JPH02140844U - - Google Patents
Info
- Publication number
- JPH02140844U JPH02140844U JP1989049092U JP4909289U JPH02140844U JP H02140844 U JPH02140844 U JP H02140844U JP 1989049092 U JP1989049092 U JP 1989049092U JP 4909289 U JP4909289 U JP 4909289U JP H02140844 U JPH02140844 U JP H02140844U
- Authority
- JP
- Japan
- Prior art keywords
- die bonding
- pellet
- back surface
- pellets
- molten solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989049092U JPH02140844U (enExample) | 1989-04-25 | 1989-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989049092U JPH02140844U (enExample) | 1989-04-25 | 1989-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02140844U true JPH02140844U (enExample) | 1990-11-26 |
Family
ID=31566489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989049092U Pending JPH02140844U (enExample) | 1989-04-25 | 1989-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02140844U (enExample) |
-
1989
- 1989-04-25 JP JP1989049092U patent/JPH02140844U/ja active Pending