JPH0415238U - - Google Patents

Info

Publication number
JPH0415238U
JPH0415238U JP1990054556U JP5455690U JPH0415238U JP H0415238 U JPH0415238 U JP H0415238U JP 1990054556 U JP1990054556 U JP 1990054556U JP 5455690 U JP5455690 U JP 5455690U JP H0415238 U JPH0415238 U JP H0415238U
Authority
JP
Japan
Prior art keywords
bonding
capillary
bonded
tip
swinging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990054556U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0810188Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990054556U priority Critical patent/JPH0810188Y2/ja
Publication of JPH0415238U publication Critical patent/JPH0415238U/ja
Application granted granted Critical
Publication of JPH0810188Y2 publication Critical patent/JPH0810188Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped

Landscapes

  • Wire Bonding (AREA)
JP1990054556U 1990-05-28 1990-05-28 ボンディング装置 Expired - Fee Related JPH0810188Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990054556U JPH0810188Y2 (ja) 1990-05-28 1990-05-28 ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990054556U JPH0810188Y2 (ja) 1990-05-28 1990-05-28 ボンディング装置

Publications (2)

Publication Number Publication Date
JPH0415238U true JPH0415238U (enExample) 1992-02-06
JPH0810188Y2 JPH0810188Y2 (ja) 1996-03-27

Family

ID=31576723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990054556U Expired - Fee Related JPH0810188Y2 (ja) 1990-05-28 1990-05-28 ボンディング装置

Country Status (1)

Country Link
JP (1) JPH0810188Y2 (enExample)

Also Published As

Publication number Publication date
JPH0810188Y2 (ja) 1996-03-27

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Legal Events

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