943A (en) * 1980-11-26 1982-06-05 Mitsubishi Electric Corp Heating base for bonding of semiconductor element
JPS59174576A (ja) * 1983-03-18 1984-10-03 日立化成工業株式会社 ＳｉＣ治具
JPS61143686A (ja) * 1984-12-18 1986-07-01 イビデン株式会社 寸法精度の優れた耐熱性治具用炭化珪素質焼結体
JPH0265245A (ja) * 1988-08-31 1990-03-05 Nec Yamagata Ltd 半導体製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998001902A1 (en) * 1996-07-08 1998-01-15 Kabushiki Kaisha Toshiba Semiconductor component fixing jig, table for placement of semiconductor component and bonding apparatus

Also Published As

Publication number Publication date
JPH0610684Y2 (ja) 1994-03-16

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term