JPH0810188Y2 - ボンディング装置 - Google Patents

ボンディング装置

Info

Publication number
JPH0810188Y2
JPH0810188Y2 JP1990054556U JP5455690U JPH0810188Y2 JP H0810188 Y2 JPH0810188 Y2 JP H0810188Y2 JP 1990054556 U JP1990054556 U JP 1990054556U JP 5455690 U JP5455690 U JP 5455690U JP H0810188 Y2 JPH0810188 Y2 JP H0810188Y2
Authority
JP
Japan
Prior art keywords
bonding
temporary bonding
temporary
ball
wafer substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990054556U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0415238U (enExample
Inventor
岩実 浦元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP1990054556U priority Critical patent/JPH0810188Y2/ja
Publication of JPH0415238U publication Critical patent/JPH0415238U/ja
Application granted granted Critical
Publication of JPH0810188Y2 publication Critical patent/JPH0810188Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/536—

Landscapes

  • Wire Bonding (AREA)
JP1990054556U 1990-05-28 1990-05-28 ボンディング装置 Expired - Fee Related JPH0810188Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990054556U JPH0810188Y2 (ja) 1990-05-28 1990-05-28 ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990054556U JPH0810188Y2 (ja) 1990-05-28 1990-05-28 ボンディング装置

Publications (2)

Publication Number Publication Date
JPH0415238U JPH0415238U (enExample) 1992-02-06
JPH0810188Y2 true JPH0810188Y2 (ja) 1996-03-27

Family

ID=31576723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990054556U Expired - Fee Related JPH0810188Y2 (ja) 1990-05-28 1990-05-28 ボンディング装置

Country Status (1)

Country Link
JP (1) JPH0810188Y2 (enExample)

Also Published As

Publication number Publication date
JPH0415238U (enExample) 1992-02-06

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees