JPS5790943A - Heating base for bonding of semiconductor element - Google Patents

Heating base for bonding of semiconductor element

Info

Publication number
JPS5790943A
JPS5790943A JP16718180A JP16718180A JPS5790943A JP S5790943 A JPS5790943 A JP S5790943A JP 16718180 A JP16718180 A JP 16718180A JP 16718180 A JP16718180 A JP 16718180A JP S5790943 A JPS5790943 A JP S5790943A
Authority
JP
Japan
Prior art keywords
heating base
heating
supporting
work
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16718180A
Other languages
Japanese (ja)
Inventor
Koichi Nakagawa
Katsunori Ochi
Toshinobu Banjo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16718180A priority Critical patent/JPS5790943A/en
Publication of JPS5790943A publication Critical patent/JPS5790943A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To exchange only light supporting boards when the form of a work such as a lead frame to which the semiconductor element is fixed differs by previously settling the heating base proper, into which a heating member is incorporated, to a bonding device and detachably shaping the supporting boards for supporting the work to the heating base proper. CONSTITUTION:The heating base 6 for bonding of the semiconductor element is composed of the heating base proper 10, into which the heating member is incorporated, and the light work supporting board 11 supporting the work such as the lead frame. In this constitution, an inserting hole 9 for inserting the heating member 8 at the side and projections 12 for positioning located on an upper surface are formed previously to the heating base proper 10, and a concave section 7 conformed to the shape of the lead frame and holes 13 for positioning fitted to the projections 12 are molded to the light work supporting board 11 placed on the heating base proper 10. Accordingly, since the heating base 6 is divided into two sections, only the light supporting boards 11 may be exchanged when the form of the lead frame changes, and a large number of heating bases integrally constituted need not be prepared.
JP16718180A 1980-11-26 1980-11-26 Heating base for bonding of semiconductor element Pending JPS5790943A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16718180A JPS5790943A (en) 1980-11-26 1980-11-26 Heating base for bonding of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16718180A JPS5790943A (en) 1980-11-26 1980-11-26 Heating base for bonding of semiconductor element

Publications (1)

Publication Number Publication Date
JPS5790943A true JPS5790943A (en) 1982-06-05

Family

ID=15844920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16718180A Pending JPS5790943A (en) 1980-11-26 1980-11-26 Heating base for bonding of semiconductor element

Country Status (1)

Country Link
JP (1) JPS5790943A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0348231U (en) * 1989-09-19 1991-05-08
JPH062381U (en) * 1992-06-08 1994-01-14 有限会社民芸品さとう price tag
JP2009071202A (en) * 2007-09-18 2009-04-02 Sumitomo Electric Ind Ltd Fixing mechanism of plate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0348231U (en) * 1989-09-19 1991-05-08
JPH0610684Y2 (en) * 1989-09-19 1994-03-16 株式会社カイジョー Bonding device
JPH062381U (en) * 1992-06-08 1994-01-14 有限会社民芸品さとう price tag
JP2009071202A (en) * 2007-09-18 2009-04-02 Sumitomo Electric Ind Ltd Fixing mechanism of plate

Similar Documents

Publication Publication Date Title
DE3769158D1 (en) OPTOELECTRONIC DEVICE FOR SURFACE MOUNTING.
BE890136A (en) NOVEL MYOTONOLYTIC AGENTS BASED ON 4,5,6,7-TETRA-HYDROISOXAZOLO (5,4-C) PYRIDINE-3-OLS
GR78910B (en)
NL193891B (en) Controlled power supply circuit.
DK1681A (en) FIVE-METHOD FOR PREPARING PLATIN (IV) DIAMINE COMPLEXS
DE59909802D1 (en) Base plate for setting up devices for clamping workpieces
GB2027023B (en) Bis (2,2,6,6-tetra-alkyl piperidin-4-yl)-imidazolidine or -hexahydropyrimidine derivates
DE3576763D1 (en) CIRCUIT ARRANGEMENT FOR THE ENERGY SUPPLY IN AN INTEGRATED CIRCUIT.
JPS55151377A (en) Photo semiconductor device
DE69008578D1 (en) Circuit for regulating the base current of a semiconductor power device.
BE870328A (en) INTEGRATED POWER SUPPLY CIRCUIT
JPS5790943A (en) Heating base for bonding of semiconductor element
IT1154392B (en) CONNECTION ELEMENT FOR INTEGRATED MICRO CIRCUIT SUPPORT
FI890345A (en) A pin that is attached to the circuit board by soldering
JPS5742138A (en) Semiconductor device
JPS5768088A (en) Photosemiconductor device
FR2402327A1 (en) Cable junction box used in vehicles - is divided into upper and lower moulded sections screwed together
JPS5745264A (en) Manufacture of electronic part molded with resin
JPS5762548A (en) Semiconductor device
DK348187A (en) PROCEDURE FOR MANUFACTURING GUIDE PLATES WITH A COPPER SURFACE
JPS6486590A (en) Manufacture of insulating substrate with electric path
JPS5567488A (en) Thermal recording head
JPS52148971A (en) Supporting device for dehydrater and so like
DK280888D0 (en) DEVICE FOR REGULATING THE POWER IN A CIRCUIT
JPS6489545A (en) Package for semiconductor device